Patents by Inventor Hiroyuki Ryoson
Hiroyuki Ryoson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150222018Abstract: An invented antenna device includes a spiral coil having terminal wires extending from an inner periphery side thereof and from an outer periphery side thereof, a magnetic layer supporting the spiral coil and being formed with a cutoff portion extending from an inner periphery side thereof to an outer periphery side thereof, and a circuit board having a pair of terminal portions for connecting to the terminal wire and a connecting terminal for connecting an external circuit. The circuit board is placed in the cutoff portion, and the terminal wire extending from the inner periphery side of the spiral coil is coupled to the terminal portion located on an inner periphery side of the circuit board whereas the terminal wire extending from the outer periphery side of the spiral coil is coupled to the terminal portion located on an outer periphery side of the circuit board.Type: ApplicationFiled: February 3, 2015Publication date: August 6, 2015Inventors: Tatsuo KUMURA, Yusuke KUBO, Hiroyuki RYOSON
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Publication number: 20150222017Abstract: An antenna device according to the invention includes a spiral coil, a magnetic layer supporting the spiral coil and including a recess or a through hole for containing an extension from an inner periphery of the spiral coil, and a circuit board having a plurality of conducting patterns and being formed with a first terminal connecting the spiral coil to the conducting patterns and with a second terminal connecting the conducting patterns to an external circuit. The magnetic layer has at least a part of the circuit board inside. This invented antenna device is formed in a thinner size.Type: ApplicationFiled: January 26, 2015Publication date: August 6, 2015Inventors: Tatsuo KUMURA, Yusuke KUBO, Hiroyuki RYOSON
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Patent number: 8400770Abstract: According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.Type: GrantFiled: September 2, 2009Date of Patent: March 19, 2013Assignee: Sony CorporationInventors: Mitsuo Hashimoto, Kazuaki Yazawa, Yuichi Ishida, Hiroyuki Ryoson
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Patent number: 8391007Abstract: According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being arranged apart from and higher than the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion by a gravitational force.Type: GrantFiled: August 6, 2009Date of Patent: March 5, 2013Assignee: Sony CorporationInventors: Mitsuo Hashimoto, Kazuaki Yazawa, Yuichi Ishida, Hiroyuki Ryoson
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Patent number: 8325477Abstract: Provided is a vibrating device which can generate efficient vibrations in a vibrating member and efficiently apply vibrations to a gas, a jet flow generating device in which the vibrating device has been implemented, and an electronic device in which the jet flow generating device has been implemented. A jet flow generating device 10 has a vibrating device 15 including a frame 4, and actuator 5 mounted on the frame 4, and a vibrating member 3 supported on the frame 4 by an elastic supporting member 6. The vibrating member 3 has a side plate 3b formed on the perimeter portion of a disc-shaped vibrating plate 3a, for example. Vibration of the vibrating member 3 applies vibrations to air within chambers 11a and 11b, whereby gas can alternatingly be blown from nozzles 2a and 2b.Type: GrantFiled: February 27, 2006Date of Patent: December 4, 2012Assignee: Sony CorporationInventors: Hiroichi Ishikawa, Norikazu Nakayama, Takuya Makino, Tomoharu Mukasa, Hiroyuki Ryoson
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Patent number: 8256501Abstract: A plate-type heat transport device and electronic instrument are provided. The plate-type heat transport device includes a heat absorbing plane absorbing heat because of the evaporation of a working fluid, a heat emission plane opposing the heat absorbing plane and emitting heat because of the condensation of the working fluid, and a flow path two-dimensionally arranged between the heat absorbing plane and the heat emission plane to align with the heat absorbing plane and the heat emission plane, the flow path allowing the working fluid to flow therethrough for changing the phase of the working fluid, and the flow path being capable of two-dimensionally diffusing the working fluid by generating a capillary force in the condensed working fluid.Type: GrantFiled: March 13, 2007Date of Patent: September 4, 2012Assignee: Sony CorporationInventors: Hiroyuki Nagai, Hiroyuki Ryoson
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Publication number: 20120140414Abstract: Provided is a vibrating device which can generate efficient vibrations in a vibrating member and efficiently apply vibrations to a gas, a jet flow generating device in which the vibrating device has been implemented, and an electronic device in which the jet flow generating device has been implemented. A jet flow generating device 10 has a vibrating device 15 including a frame 4, and actuator 5 mounted on the frame 4, and a vibrating member 3 supported on the frame 4 by an elastic supporting member 6. The vibrating member 3 has a side plate 3b formed on the perimeter portion of a disc-shaped vibrating plate 3a, for example. Vibration of the vibrating member 3 applies vibrations to air within chambers 11a and 11b, whereby gas can alternatingly be blown from nozzles 2a and 2b.Type: ApplicationFiled: February 8, 2012Publication date: June 7, 2012Applicant: SONY CORPORATIONInventors: Hiroichi Ishikawa, Norikazu Nakayama, Takuya Makino, Tomoharu Mukasa, Hiroyuki Ryoson
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Publication number: 20110253345Abstract: [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible. [Solving Means] A capillary member (5) having a larger thickness than a frame member (2) is mounted on an inner surface (11) of a lower plate member (1). Subsequently, the frame member (2) is mounted on the inner surface (11) of the lower plate member (1), and an upper plate member (3) is mounted on the capillary member (5). Due to a difference between the thickness of the capillary member (5) and the thickness of the frame member (2), a squashing amount (G) is provided between the frame member (2) and the upper plate member (3). Then, the lower plate member (1) and the upper plate member (3) are diffusion-bonded with the frame member (2). At this time, the capillary member (5) is compressed by an amount corresponding to the squashing amount (G).Type: ApplicationFiled: December 11, 2009Publication date: October 20, 2011Applicants: SONY CHEMICAL & INFORMATION DEVICE CORPORATION, SONY CORPORATIONInventors: Hiroyuki Ryoson, Takashi Yajima, Kazunao Oniki, Hiroto Kasai, Koji Hirata, Mitsuo Hashimoto
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Publication number: 20110088877Abstract: A heat transport device includes a working fluid, a capillary member, and a container. The working fluid transports heat by performing a phase change. The capillary member applies a capillary force to the working fluid. The capillary member includes a first mesh member having a mesh of a first size and a second mesh member having a mesh of a second size different from the first size. The second mesh member is folded so that the first mesh member is sandwiched. The container contains the working fluid and the capillary member.Type: ApplicationFiled: October 1, 2010Publication date: April 21, 2011Applicant: SONY CORPORATIONInventors: Kazunao Oniki, Hiroyuki Ryoson, Koji Hirata
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Publication number: 20110005724Abstract: [Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding. [Solving Means] A bonding surface (1a) of an upper member (1) that is subjected to diffusion bonding to a bonding surface (21) of a frame member (2) is formed into a convex shape, which can make a contact area of the bonding surface (1a) and the bonding surface (21) small. Therefore, a pressure (load per unit area) applied to the bonding surfaces (1a and 21) is increased, and thus the diffusion bonding of the bonding surfaces (1a and 21) is performed by a high pressure. Similarly, a bonding surface (3a) of a lower member (3) and a bonding surface (23) of the frame member (2) are also subjected to the diffusion bonding by a high pressure.Type: ApplicationFiled: December 11, 2009Publication date: January 13, 2011Applicants: SONY CORPORATION, SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Hiroto Kasai, Hiroyuki Ryoson, Takashi Yajima, Koji Hirata
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Publication number: 20100326632Abstract: [Object] To provide a phase-change-type heat spreader, a flow-path structure, an electronic apparatus including the phase-change-type heat spreader, a flow-path structure used therein, and the like that are capable of improving a thermal efficiency by a phase change and lowering a thermal resistance. [Solving Means] Capillary boards (401 to 404) in which a plurality of openings (408) penetrating the capillary boards are formed on a wall surface constituting grooves (405) in a longitudinal direction of the grooves (405), are laminated while each being rotated 90 degrees to be deviated within an X-Y plane so that the grooves (405) of those layers extend in mutually-orthogonal directions, and the plurality of openings (408) function as a part of a vapor-phase flow path through which a vapor refrigerant evaporated by heat received by a heat-receiving plate circulates.Type: ApplicationFiled: August 8, 2008Publication date: December 30, 2010Applicant: SONY CORPORATIONInventors: Hiroyuki Nagai, Hiroyuki Ryoson, Takashi Yajima, Mitsuo Hashimoto
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Publication number: 20100307722Abstract: A method of manufacturing a heat transport device including the steps of stacking a first plate, a capillary member, and a second plate by interposing the capillary member between the first plate and the second plate, the first plate and the second plate constituting a container of a heat transport device configured to transport heat using phase change in a working fluid; and diffusion-bonding the first plate and the second plate while deforming the second plate to create an internal space in the container for storing the capillary member.Type: ApplicationFiled: June 2, 2010Publication date: December 9, 2010Applicant: SONY CORPORATIONInventors: Hiroyuki Ryoson, Hiroto Kasai, Koji Hirata
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Publication number: 20100254088Abstract: According to an embodiment of the present invention, there is provided a heat transport device including a working fluid, an evaporation portion, a condenser portion, a flow path portion, and an area. The working fluid includes pure water and an organic compound bearing a hydroxyl group. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The area is made of a carbon material and provided on at least one of the evaporation portion, the condenser portion, and the flow path portion.Type: ApplicationFiled: March 24, 2010Publication date: October 7, 2010Applicant: SONY CORPORATIONInventors: Yuichi Ishida, Mitsuo Hashimoto, Kazuaki Yazawa, Hiroyuki Ryoson, Tatsuhiko Shigemoto
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Publication number: 20100252237Abstract: A heat transport device includes a working fluid, an evaporation portion, a condenser portion, a flow path portion, a concave portion, and a protrusion portion. The evaporation portion causes the working fluid to evaporate from a liquid phase to a vapor phase. The condenser portion communicates with the evaporation portion, and causes the working fluid to condense from the vapor phase to the liquid phase. The flow path portion causes the working fluid condensed in the condenser portion to the liquid phase to flow to the evaporation portion. The concave portion is provided on at least one of the evaporation portion and the flow path portion, in which the liquid-phase working fluid flows. The protrusion portion is made of nanomaterial protruding from an inner wall side surface of the concave portion such that the protrusion portion partially covers an opening surface of the concave portion.Type: ApplicationFiled: March 23, 2010Publication date: October 7, 2010Applicant: SONY CORPORATIONInventors: Mitsuo Hashimoto, Kazuaki Yazawa, Hiroto Kasai, Yuichi Ishida, Hiroyuki Ryoson
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Publication number: 20100122798Abstract: According to an embodiment of the present invention, there is provided a heat transport device including an evaporation portion, a flow path, a condenser portion, and a working fluid. The evaporation portion is made of nanomaterial, and has V-shaped grooves formed on a surface. The flow path communicates with the evaporation portion. The condenser portion communicates with the evaporation portion through the flow path. The working fluid evaporates from a liquid phase to a vapor phase in the evaporation portion and condenses from the vapor phase to the liquid phase in the condenser portion.Type: ApplicationFiled: November 18, 2009Publication date: May 20, 2010Applicant: SONY CORPORATIONInventors: Mitsuo Hashimoto, Kazuaki Yazawa, Yuichi Ishida, Hiroyuki Ryoson
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Publication number: 20100053899Abstract: According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.Type: ApplicationFiled: September 2, 2009Publication date: March 4, 2010Applicant: SONY CORPORATIONInventors: Mitsuo Hashimoto, Kazuaki Yazawa, Yuichi Ishida, Hiroyuki Ryoson
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Publication number: 20100033933Abstract: According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion.Type: ApplicationFiled: August 6, 2009Publication date: February 11, 2010Applicant: SONY CORPORATIONInventors: Mitsuo Hashimoto, Kazuaki Yazawa, Yuichi Ishida, Hiroyuki Ryoson
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Publication number: 20100008043Abstract: A heat-transporting device includes a casing, a working fluid, a first substrate, a second substrate, and a third substrate. The casing includes a first side and a second side opposed to the first side. The working fluid is sealed inside the casing and transports heat by a phase change. The first substrate includes an inlet through which the working fluid is injected and constitutes the first side of the casing. The second substrate is disposed opposite to the first substrate and constitutes the second side of the casing. The third substrate includes a contact portion that is brought into contact with the inlet so that the inlet is sealed when the inlet is pressed, the third substrate being interposed between the first substrate and the second substrate.Type: ApplicationFiled: July 2, 2009Publication date: January 14, 2010Applicant: SONY CORPORATIONInventors: Takashi Yajima, Hiroyuki Ryoson, Kazuo Goto
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Publication number: 20090323285Abstract: A heat transport device includes an airtight container, a working fluid contained in the airtight container, and a plurality of plate-like members including a first plate-like member and a second plate-like member adjacent to the first plate-like member, the plate-like members each having a first hole having a first opening area and a second hole having a second opening area smaller than the first opening area, the plate-like members being layered in the airtight container so that the first hole of the first plate-like member and the first hole of the second plate-like member are communicated with each other, to retain the working fluid in a liquid phase by applying a capillary force to the working fluid, and so that an opening of the second hole is located within an opening of the first hole, to transfer the working fluid vaporized into a gas phase in the layered direction.Type: ApplicationFiled: June 23, 2009Publication date: December 31, 2009Applicant: Sony CorporationInventors: Hiroyuki RYOSON, Takashi YAJIMA, Mitsuo HASHIMOTO, Toshiro OOTA, Tatsuhiko SHIGEMOTO, Kazuo GOTO
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Publication number: 20090086416Abstract: Provided is a vibrating device which can generate efficient vibrations in a vibrating member and efficiently apply vibrations to a gas, a jet flow generating device in which the vibrating device has been implemented, and an electronic device in which the jet flow generating device has been implemented. A jet flow generating device 10 has a vibrating device 15 including a frame 4, and actuator 5 mounted on the frame 4, and a vibrating member 3 supported on the frame 4 by an elastic supporting member 6. The vibrating member 3 has a side plate 3b formed on the perimeter portion of a disc-shaped vibrating plate 3a, for example. Vibration of the vibrating member 3 applies vibrations to air within chambers 11a and 11b, whereby gas can alternatingly be blown from nozzles 2a and 2b.Type: ApplicationFiled: February 27, 2006Publication date: April 2, 2009Applicant: SONY CORPORATIONInventors: Hiroichi Ishikawa, Norikazu Nakayama, Takuya Makino, Tomoharu Mukasa, Hiroyuki Ryoson