Abstract: A vehicular power supply device to be equipped in a vehicle includes an electric storage unit group, an inverter, a driving motor, a converter, an electric device group, a first switch, and a second switch. The electric storage unit group includes first and second electric storage units. The driving motor is to be coupled to the electric storage unit group via the inverter. The electric device group is to be coupled to the electric storage unit group via the converter. The first switch is to be controlled between a state where the first electric storage unit is coupled to the inverter and a state where the first electric storage unit is coupled to the converter. The second switch is to be controlled between a state where the second electric storage unit is coupled to the inverter and a state where the second electric storage unit is coupled to the converter.

Abstract: The invention provides an improved heat seal structure for electronic devices. A heat seal structure comprises a base of synthetic resin formed integrally with an outwardly extending projection, with a gas vent running through the base and projection, the gas vent being sealed off by melting the projection, the improvement that the gas vent is configured generally in the shape of the letter V or Y bifurcating in the outward direction. In another embodiment, the projection has an annular extension disposed on the outward side of the base and adapted to be melted for a double seal effect. In another version of the structure, heat-sealing is performed with a sealing member or composition interposed in the gas vent. In still further embodiments, heat sealing is performed using a sealing member melting at a temperature below the melting point of the resin forming the base.

Abstract: An electromagnetic relay of the present invention has a large dielectric strength between a coil and each contact because of an insulative member interposed therebetween. Even if the straight distance between the coil and each contact is small, it is possible to obtain a sufficient dielectric strength without an extra process. Moreover, since a leg part of the coil terminal is coated with an insulative resin, the dielectric strength between the coil terminal and a movable iron element or a movable contact piece is enhanced. An insertion window formed in an insulating plate of the coil helps to insert a thickness gauge with high positioning accuracy.

Abstract: This low profile electromagnetic relay includes a base and a support post protruding at one end of the base. An electromagnet assembly is mounted in a generally central position on the base, and has a pair of magnetic pole surfaces on opposite sides of its one end. An armature assembly includes an insulating armature member, shaped generally as a hollow rectangular member with an open space being defined within it and formed with a hole by which it is rotatably fitted over the support post with the electromagnet assembly fitting inside the open space defined within it. A drive portion is connected to the insulating armature member. A pair of mutually opposed armature pieces are mounted on the insulating armature member, and, when the insulating armature member is rotatably fitted over the support post, lie on opposite sides of the one end of the electromagnet assembly and each oppose one of the magnetic pole surfaces of the electromagnet assembly.

Abstract: In this mounting structure and method for a surface mounted type electronic component, the component has at least one terminal which protrudes from its bottom surface and which terminates in a foot portion for being soldered to a printed circuit board. Also, a projection extends from this bottom surface of the electronic component for a distance somewhat less than the amounty by which the terminal projects from it. This projection is provisionally secured by adhesive to the printed circuit board with the foot portion of the terminal overlaying that circuit portion to which it is to be soldered, and then subsequently this terminal foot portion is soldered to this circuit portion. Thereby, during the soldering process, there is no risk of the terminal foot portion becoming displaced from the circuit portion and thus badly soldered thereto, because of the locating action of the adhered projection.