Abstract: An aspect of the invention provides a method for operating a workable homogeneous charge compressed ignition engine in which a compression ignition operation is performed by spark ignition to shorten a load input time and a load cutoff time. In the homogeneous charge compressed ignition engine operating method, a mixture gas is burned by compression ignition in a combustion chamber, and fuel and air are previously mixed to produce the mixture gas. The homogeneous charge compressed ignition engine includes a spark ignition device 53 which performs spark ignition to the mixture gas. A temperature controller 35 substantially keeps an intake air temperature of the mixture gas constant. A spark ignition operation, a spark-assist compression ignition operation in which spark ignition is supplementarily used, and a non-spark compression ignition operation in which the spark ignition is not used are switched according to magnitude of a load.

Abstract: A method is provided for operating a homogeneous charge compressed ignition engine in which a mixture gas is burned by compression ignition in a combustion chamber of a cylinder, fuel and air being previously mixed to produce the mixture gas. The homogeneous charge compressed ignition engine includes an ignition plug, which performs spark ignition to the mixture gas. An advance-angle limit and a delay-angle limit of spark ignition timing are set. The compression ignition of the mixture gas is able to be induced at the spark ignition timing. The spark ignition is supplementarily performed to the mixture gas according to an operating condition between the advance-angle limit and the delay-angle limit.

Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.

Abstract: An aspect of the invention provides a method for operating a workable homogeneous charge compressed ignition engine in which a compression ignition operation is performed by spark ignition to shorten a load input time and a load cutoff time. In the homogeneous charge compressed ignition engine operating method, a mixture gas is burned by compression ignition in a combustion chamber, and fuel and air are previously mixed to produce the mixture gas. The homogeneous charge compressed ignition engine includes a spark ignition device 53 which performs spark ignition to the mixture gas. A temperature controller 35 substantially keeps an intake air temperature of the mixture gas constant. A spark ignition operation, a spark-assist compression ignition operation in which spark ignition is supplementarily used, and a non-spark compression ignition operation in which the spark ignition is not used are switched according to magnitude of a load.

Abstract: Compression ignition is induced by spark ignition to realize stable ignition, thereby expanding an operation range where the compression ignition is operable, even in an operating condition in which the compression ignition is hardly performed. Improvements of cycle efficiency and thermal efficiency and restraint of air-pollution substance emission can be realized by properly adjusting compression ignition timing in a cylinder.

Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.

Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.

Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.