Abstract: A manufacturing method of an electronic device processes a surface of a first wafer, bonds a surface of a second wafer to the processed surface of the first wafer, thins the first wafer by polishing a back surface of the first wafer, the back surface being located on an opposite side of the processed surface, forms a groove along a periphery of the back surface of the thinned first wafer by using a dicing blade, attaches a protective layer to the back surface of the first wafer having the groove, via a bonding layer, and polishes a back surface of the second wafer, the back surface being located on an opposite side of the surface attached to the protective layer.

Abstract: A manufacturing method of an electronic device processes a surface of a first wafer, bonds a surface of a second wafer to the processed surface of the first wafer, thins the first wafer by polishing a back surface of the first wafer, the back surface being located on an opposite side of the processed surface, forms a groove along a periphery of the back surface of the thinned first wafer by using a dicing blade, attaches a protective layer to the back surface of the first wafer having the groove, via a bonding layer, and polishes a back surface of the second wafer, the back surface being located on an opposite side of the surface attached to the protective layer.

Abstract: A radiator including a core part having a plurality of tubes and fins, a tank fluidically connected with the tank, an oil cooler contained in the tank, the oil cooler being provided with a pair of connecting pipes which fluidically communicate an interior of the oil cooler and penetrate a wall portion of the tank. The wall portion is formed with a projecting reinforcement portion which projects therefrom and is formed at least between the connecting pipes.

Abstract: A plurality of tubes and corrugated fins are piled up and arranged alternatively, for integrally assembled heat exchangers. The corrugated fin has fin portions for the heat exchangers and a connecting portion connecting the fin portions. The connecting portion is formed with slits arranged in first and second lines extending in a longitudinal direction of the fin and at least one louver between the slits in the lines. The slits in the first line and the slits in the second line traverse a top portion and a bottom portion adjacent to the top portion of the fin and the louver is formed on an intermediate portion between the top portion and the bottom portion so that the louver is located between the space of the slits in the first line and the space of the slits in the second line.

Abstract: A radiator including a core part having a plurality of tubes and fins, a tank fluidically connected with the tank, an oil cooler contained in the tank, the oil cooler being provided with a pair of connecting pipes which fluidically communicate an interior of the oil cooler and penetrate a wall portion of the tank. The wall portion is formed with a projecting reinforcement portion which projects therefrom and is formed at least between the connecting pipes.

Abstract: An oil cooler includes a heat exchanger having a plurality of element units stacked in a state communicating with each other, pipe connectors coupled to the heat exchanger in a state communicating with spaces formed respectively at both end portions in the longitudinal direction of the heat exchanger, and a pair of connecting pipes communicating with the spaces from connecting pipe attaching holes formed on the tank via cylindrical portions of the pipe connectors. The cylindrical portions are fixed respectively to rings provided on the outside of the tank at the connecting pipe attaching holes, and joint portions thereof are formed to be exposed to the outside of the tank.

Abstract: A surface mount type semiconductor device comprises a support substrate having mutually opposed first and second surfaces, and having a slit at a central part thereof, a semiconductor element including electrode pads at least a central part thereof, the semiconductor element being mounted on the first surface such that the electrode pads are located within the slit, a width of the semiconductor element is less than a longitudinal length of the slit and both ends of the slit are located outside end portions of the semiconductor element, metal fine wires for electrically connecting the electrode pads to the connection terminals on the second surface, a first seal resin member provided to seal the semiconductor element on the first surface, and a second seal resin member provided to seal the slit on the second surface.

Abstract: A plurality of tubes and corrugated fins are piled up and arranged alternatively, for integrally assembled heat exchangers. The corrugated fin has fin portions for the heat exchangers and a connecting portion connecting the fin portions. The connecting portion is formed with slits arranged in first and second lines extending in a longitudinal direction of the fin and at least one louver between the slits in the lines. The slits in the first line and the slits in the second line traverse a top portion and a bottom portion adjacent to the top portion of the fin and the louver is formed on an intermediate portion between the top portion and the bottom portion so that the louver is located between the space of the slits in the first line and the space of the slits in the second line.

Abstract: An oil cooler is held by holding plates. Top portions of side pieces of each holding plate are disposed through a side wall of a tank and are bent at the outer surface of the tank, so that circular interposed members and the oil cooler are retained by being sandwiched between middle supporter pieces of the holding plates and the side wall of the tank in the stacking direction of element units such that the oil cooler is movable in the longitudinal direction with respect to the side wall of the tank. By inserting connecting pipes of the oil cooler through openings of the tank so as to temporarily assemble the connecting pipes into openings of a tube plate, blocking flanges of the connecting pipes are retained while being in contact with the outer surface of the side wall of the tank.

Abstract: An oil cooler is held by holding plates. Top portions of side pieces of each holding plate are disposed through a side wall of a tank and are bent at the outer surface of the tank, so that circular interposed members and the oil cooler are retained by being sandwiched between middle supporter pieces of the holding plates and the side wall of the tank in the stacking direction of element units such that the oil cooler is movable in the longitudinal direction with respect to the side wall of the tank. By inserting connecting pipes of the oil cooler through openings of the tank so as to temporarily assemble the connecting pipes into openings of a tube plate, blocking flanges of the connecting pipes are retained while being in contact with the outer surface of the side wall of the tank.

Abstract: In a tank structure of a heat exchanger, at least one of a first tank member and a second tank member which have substantially U-shaped cross sections has, in coupling portions thereof, bent portions made of bent plate materials. The first tank member and the second tank member have first to fourth slits that are formed at least in the bent portions near end faces. End face closing members have main portions capable of closing end-face openings formed by the first and second tank members, and the main portions have on outer peripheries thereof integrally formed first lock portions and second lock portions inserted in and locked by the slits to cover gaps formed between the first and second tank members.

Abstract: An information processing system comprises: plural processors; a shared memory connected to the plurality of processors for enabling communication between the processors; a unit disposed in the shared memory for storing information for specifying a processor connected thereto; and a unit for checking, when a first processor communicates with a second processor, whether or not the first and second processors are connected to the shared memory for direct access thereto by referring to the information storing means.

Abstract: A dispenser unit is provided on one side of a conveying rail and a wafer is provided on the other side of the conveying rail. A tube is attached at one end to the dispensing unit and at the other end to a syringe. First and second shafts are attached at their base ends to the dispensing unit. A satellite roller and movable roller are mounted on the forward ends of the first and second shafts. The satellite roller and movable roller are mounted such that they are rotatable. A movable mechanism is mounted on the dispensing unit to move a semiconductor element from a wafer onto a lead frame. The movable roller is moved to coat a bonding agent on a rear surface of the semiconductor element.

Abstract: A storage control apparatus contains plural request stacks for storing the access request; a stack selecting circuit for selecting a request stack by accepting the access requests one after another and for storing the access request; and a priority determining circuit for selecting the access request stored in said request stack in order of priority and makes access to a main storage unit in response to an access request from an input-output processor, instruction processor and the like. When memory access requests are issued continuously from the unit as a source of issuing the same access request to the storage control apparatus, the access request which follows can make access to a cache memory while the previous request is making access to the main storage unit, thereby preventing a reduction in a total throughput.

Abstract: A data processing system which encludes an instruction processor, a storage controller, a main storage, and an extended storage. The storage controller contains a data transfer unit for transferring data between the main storage and the extended storage by an instruction from the instruction process specifying an amount of the data to be transferred. The data transfer unit is provided in the storage controller and with a data buffer and an address addition-subtraction circuit for operating a source address and a destination address. The data is transferred between the main storage and the extended storage by sending to a firmware of a storage control a main storage real address translated from a main storage virtual address specified by the instruction, the number of data to be transferred from the main storage, an extended storage real address, and the number of bytes to be transferred from the extended storage, in a manner so as to match with a unit of data to be processed on the extended storage.