Abstract: An electric vacuum cleaner includes an electric blower, a driver for driving the electric blower, a determination controller for controlling the electric power supply to the electric blower by transmitting a signal to the driver, and a dust amount sensor for sensing the amounts of dusts of different sizes. The determination controller controls the electric power supply to the electric blower based on the amounts of dusts of the different sizes sensed by the dust amount sensor.

Abstract: An oxygen enrichment apparatus includes an oxygen enriching unit for generating oxygen-enriched air and a discharge unit for discharging the oxygen-enriched air transferred from the suction unit. The oxygen-enriched air generated by the oxygen enriching unit has an oxygen concentration ranging from about 25% to 35%. The apparatus also includes a suction unit for suctioning the oxygen-enriched air from the oxygen enriching unit and a control unit for controlling the operation of the suction unit. The main body is provided with a display unit for indicating a state that the oxygen-enriched air is being discharged out by the discharge unit. The oxygen enriching unit has at least one oxygen enriching membrane for generating the oxygen-enriched air and a condensed water treating unit is installed at an air passage for guiding the oxygen-enriched air from the oxygen enriching unit to the discharge unit via the suction unit.

Abstract: A suction nozzle for use in a vacuum cleaner includes a floor nozzle and a mini nozzle having a suction head, a rotatable joint, and joint, to be detachably secured in the floor nozzle. Either of the suction head and the rotatable joint or the rotatable joint and the joint is vertically joined and the other rotatably joined. Moreover, the suction head is unrotatably secured onto the floor nozzle, and forms an air communication with the floor nozzle.

Abstract: An oxygen enrichment apparatus includes an oxygen enriching unit for generating oxygen-enriched air and a discharge unit for discharging the oxygen-enriched air transferred from the suction unit. The oxygen-enriched air generated by the oxygen enriching unit has an oxygen concentration ranging from about 25% to 35%. The apparatus also includes a suction unit for suctioning the oxygen-enriched air from the oxygen enriching unit and a control unit for controlling the operation of the suction unit. The main body is provided with a display unit for indicating a state that the oxygen-enriched air is being discharged out by the discharge unit. The oxygen enriching unit has at least one oxygen enriching membrane for generating the oxygen-enriched air and a condensed water treating unit is installed at an air passage for guiding the oxygen-enriched air from the oxygen enriching unit to the discharge unit via the suction unit.

Abstract: A suction nozzle for use in a vacuum cleaner includes a floor nozzle and a mini nozzle having a suction head, a rotatable joint, and joint, to be detachably secured in the floor nozzle. Either of the suction head and the rotatable joint or the rotatable joint and the joint is vertically joined and the other rotatably joined. Moreover, the suction head is unrotatably secured onto the floor nozzle, and forms an air communication with the floor nozzle.

Abstract: A two-step method for chemical mechanical polishing of a semiconductor substrate having successive layers, comprised of, a metal layer, an underlying barrier film and an underlying dielectric layer. The first polishing step is performed utilizing a slurry composition selective to the metal in the metal layer, to remove the metal at a high removal rate during polishing, and the second polishing step is performed utilizing a slurry composition selective to the barrier film and least selective to the metal layer and the underlying dielectric layer. In an alternate embodiment, the second polishing step is performed with a slurry equally selective to the barrier layer and the underlying dielectric layer and least selective to the metal of the metal layer, to remove the barrier layer at a high removal rate during polishing, and level a surface of the dielectric layer to the surface of the metal interconnection structure in the underlying dielectric layer.