Patents by Inventor Hiroyuki OMICHI

Hiroyuki OMICHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOLDED ARTICLE AND METHOD FOR PRODUCTION THEREOF
    Publication number: 20190031838
    Abstract: Disclosed is a molded article obtained by molding a thermoplastic resin composition, wherein the thermoplastic resin composition contains a thermoplastic resin (A) and an inorganic filler (B); the content of the inorganic filler (B) is 60 to 150 parts by mass based on 100 parts by mass of the thermoplastic resin (A); the content of a plate-shaped inorganic filler (b1) having an average thickness of 4.0 ?m or less and an aspect ratio of 130 or more in the inorganic filler (B) is 35 to 100% by mass; and a thickness of the thinnest part thereof is 2.0 mm or less.
    Type: Application
    Filed: January 25, 2017
    Publication date: January 31, 2019
    Applicant: KURARAY CO., LTD.
    Inventors: Hideaki SUZUKI, Kozo TAMURA, Hiroyuki OMICHI