Patents by Inventor Hiroyuki Ogiwara

Hiroyuki Ogiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200362441
    Abstract: An aluminum alloy wire with a composition that contains at least one metallic element selected from the group consisting of Fe, Cr, Ni, Co, Ti, Sc, Zr, Nb, Hf, and Ta in the total amount of more than 1.4 atomic percent and 5.1 atomic percent or less and a remainder of Al and incidental impurities, wherein the aluminum alloy wire has a tensile strength of 250 MPa or more and an electrical conductivity of 50% IACS or more.
    Type: Application
    Filed: December 21, 2018
    Publication date: November 19, 2020
    Inventors: Toru MAEDA, Tetsuya KUWABARA, Akiko INOUE, Hiroyuki OGIWARA
  • Patent number: 6219806
    Abstract: Disclosed is a method of executing test programs for a semiconductor testing system performing function tests on a semiconductor device through the execution of the test programs by means of an operating system. When a statement of a test program for designating a predetermined set value is executed, the set value is stored in a data area. Then, when a statement on the execution of a function test is executed, the above set value is read to set a corresponding circuit, after which the function tests are carried out.
    Type: Grant
    Filed: May 14, 1998
    Date of Patent: April 17, 2001
    Assignee: Advantest Corporation
    Inventor: Hiroyuki Ogiwara
  • Patent number: D619520
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: July 13, 2010
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Hiroyuki Ogiwara, Kazuki Tanaka