Patents by Inventor Hiroyuki Otaguro

Hiroyuki Otaguro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6866549
    Abstract: The present invention relates to an electrical connector assembly capable of achieving a high-precision fit starting with fairly rough positioning, the assembly consisting of a first connector which is equipped with multiple substrates secured in an array and a second connector which is equipped with female terminals and mates with the first connector. The electrical connector has a rough guide mechanism (first guides and second guides as well as first complementary guides and second complementary guides) which guides a mating between the first connector and the second connector relatively roughly at an initial stage of mating, and a precision guide mechanism (chamfers on substrates and corresponding tapers on a housing of the second connector) which guides the mating between the first connector and the second connector relatively precisely at an advanced stage of mating.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: March 15, 2005
    Assignees: Tyco Electronics AMP K.K., Fujitsu Limited
    Inventors: Takeshi Kimura, Kazuya Orui, Kunihiko Shimizu, Hiroyuki Otaguro, Rie Takada
  • Publication number: 20040185715
    Abstract: The present invention is an electrical connector, having multiple terminals equipped with compliant sections to be inserted into through-holes in a main board; multiple sub-boards equipped with lands connected to the terminals and a contact section to be connected to a mating connector. The lands consist of a conductor formed on an insulator and a housing used to secure the multiple sub-boards in an array, wherein owing to a conductor which extends close to the terminal-side edge of the insulator, the lands prevent the sub-boards from being buckled by being bitten by the terminals when the compliant sections are inserted into the through-holes in the main board.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 23, 2004
    Inventors: Takeshi Kimura, Kazuya Orui, Kunihiko Shimizu, Hiroyuki Otaguro, Rie Takada
  • Publication number: 20040185716
    Abstract: The present invention relates to an electrical connector assembly capable of achieving a high-precision fit starting with fairly rough positioning, the assembly consisting of a first connector which is equipped with multiple substrates secured in an array and a second connector which is equipped with female terminals and mates with the first connector. The electrical connector has a rough guide mechanism (first guides and second guides as well as first complementary guides and second complementary guides) which guides a mating between the first connector and the second connector relatively roughly at an initial stage of mating, and a precision guide mechanism (chamfers on substrates and corresponding tapers on a housing of the second connector) which guides the mating between the first connector and the second connector relatively precisely at an advanced stage of mating.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 23, 2004
    Inventors: Takeshi Kimura, Kazuya Orui, Kunihiko Shimizu, Hiroyuki Otaguro, Rie Takada
  • Patent number: 6388879
    Abstract: A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: May 14, 2002
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Otaguro, Takayuki Ashida, Hitoshi Yokemura, Hidenao Nakajima, Yoshimi Watanabe, Shuuhei Fujita
  • Patent number: 6216342
    Abstract: A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: April 17, 2001
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe
  • Patent number: 6127634
    Abstract: A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a portion which is in contact with the board and only the side surface of the electrically conductive portion and which prevents the board from being etched when the electrically conductive layer is etched.
    Type: Grant
    Filed: June 13, 1995
    Date of Patent: October 3, 2000
    Assignee: Fujitsu Limited
    Inventors: Yutaka Higashiguchi, Masao Hosogai, Hiroyuki Otaguro, Hitoshi Yokemura, Masaharu Hida
  • Patent number: 6116912
    Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.
    Type: Grant
    Filed: September 15, 1998
    Date of Patent: September 12, 2000
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe
  • Patent number: 5886309
    Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: March 23, 1999
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe