Patents by Inventor Hiroyuki Sawamura
Hiroyuki Sawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10718679Abstract: A pressure sensor device with good temperature characteristics. An auxiliary fluid introduction path is provided in a bottom wall portion of a first case to introduce a fluid to the vicinity of a recessed portion of the bottom wall portion where an integrated circuit with a large change in temperature characteristics is mounted such that the temperature of the integrated circuit becomes the same as or close to the temperature of the fluid.Type: GrantFiled: April 26, 2017Date of Patent: July 21, 2020Assignee: HOKURIKU ELECTRIC INDUSTRY CO., LTD.Inventors: Hiroyuki Sawamura, Toshiaki Ichii
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Publication number: 20190137351Abstract: A pressure sensor device with good temperature characteristics. An auxiliary fluid introduction path is provided in a bottom wall portion of a first case to introduce a fluid to t he vicinity of a recessed portion of the bottom wall portion where an integrated circuit with a large change in temperature characteristics is mounted such that the temperature of the integrated circuit becomes the same as or close to the temperature of the fluid.Type: ApplicationFiled: April 26, 2017Publication date: May 9, 2019Inventors: Hiroyuki Sawamura, Toshiaki Ichii
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Patent number: 10006826Abstract: A semiconductor pressure sensor device in which the shape or the structure of a connector portion can be easily changed and which has high waterproof performance. A terminal housing and a second case are engaged with each other via an engagement structure. The terminal housing and a first case are fitted with each other via a fitting structure. Thus, the first case and the second case are fixed to each other via the terminal housing. The first case is fitted in the second case. Then, the terminal housing is fitted with the first case, and the terminal housing is engaged with the second case substantially at the same time. Through such simple process, an opening portion of the first case is covered and a connector portion configured to enable external terminals to be connected to ends, located on one side, of a plurality of lead terminals is formed.Type: GrantFiled: December 1, 2015Date of Patent: June 26, 2018Assignee: Hokuriku Electric Industry Co., Ltd.Inventors: Satoshi Tsubata, Hiroyuki Sawamura
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Publication number: 20170328802Abstract: A semiconductor pressure sensor device in which the shape or the structure of a connector portion can be easily changed and which has high waterproof performance. A terminal housing and a second case are engaged with each other via an engagement structure. The terminal housing and a first case are fitted with each other via a fitting structure. Thus, the first case and the second case are fixed to each other via the terminal housing. The first case is fitted in the second case. Then, the terminal housing is fitted with the first case, and the terminal housing is engaged with the second case substantially at the same time. Through such simple process, an opening portion of the first case is covered and a connector portion configured to enable external terminals to be connected to ends, located on one side, of a plurality of lead terminals is formed.Type: ApplicationFiled: December 1, 2015Publication date: November 16, 2017Inventors: Satoshi Tsubata, Hiroyuki Sawamura
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Patent number: 7360440Abstract: A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.Type: GrantFiled: June 15, 2007Date of Patent: April 22, 2008Assignee: Hokuriku Electric Industry Co., Ltd.Inventors: Shigeru Hirose, Hiroyuki Sawamura, Masato Ando, Yoshimitsu Motoki
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Publication number: 20070234827Abstract: A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.Type: ApplicationFiled: June 15, 2007Publication date: October 11, 2007Applicant: HOKURIKU ELECTRIC INDUSTRY CO., LTD.Inventors: Shigeru Hirose, Hiroyuki Sawamura, Masato Ando, Yoshimitsu Motoki
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Patent number: 7234359Abstract: A semiconductor force sensor capable of preventing a diaphragm part (37) from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part (37), wherein a force transmitting means for applying a measured force to the diaphragm part (37) of a semiconductor force sensor element (31) is formed of a sphere (33) having a rigidity, and a through hole (63) passing through an opposed wall part (55) toward the diaphragm (37) is formed in the opposed wall parts (55) at a position opposed to the center part of the diaphragm part (37) so that a part of the sphere (33) can face the outside of the opposed wall part (55) and stores a part of the remaining part of the sphere (33) to allow the sphere (33) to be moved only in a direction orthogonal to the diaphragm part (37) and rotated on the center part of the diaphragm part (37).Type: GrantFiled: April 14, 2003Date of Patent: June 26, 2007Assignee: Hokuriku Electric Industry Co., Ltd.Inventors: Shigeru Hirose, Hiroyuki Sawamura, Masato Ando, Yoshimitsu Motoki
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Publication number: 20050217386Abstract: A semiconductor force sensor capable of preventing a diaphragm part (37) from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part (37), wherein a force transmitting means for applying a measured force to the diaphragm part (37) of a semiconductor force sensor element (31) is formed of a sphere (33) having a rigidity, and a through hole (63) passing through an opposed wall part (55) toward the diaphragm (37) is formed in the opposed wall parts (55) at a position opposed to the center part of the diaphragm part (37) so that a part of the sphere (33) can face the outside of the opposed wall part (55) and stores a part of the remaining part of the sphere (33) to allow the sphere (33) to be moved only in a direction orthogonal to the diaphragm part (37) and rotated on the center part of the diaphragm part (37).Type: ApplicationFiled: April 14, 2003Publication date: October 6, 2005Applicant: Hokuriku Electric Industry Co.,Inventors: Shigeru Hirose, Hiroyuki Sawamura, Masato Ando, Yoshimitsu Motoki
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Patent number: D629320Type: GrantFiled: September 25, 2009Date of Patent: December 21, 2010Assignee: Hokuriku Electric Industry Co., Ltd.Inventors: Hiroyuki Sawamura, Masato Ando, Satoshi Tsubata