Patents by Inventor Hiroyuki Osakabe
Hiroyuki Osakabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20030079863Abstract: A first intermediate plate 5C adjacent to a heat receiving plate 5A and a second intermediate plate 5D adjacent to the first intermediate plate 5C are provided so that the slit width of the openings (first opening 5a) in the first intermediate plate 5C is wider than that (second opening 5b) in the second intermediate plate 5D. In this way, when the first intermediate plate 5C and the second intermediate 5D are stacked, a tunnel structure is formed in which the opening dimension L3 (the opening dimension of the second openings 5b) of the communicating sections through which the first openings 5a and the second openings 5b communicate with each other is smaller than the length L2 (the opening dimension of the first openings 5a) of the tunnel portions (L2>L3). Therefore, a heat-generating member with large density of heat generation can be effectively cooled.Type: ApplicationFiled: December 22, 2002Publication date: May 1, 2003Inventors: Hajime Sugito, Hiroyuki Osakabe, Shinichi Morihira, Yuhei Kunikata
-
Patent number: 6527045Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.Type: GrantFiled: March 14, 1997Date of Patent: March 4, 2003Assignee: Denso CorporationInventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki
-
Publication number: 20030037908Abstract: A cooling apparatus 1 boiling and condensing refrigerant is constructed to have a stacked construction by stacking a plurality of pressed members 3 and comprises a refrigerant tank portion, a heat exchanging portion and a refrigerant diffusing portion.Type: ApplicationFiled: August 6, 2002Publication date: February 27, 2003Inventors: Hajime Sugito, Hiroyuki Osakabe, Shinichi Morihira, Takaki Okochi, Yuhei Kunikata
-
Publication number: 20030019612Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.Type: ApplicationFiled: September 9, 2002Publication date: January 30, 2003Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki
-
Patent number: 6397934Abstract: A cooling device includes a boiling unit and a condensing unit. A diffusion plate having a plurality of holes is formed into a thin-long shape, and is disposed in an upper tank of the condensing unit at an approximate center in an up-down direction so that an inner space of the upper tank of the condensing unit is divided into upper and lower parts in the up-down direction. Each hole opened in the diffusion plate has an opening area smaller than a sectional surface area of an introduction port of a gas-refrigerant introduction pipe, opened in the upper tank of the condensing unit. Thus, gas refrigerant flowing into the upper tank of the condensing unit through the gas-refrigerant introduction pipe is diffused to all the upper part of the upper tank along the surface of the diffusion plate while passing through the holes of the diffusion plate downwardly.Type: GrantFiled: November 29, 2000Date of Patent: June 4, 2002Assignee: Denso CorporationInventors: Hiroyuki Osakabe, Yoshiyuki Okamoto, Kiyoshi Kawaguchi
-
Patent number: 6357517Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating the heat of the boiled and vaporized refrigerant. The radiator has an inflow return chamber provided with a small-diameter opening having a diameter smaller than that of the inflow return chamber. The liquid refrigerant of the gas-liquid mixed refrigerant is dammed by the small-diameter opening of the inflow return chamber and the dammed liquid refrigerant is returned through a return passage to the refrigerant tank. Since the liquid refrigerant contained in the gas-liquid mixed refrigerant is suppressed from flowing by means of the small-diameter opening, the gaseous refrigerant can transfer heat directly to the walls of the radiating passages, so that the deterioration of the radiating performance can be prevented.Type: GrantFiled: October 25, 1999Date of Patent: March 19, 2002Assignee: Denso CorporationInventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki, Shigeru Kadota
-
Patent number: 6341643Abstract: A cross-flow fan is provided in which air movement is increased without increasing the power of the motor. Opening portions for ventilation are bored wall surfaces forming a stabilizer in the casing of a cooling fan. These bores are at positions separated from the tongue portion by predetermined distances. When a bladed wheel is rotated by a motor, air is sucked from the front side of a core portion through the core portion and into the inside of the casing. The cooling fan generates, in the inside of the casing, a simple flow passing through the bladed wheel to a discharge port. This flow has a circulation flow (swirl) circulating within the bladed wheel.Type: GrantFiled: May 2, 2000Date of Patent: January 29, 2002Assignee: Denso CorporationInventor: Hiroyuki Osakabe
-
Publication number: 20010023758Abstract: A boiling cooler has a heat exchange part in which refrigerant vapor performs heat exchange with cooling water. The refrigerant vapor is produced from liquid refrigerant that is boiled and gasified by heat transferred from a heating element. In this boiling cooler, the refrigerant vapor can be cooled by cooling water having a thermal conductivity larger than that of air.Type: ApplicationFiled: March 21, 2001Publication date: September 27, 2001Inventor: Hiroyuki Osakabe
-
Patent number: 6279649Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices. The refrigerant tank includes a refrigerant chamber, a condensed liquid passage, heat insulating passage, and a communication passage. The heat insulating passage is formed between the condensed liquid passage and the refrigerant chamber. A vapor reverse flow reducing plate having a small hole is provided at the bottom of a lower opening of the heat insulating passage to reduce vaporized refrigerant (bubble) flowing into the refrigerant chamber from the heat insulated passage. Accordingly, the movement of the bubbles from the heat insulating passage to the refrigerant chamber via the communication passage is suppressed, and the heat radiation performance is improved.Type: GrantFiled: April 23, 1999Date of Patent: August 28, 2001Assignee: Denso CorporationInventor: Hiroyuki Osakabe
-
Publication number: 20010009188Abstract: This cooling apparatus can improve a radiation performance by increasing the boiling area and make it difficult to cause the burnout on boiling faces by filling the boiling faces with a refrigerant necessary for the boiling. In refrigerant chambers for reserving a refrigerant, there are inserted corrugated fins for increasing the boiling area. These corrugated fins are composed of lower corrugated fins arranged to correspond to the lower sides of the boiling faces for receiving the heat of a heating body, and upper corrugated fins arranged to correspond to the upper sides of the boiling faces, and these lower and upper corrugated fins and are individually held in thermal contact with the boiling faces of the refrigerant chambers. The lower corrugated fins and the upper corrugated fins are given a common fin pitch P and are individually inserted vertically in the individual refrigerant chambers to define the individual passages further into a plurality of small passage portions.Type: ApplicationFiled: February 8, 2001Publication date: July 26, 2001Inventors: Hiroyuki Osakabe, Kunihiro Kamiya, Takahide Ohara
-
Patent number: 6257324Abstract: This cooling apparatus can improve a radiation performance by increasing the boiling area and make it difficult to cause the burnout on boiling faces by filling the boiling faces with a refrigerant necessary for the boiling. In refrigerant chambers for reserving a refrigerant, there are inserted corrugated fins for increasing the boiling area. These corrugated fins are composed of lower corrugated fins arranged to correspond to the lower sides of the boiling faces for receiving the heat of a heating body, and upper corrugated fins arranged to correspond to the upper sides of the boiling faces, and these lower and upper corrugated fins and are individually held in thermal contact with the boiling faces of the refrigerant chambers. The lower corrugated fins and the upper corrugated fins are given a common fin pitch P and are individually inserted vertically in the individual refrigerant chambers to define the individual passages further into a plurality of small passage portions.Type: GrantFiled: June 14, 1999Date of Patent: July 10, 2001Assignee: Denso CorporationInventors: Hiroyuki Osakabe, Kunihiro Kamiya, Takahide Ohara
-
Publication number: 20010000201Abstract: A cooling device includes a boiling unit and a condensing unit. A diffusion plate having a plurality of holes is formed into a thin-long shape, and is disposed in an upper tank of the condensing unit at an approximate center in an up-down direction so that an inner space of the upper tank of the condensing unit is divided into upper and lower parts in the up-down direction. Each hole opened in the diffusion plate has an opening area smaller than a sectional surface area of an introduction port of a gas-refrigerant introduction pipe, opened in the upper tank of the condensing unit. Thus, gas refrigerant flowing into the upper tank of the condensing unit through the gas-refrigerant introduction pipe is diffused to all the upper part of the upper tank along the surface of the diffusion plate while passing through the holes of the diffusion plate downwardly.Type: ApplicationFiled: November 29, 2000Publication date: April 12, 2001Applicant: DENSO CorporationInventors: Hiroyuki Osakabe, Yoshiyuki Okamoto, Kiyoshi Kawaguchi
-
Patent number: 6102109Abstract: A cooling device includes a refrigerant tank in which liquid refrigerant is boiled, and a radiator in which gas refrigerant is condensed. A connection pipe is formed in the radiator so that refrigerant communicates between the refrigerant tank and the radiator. An interior of the connection pipe is partitioned into a first communication passage and a second communication passage, and a restriction plate is provided between the first communication passage and a refrigerant-condensing passage of the radiator to prevent liquid refrigerant from flowing into the refrigerant-condensing passage. Thus, when heat-generating amount of a heat-generating member becomes larger so that liquid refrigerant is vehemently boiled in the refrigerant tank and a part of liquid refrigerant is blown upwardly together with refrigerant vapor, the restriction plate prevents the liquid refrigerant from flowing into the refrigerant-condensing passage of the radiator while gas refrigerant readily passes through the restriction plate.Type: GrantFiled: December 10, 1998Date of Patent: August 15, 2000Assignee: Denso CorporationInventors: Hiroyuki Osakabe, Takahide Ohara
-
Patent number: 6076596Abstract: A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices, and a radiator for radiating heat of the boiled and vaporized refrigerant in a radiating passage thereof. In the radiating passage, a inner fin and a projection to position and fix the inner fin are provided, and a predetermined gap is provided between the projection and a bottom surface of the radiating passage. Thus the refrigerant condensed and liquefied in the radiating passage can reach an outflow communicating portion while flowing through the fluid passage formed as the gap.Type: GrantFiled: April 10, 1998Date of Patent: June 20, 2000Assignee: Denso CorporationInventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki
-
Patent number: 6073683Abstract: A cooling apparatus using boiling and condensing refrigerant for cooling a heat generating unit, includes a refrigerant tank having a wall surface, for containing the refrigerant therein, a heat generating unit boiling the refrigerant in the refrigerant tank by heating, and a radiator disposed in communication with the refrigerant tank for condensing and liquefying the boiling refrigerant in the tank. An interior of the refrigerant tank is partitioned into a vapor passage for leading the boiling refrigerant to the radiator, a condensed liquid passage in which the condensed and liquefied refrigerant flows downwardly, and a communication path formed at a lower side thereof for communicating between the vapor passage and the condensed liquid passage. The condensed liquid passage is defined by a part of the wall surface.Type: GrantFiled: July 3, 1996Date of Patent: June 13, 2000Assignee: Nippondenso Co., Ltd.Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Takahide Ohara, Shigeru Kadota, Masahiko Suzuki
-
Patent number: 5871043Abstract: An IGBT module has an IGBT element. Within a refrigerant tank is sealed refrigerant. On the bottom part of the refrigerant tank is provided the IGBT module. The heat emitted from the IGBT element is absorbed by the refrigerant by the transmission of the boiling heat emitted from the IGBT element and the refrigerant is gasified by the absorbed heat. A radiation tube is communicated with the refrigerant tank at one end and blocked at the other end. Within the radiation tube is disposed corrugated inner fins, and an upper space, refrigerant passages through for guiding the refrigerant from the refrigerant tank into the upper space, and thin holes in which a liquid pooling part for returning the refrigerant from the upper space into the refrigerant tank is formed are dividingly formed respectively.Type: GrantFiled: February 27, 1997Date of Patent: February 16, 1999Assignee: Nippondenso Co., Ltd.Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki, Kazuma Matsui
-
Patent number: 5836381Abstract: A radiation part, a refrigerant tank having heating elements mounted thereon, and an inverter case are bonded together by welding or brazing. A cooling fan is provided at the back surface of the radiation part. IGBT modules are fastened to a side surface of the refrigerant tank and further fastened together to the inverter case together. A press worked thin plate materials are bonded together to the refrigerant tank by brazing. The IGBT modules, which are heating elements, are mounted to the inverter case by bolts through the component materials of the refrigerant tank. According to this invention, as these components can be fixed in a very simple construction without using any seat cock, the manufacturing cost thereof can be reduced.Type: GrantFiled: September 11, 1997Date of Patent: November 17, 1998Assignee: Nippondenso Co., Ltd.Inventors: Hiroyuki Osakabe, Takashi Furukawa, Kiyoshi Kawaguchi, Masahiko Suzuki, Manji Suzuki
-
Patent number: 5832989Abstract: An object of the present invention is to provide a cooling apparatus using a boiling and condensing refrigerant which can be economically manufactured. Another object is to improve reliability of soldering. A refrigerant tank, on which hot objects to be cooled is mounted, is connected to a radiator for condensing the vaporized refrigerant through a coupler made of two plates bonded together by soldering. The coupler connecting the tank and the radiator can be made easily and economically even if it has a complex shape, because the coupler is composed of two stamped plates. To bond two plates together by soldering process, it is necessary to secure an air-tightness and a high reliability. Improved configurations of the coupler and ways of fastening the two plates effectively are provided in the present invention.Type: GrantFiled: March 5, 1997Date of Patent: November 10, 1998Assignee: Denso CorporationInventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki
-
Patent number: 5713413Abstract: According to the present invention, a cooling apparatus includes a refrigerant tank composed of at least a couple of thin plate materials facing each other and bonded together at bonding parts thereof, a heating body mounted on an outer surface of the thin plates, refrigerant sealed in the refrigerant tank for absorbing heat generated by the heating body, the refrigerant vaporizing in the refrigerant tank, a heat radiator mounted on the refrigerant tank in fluid communication therewith for condensing and liquefying boiling vapor ascending from the refrigerant tank, and a refrigerant flow control plate composed of a plate material and disposed in an upper part of the refrigerant tank in contact with the thin plate materials facing each other. The refrigerant flow control plate partitions an inside of the refrigerant tank into a vapor outlet and a liquid inlet.Type: GrantFiled: December 27, 1995Date of Patent: February 3, 1998Assignee: Nippondenso Co., Ltd.Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki, Hajime Sugito, Kazuo Kobayashi, Shigeru Kadota
-
Patent number: 5613552Abstract: A power pack is mounted on the side wall of a refrigerant tank in which the internal pressure is reduced and a refrigerant is held in such a way that a heat transfer panel on which a power element is mounted can contact the refrigerant. The refrigerant boiled and gasified by heat from the contact part of the heat transfer panel 19 is guided into a radiation part planted on the top of the refrigerant tank 11. The radiation part is composed of a plurality of hollow tubular bodies having flat cross sections. The plurality of radiation tubes are laid out in parallel with each other at specified intervals, the upper ends thereof being closed and the lower ends thereof being open to the inside of the refrigerant tank so that the gasified refrigerant is guided thereinto. Here, the natural convection of the air is generated in the up/downward directions by the plurality of the radiation tubes, and the effective heat radiation is achieved thereby.Type: GrantFiled: July 12, 1995Date of Patent: March 25, 1997Assignee: Nippondenso Co., Ltd.Inventors: Hiroyuki Osakabe, Kiyoshi Kawaguchi, Masahiko Suzuki