Patents by Inventor Hiroyuki Sakata

Hiroyuki Sakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134364
    Abstract: A production line design apparatus includes: a storage unit that stores facility configuration information that defines a number configuration including at least one or more main facilities that perform a main work in a production line and at least one or more setup facilities that perform an auxiliary work of the main facility, and arrangement pattern definition information including one or more arrangement patterns that define a combination of a movement method of the setup facility that is adoptable and a relative positional relationship between the main facility that is adoptable and the setup facility; and a processor that executes layout candidate generation processing of generating layout information that satisfies the number configuration by combining the arrangement patterns using the facility configuration information and the arrangement pattern definition information.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 25, 2024
    Inventors: Hiroyuki SAKATA, Daisuke TSUTSUMI
  • Patent number: 11929461
    Abstract: The present invention provides an electrolytic solution capable of providing an electrochemical device, such as a lithium ion secondary battery, or a module that has excellent high-temperature storage performance. The electrolytic solution contains: a homocyclic compound other than aromatic compounds; and a cyclic dicarbonyl compound. The homocyclic compound contains at least one group selected from the group consisting of a nitrile group and an isocyanate group.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: March 12, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Kenzou Takahashi, Shinichi Kinoshita, Hideo Sakata, Shigeaki Yamazaki, Hiroyuki Arima
  • Publication number: 20010004465
    Abstract: A cereal flour dough sheet-derived food, which contains a cereal material-derived water-soluble fraction in a portion of food where deterioration of palatability in texture occurs, said fraction having an equilibrium moisture content of from 10% by weight to 80% by weight at 25° C. and a glass transition moisture of from 1% by weight to 30% by weight at 25° C., and said fraction being contained in an amount of from 0.2% by weight to 50% by weight calculated as the solid content based on the total solid content of said portion. It is possible to provide edible substances capable of effectively inhibiting deterioration of palatability of food which occurs due, for example, to the reduction of moisture during preservation and/or cooking of processed food products and food materials containing various cereal flours, particularly cereal flour dough sheet-derived food products.
    Type: Application
    Filed: December 18, 2000
    Publication date: June 21, 2001
    Applicant: AJINOMOTO CO., INC.
    Inventors: Hiroyuki Sakata, Chie Sasaki, Masahiko Nonaka, Reiko Miyano, Sumie Sato
  • Patent number: 5439977
    Abstract: An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a latent curing accelerator soluble in an epoxy resin having two or more epoxy groups in one molecule and (c) a latent curing accelerator soluble in an acid anhydride, and (4) a dispersible latent curing accelerator, wherein the ratio of (1) to (2) is from 0.8 to 1.2, defined as the number of acid anhydride equivalents/the number of epoxy equivalents, and the amounts of (3) and (4) each are from 0.1 to 10 parts by weight to 100 parts by weight of the epoxy resin. The composition has excellent infiltrability, storage stability and reactivity.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: August 8, 1995
    Assignee: Ajinomoto Co., Inc.
    Inventors: Tadahiko Yokota, Hiroyuki Sakata, Kiyomiki Hirai, Koji Takeuchi
  • Patent number: 5430112
    Abstract: Epoxy resin compositions which contain (1) an epoxy resin which has two or more epoxy groups in its molecule, (2) a polythiol compound which has two or more thiol groups in its molecule and (3) an accelerator which is (i) a solid dispersion-type amine adduct latent curing accelerator or (ii) the product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule, exhibit excellent curability at relatively low heating temperatures as well as a long working life.
    Type: Grant
    Filed: October 21, 1993
    Date of Patent: July 4, 1995
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hiroyuki Sakata, Tadahiko Yokota, Kenichi Mori, Kiyomiki Hirai, Koji Takeuchi, Toshihiko Hatajima