Patents by Inventor Hiroyuki Shimoyama

Hiroyuki Shimoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200147584
    Abstract: The present invention relates to a silica powder storage package that stores a silica powder, in which the silica powder storage package preferably includes a bottomed container that has an opening portion, and a lid member that closes the opening portion, and further relates to a test kit including the silica powder storage package of the present invention, and the test kit being for allowing the silica powder to adsorb at least one part of the components in a liquid sample by injecting the liquid sample into the bottomed container.
    Type: Application
    Filed: January 10, 2020
    Publication date: May 14, 2020
    Applicant: MITSUBISHI CHEMICAL CORPORATION
    Inventors: Takanobu KATSUKI, Hiroyuki YANO, Kohshi HONDA, Kouichi ADACHI, Atsushi WADA, Takahiro INOUE, Yuriko KOREKANE, Masaru SHIMOYAMA, Naoya KENBOU
  • Publication number: 20200139702
    Abstract: A liquid ejection head includes a laminated body including a first plate having a plurality of ejection nozzles for ejecting a liquid and made from a resin material and a second plate having a plurality of through-holes communicating with the corresponding ejection nozzles and made from a metal material. The laminated body has a plurality of projection parts formed along the array direction Y of the ejection nozzles and having a curved dome shape projecting in the direction from the second plate to the first plate. The second plate has a plurality of through-slits formed adjacent to the projection parts.
    Type: Application
    Filed: December 10, 2019
    Publication date: May 7, 2020
    Inventor: Hiroyuki Shimoyama
  • Patent number: 10562301
    Abstract: A liquid ejection head includes a laminated body including a first plate having a plurality of ejection nozzles for ejecting a liquid and made from a resin material and a second plate having a plurality of through-holes communicating with the corresponding ejection nozzles and made from a metal material. The laminated body has a plurality of projection parts formed along the array direction Y of the ejection nozzles and having a curved dome shape projecting in the direction from the second plate to the first plate. The second plate has a plurality of through-slits formed adjacent to the projection parts.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: February 18, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hiroyuki Shimoyama
  • Patent number: 10468338
    Abstract: Performance of a semiconductor device is enhanced. A semiconductor device is a semiconductor device obtained by sealing in a sealing portion first, second, and third semiconductor chips each incorporating a power transistor for high-side switch, fourth, fifth, and sixth semiconductor chips each incorporating a power transistor for low-side switch, and a semiconductor chip incorporating a control circuit controlling these chips. The source pads of the fourth, fifth, and sixth semiconductor chips are electrically coupled to a plurality of leads LD9 and a plurality of leads LD10 via a metal plate. As viewed in a plane, the leads LD9 intersect with a side MRd4 of the sealing portion and the leads LD10 intersect with a side MRd2 of the sealing portion.
    Type: Grant
    Filed: July 29, 2018
    Date of Patent: November 5, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Hiroya Shimoyama, Hiroyuki Nakamura
  • Patent number: 10343401
    Abstract: A flow path unit is formed by laminating a plurality of lamination plates, and has a first damper chamber extending in a manner overlapping with a plurality of pressure chambers with respect to a longitudinal direction in which the plurality of pressure chambers is aligned, as seen from an opening side of a plurality of nozzles. The first damper chamber is provided at a height between the pressure chamber and the common liquid chamber, as measured along the laminating direction in which the plurality of lamination plates is laminated, and a first support part is provided inside the first damper chamber.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: July 9, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hiroyuki Shimoyama
  • Patent number: 10328696
    Abstract: A liquid ejection head includes a plurality of ejection ports, a plurality of pressure chambers each communicating with each of the ejection ports, a piezoelectric actuator constituting part of walls of the pressure chambers, and a common liquid chamber containing liquid to be supplied to the pressure chambers. The pressure chambers and the common liquid chamber are opposed with an opposing wall interposed therebetween. The opposing wall faces the wall of the pressure chambers constituted by the piezoelectric actuator. A reinforcing portion that supports the opposing wall is provided in the common liquid chamber.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: June 25, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiro Ishii, Junichiro Iri, Ryo Sato, Hiroyuki Shimoyama, Kazumasa Matsushita, Kenji Kitabatake
  • Patent number: 10259221
    Abstract: An element substrate in which a plurality of members are layered. Plates and a substrate serving as the plurality of members being layered and adhered to each other. The element substrate including a plurality of ejection ports that eject a liquid, and a plurality of supply ports that each communicate with a different ejection port. At least one of the members includes a groove that is, when viewing, from above, a surface in which the ejection ports are formed, formed between two ejection ports, each of which communicates to a different supply port.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: April 16, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Junichiro Iri, Kazuhiro Ishii, Ryo Sato, Hiroyuki Shimoyama, Kazumasa Matsushita, Kenji Kitabatake
  • Publication number: 20180250934
    Abstract: A flow path unit is formed by laminating a plurality of lamination plates, and has a first damper chamber extending in a manner overlapping with a plurality of pressure chambers with a longitudinal direction in which the plurality of pressure chambers is aligned, seen from an opening side of a plurality of nozzles. The first damper chamber is provided at a height between the pressure chamber and the common liquid chamber, in a height along the laminating direction in which the plurality of lamination plates is laminated, and a first support part is provided inside the first damper chamber.
    Type: Application
    Filed: February 13, 2018
    Publication date: September 6, 2018
    Inventor: Hiroyuki Shimoyama
  • Publication number: 20180162126
    Abstract: A liquid ejection head includes a laminated body including a first plate having a plurality of ejection nozzles for ejecting a liquid and made from a resin material and a second plate having a plurality of through-holes communicating with the corresponding ejection nozzles and made from a metal material. The laminated body has a plurality of projection parts formed along the array direction Y of the ejection nozzles and having a curved dome shape projecting in the direction from the second plate to the first plate. The second plate has a plurality of through-slits formed adjacent to the projection parts.
    Type: Application
    Filed: November 16, 2017
    Publication date: June 14, 2018
    Inventor: Hiroyuki Shimoyama
  • Publication number: 20180065367
    Abstract: An element substrate in which a plurality of members are layered. Plates and a substrate serving as the plurality of members being layered and adhered to each other. The element substrate including a plurality of ejection ports that eject a liquid, and a plurality of supply ports that each communicate with a different ejection port. At least one of the members includes a groove that is, when viewing, from above, a surface in which the ejection ports are formed, formed between two ejection ports, each of which communicates to a different supply port.
    Type: Application
    Filed: August 31, 2017
    Publication date: March 8, 2018
    Inventors: Junichiro Iri, Kazuhiro Ishii, Ryo Sato, Hiroyuki Shimoyama, Kazumasa Matsushita, Kenji Kitabatake
  • Publication number: 20180065366
    Abstract: A liquid ejection head includes a plurality of ejection ports, a plurality of pressure chambers each communicating with each of the ejection ports, a piezoelectric actuator constituting part of walls of the pressure chambers, and a common liquid chamber containing liquid to be supplied to the pressure chambers. The pressure chambers and the common liquid chamber are opposed with an opposing wall interposed therebetween. The opposing wall faces the wall of the pressure chambers constituted by the piezoelectric actuator A reinforcing portion that supports the opposing wall is provided in the common liquid chamber.
    Type: Application
    Filed: August 31, 2017
    Publication date: March 8, 2018
    Inventors: Kazuhiro Ishii, Junichiro Iri, Ryo Sato, Hiroyuki Shimoyama, Kazumasa Matsushita, Kenji Kitabatake
  • Patent number: 9472639
    Abstract: A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: October 18, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroyuki Shimoyama, Taichi Yonemoto, Shuji Koyama, Masaki Ohsumi, Keiji Matsumoto, Seiichiro Yaginuma
  • Patent number: 9254661
    Abstract: Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: February 9, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shimpei Otaka, Isao Imamura, Hiroyuki Shimoyama, Tomohiro Takahashi
  • Publication number: 20150217569
    Abstract: Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.
    Type: Application
    Filed: January 26, 2015
    Publication date: August 6, 2015
    Inventors: Shimpei Otaka, Isao Imamura, Hiroyuki Shimoyama, Tomohiro Takahashi
  • Publication number: 20140212997
    Abstract: A process for producing a substrate for a liquid ejection head in which a depressed portion is formed on a second surface that is a surface opposite to a first surface of a silicon substrate having an element formation region on the first surface with a peripheral side region left, the process including the steps of (1) forming an etching mask layer covering the second surface of the silicon substrate; (2) subjecting the etching mask layer and the silicon substrate to laser abrasion processing to form a pattern opening that does not pass through the silicon substrate; and (3) performing a wet etching process to the silicon substrate where the pattern opening is formed from a side of the second surface to form the depressed portion. The depressed portion is formed over a center side region including a position corresponding to the element formation region.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 31, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Seiichiro Yaginuma, Hiroyuki Shimoyama, Masaki Ohsumi, Taichi Yonemoto, Shuji Koyama
  • Publication number: 20140024148
    Abstract: A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes.
    Type: Application
    Filed: July 18, 2013
    Publication date: January 23, 2014
    Inventors: Hiroyuki Shimoyama, Taichi Yonemoto, Shuji Koyama, Masaki Ohsumi, Keiji Matsumoto, Seiichiro Yaginuma
  • Patent number: 6198215
    Abstract: The present invention is aimed to realize a structure which satisfies all requirements of: being free from a problem on waste water treatment in a producing process when a Cr oxide film and a Cr metal film are used, and free from a weakness in water resistance when a Mo oxide film and a Mo metal film are used; adaptability to environment; low production cost; and stability in a producing process. The structure is realized by laminating a molybdenum oxynitride film in which one substance of Si, W, Ta, and Ni is added, i.e., (Mo:X)ON(X=Si,W,Ta,Ti), and one or more metal films of Ni, Al, Mo films and the like.
    Type: Grant
    Filed: March 27, 1998
    Date of Patent: March 6, 2001
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Manabu Niboshi, Hiroyuki Shimoyama
  • Patent number: 5504599
    Abstract: To reduce the thickness of liquid crystal display device and enhance its performance by integrating the liquid crystal display element and light source. One surface of a substrate and one surface of a substrate are adhered with an adhesive layer through an intervening liquid crystal layer. On the other surface of the substrate, an EL light source is mounted, that is, a glass substrate on which a first electrode, a first insulation layer, a phosphor layer, a second insulation layer, and a second electrode are laminated in this sequence is bonded with an insulation layer. Therefore, the liquid crystal display device may be reduced in thickness and enhanced in performance.
    Type: Grant
    Filed: October 15, 1993
    Date of Patent: April 2, 1996
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Katsushi Okibayashi, Kousuke Terada, Akiyoshi Mikami, Hiroyuki Shimoyama
  • Patent number: 5492199
    Abstract: A checkout device includes first and second stationary scanners forming central portions of first and second scanning lanes set in parallel with each other, each for reading an article code affixed to an article which is moved from an upstream side to a down stream side in a corresponding scanning lane, and a settlement section arranged between the first and second scanning lanes for performing a settlement process based on article codes sequentially supplied from each of the stationary scanners. In particular, the checkout device further includes a position adjusting mechanism for variably setting a position of the settlement section along the first and second scanning lanes.
    Type: Grant
    Filed: January 23, 1995
    Date of Patent: February 20, 1996
    Assignee: TEC Corporation
    Inventor: Hiroyuki Shimoyama
  • Patent number: 5372837
    Abstract: A method of manufacturing a thin film electroluminescent (EL) device in which an electron beam is directed to a pellet of a substance containing an additive agent, and the substance is evaporated and deposited on a substrate and a change per unit time of the growing deposit is monitored by a sensor, comprising the steps of (1) controlling energy of the electron beam in accordance with an output of the sensor during a first time interval for adjusting an evaporation rate of the substance to a specified rate, (2) maintaining the controlled energy of the electron beam constant during a second time interval, larger than the first time interval and alternatively repeating steps (1) and (2).
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: December 13, 1994
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiroyuki Shimoyama, Noriaki Nakamura, Kinichi Isaka, Akio Inohara, Hiroshi Kishishita