Abstract: A semiconductor device includes: a substrate having an obverse and a reverse face; wirings on the obverse face such as a first and a second drive wiring; a semiconductor element connected to the first and second drive wirings; a first drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in a thickness direction and connected to the first drive wiring; a second drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in the thickness direction and connected to the second drive wiring; and a sealing resin covering the wirings and the semiconductor element, while also covering the first and second drive conductor such that their faces opposite to the substrate in the thickness direction are exposed. The first and the second drive conductor are separated in a direction parallel to the obverse face.

Abstract: A semiconductor device and a manufacturing method of the semiconductor device by which peeling off of a sealing resin and a wire from each other can be practically suppressed are disclosed. The semiconductor device includes a substrate, a main face wire, a semiconductor element that is conductive to the main face wire, a sealing resin having resin side faces directed in a direction crossing a thickness direction, the sealing resin sealing the main face wire and the semiconductor element, a through-wire that is conductive to the main face wire and having an exposed rear face exposed from the substrate, and a column conductor that is conductive to the main face wire and having an exposed side face exposed from the resin side faces. The column conductor is supported from the opposite sides thereof in the thickness direction by the substrate and the sealing resin.

Abstract: There is provided a semiconductor device that includes a wiring layer, a plurality of bonding layers arranged on the wiring layer and having conductivity, and a semiconductor element having a rear surface facing the wiring layer and a plurality of pads provided on the rear surface, and bonded to the wiring layer via the plurality of bonding layers, wherein the plurality of bonding layers are arranged in a grid shape when viewed along a thickness direction, wherein each of the plurality of pads is electrically connected to a circuit formed inside the semiconductor element and any of the plurality of bonding layers, and wherein at least one of the plurality of pads is located to be spaced apart from the plurality of bonding layers when viewed along the thickness direction.

Abstract: A semiconductor device includes: a resin layer having a resin main surface; a mounting wiring layer arranged on the resin main surface, and having a mounting wiring main surface facing the same side as the resin main surface and a mounting wiring back surface facing the side of the resin main surface; a semiconductor element including an element wiring layer which is mounted on the mounting wiring main surface, has an element wiring main surface facing the side of the resin layer, and is connected to the mounting wiring layer; and a sealing resin which seals the mounting wiring layer and the semiconductor element, wherein the mounting wiring main surface and the element wiring main surface are rough surfaces having a larger surface roughness than the mounting wiring back surface.

Abstract: A semiconductor device includes an electrically insulating substrate including a substrate main surface and a substrate back surface facing opposite to each other in a thickness direction and at least one substrate side surface facing a direction intersecting the thickness direction, a semiconductor element arranged at a side of the substrate main surface, a heat-dissipating conductive portion that is provided at a position overlapping with at least a portion of the semiconductor element when viewed from the thickness direction and is exposed from the substrate back surface, a sealing resin that seals the semiconductor element while covering the substrate main surface, and at least one wiring portion that is connected to the heat-dissipating conductive portion, extends from the heat-dissipating conductive portion to the substrate side surface while being exposed from the substrate back surface, and is exposed from the substrate side surface.

Abstract: A semiconductor device and a manufacturing method of the semiconductor device by which peeling off of a sealing resin and a wire from each other can be practically suppressed are disclosed. The semiconductor device includes a substrate, a main face wire, a semiconductor element that is conductive to the main face wire, a sealing resin having resin side faces directed in a direction crossing a thickness direction, the sealing resin sealing the main face wire and the semiconductor element, a through-wire that is conductive to the main face wire and having an exposed rear face exposed from the substrate, and a column conductor that is conductive to the main face wire and having an exposed side face exposed from the resin side faces. The column conductor is supported from the opposite sides thereof in the thickness direction by the substrate and the sealing resin.

Abstract: A semiconductor device and a manufacturing method of the semiconductor device by which peeling off of a sealing resin and a wire from each other can be practically suppressed are disclosed. The semiconductor device includes a substrate, a main face wire, a semiconductor element that is conductive to the main face wire, a sealing resin having resin side faces directed in a direction crossing a thickness direction, the sealing resin sealing the main face wire and the semiconductor element, a through-wire that is conductive to the main face wire and having an exposed rear face exposed from the substrate, and a column conductor that is conductive to the main face wire and having an exposed side face exposed from the resin side faces. The column conductor is supported from the opposite sides thereof in the thickness direction by the substrate and the sealing resin.

Abstract: A semiconductor device includes a substrate, a wire portion, a bonding portion, a semiconductor element, and an encapsulation resin. The substrate includes substrate main and back surfaces facing in opposite directions. The wire portion includes a conductive layer formed on the substrate main surface. The bonding portion includes a first plated layer formed on an upper surface of the wire portion and a first solder layer formed on an upper surface of the first plated layer. The semiconductor element includes an element main surface facing the substrate main surface, an element electrode formed on the element main surface, and a second plated layer formed on a lower surface of the element electrode and bonded to the first solder layer. The encapsulation resin covers the semiconductor element. The bonding portion is larger than the element electrode as viewed in a thickness-wise direction that is perpendicular to the substrate main surface.

Abstract: A semiconductor device and a manufacturing method of the semiconductor device by which peeling off of a sealing resin and a wire from each other can be practically suppressed are disclosed. The semiconductor device includes a substrate, a main face wire, a semiconductor element that is conductive to the main face wire, a sealing resin having resin side faces directed in a direction crossing a thickness direction, the sealing resin sealing the main face wire and the semiconductor element, a through-wire that is conductive to the main face wire and having an exposed rear face exposed from the substrate, and a column conductor that is conductive to the main face wire and having an exposed side face exposed from the resin side faces. The column conductor is supported from the opposite sides thereof in the thickness direction by the substrate and the sealing resin.

Abstract: There is provided a semiconductor device that includes a wiring layer, a plurality of bonding layers arranged on the wiring layer and having conductivity, and a semiconductor element having a rear surface facing the wiring layer and a plurality of pads provided on the rear surface, and bonded to the wiring layer via the plurality of bonding layers, wherein the plurality of bonding layers are arranged in a grid shape when viewed along a thickness direction, wherein each of the plurality of pads is electrically connected to a circuit formed inside the semiconductor element and any of the plurality of bonding layers, and wherein at least one of the plurality of pads is located to be spaced apart from the plurality of bonding layers when viewed along the thickness direction.

Abstract: A portable media player communicates with a host computer for enabling a user of the player to manage media distribution using the control software of the host computer. The host computer can send a GUI that is displayed on the otherwise “dumb” player, and the user can view the GUI and press a single button to command the control software to download a media title to the player. The host computer can periodically poll the player to determine its status.

Abstract: A portable media player communicates with a host computer for enabling a user of the player to manage media distribution using the control software of the host computer. The host computer can send a GUI that is displayed on the otherwise “dumb” player, and the user can view the GUI and press a single button to command the control software to download a media title to the player. The host computer can periodically poll the player to determine its status.

Abstract: A portable media player communicates with a host computer for enabling a user of the player to manage media distribution using the control software of the host computer. The host computer can send a GUI that is displayed on the otherwise “dumb” player, and the user can view the GUI and press a single button to command the control software to download a media title to the player. The host computer can periodically poll the player to determine its status.

Abstract: A semiconductor device of the present invention includes a semiconductor chip; an internal pad for electrical connection formed on a surface of the semiconductor chip; a stress relaxation layer formed on the semiconductor chip and having an opening for exposing the internal pad; a connection pad made of a metal having solder wettability, formed on a part facing the opening of the internal pad and provided with a protruding portion protruding on the stress relaxation layer; a metal flange made of a metal having solder wettability, encompassing the periphery of the protruding portion and formed with a smaller thickness than a protruding amount of the protruding portion onto the stress relaxation layer; and a solder terminal for electrical connection with outside formed on the protruding portion and the metal flange.

Abstract: A semiconductor device of the present invention includes a semiconductor chip; an internal pad for electrical connection formed on a surface of the semiconductor chip; a stress relaxation layer formed on the semiconductor chip and having an opening for exposing the internal pad; an under-bump layer formed so as to cover a face exposed in the opening on the internal pad, an inner face of the opening and a circumference of the opening on the stress relaxation layer; a solder terminal for electrical connection with outside formed on the under-bump layer; and a protective layer formed on the stress relaxation layer, encompassing a periphery of the under-bump layer and covering a side face of the under-bump layer.

Abstract: A portable media player communicates with a host computer for enabling a user of the player to manage media distribution using the control software of the host computer. The host computer can send a GUI that is displayed on the otherwise “dumb” player, and the user can view the GUI and press a single button to command the control software to download a media title to the player. The host computer can periodically poll the player to determine its status.

Abstract: A portable media player communicates with a host computer for enabling a user of the player to manage media distribution using the control software of the host computer. The host computer can send a GUI that is displayed on the otherwise “dumb” player, and the user can view the GUI and press a single button to command the control software to download a media title to the player. The host computer can periodically poll the player to determine its status.

Abstract: In an inner wall surface of a casing, grooves are formed that correspond to end faces of an outer rotor and an inner rotor, and seal members are disposed within the grooves, the seal members presses against the end faces of the outer rotor and the inner rotor. Inclined portions are provided in sealing portions of resin members of seal members, the sealing portions covering a closed portion. With this configuration, an internal pressure in the closed portion causes the inclined portions to separate from an outer rotor and an inner rotor when a brake fluid pressure within the closed portion increases to the point that the brake fluid is excessively compressed, releasing the brake fluid that is inside the closed portion. It is therefore possible to prevent the brake fluid pressure from increasing excessively within the closed portion.

Abstract: A bearing is located with movement of an outer race in the longitudinal direction of a drive shaft being restricted, and the drive shaft is fixed to an inner race with the press fit, so that, it is possible to prevent the drive shaft from escaping. In addition, the inner race is longer than the outer race. Therefore, it is possible to obtain sufficient strength of the press fit of the drive shaft in the inner race while suppressing the size of the outer race (in other words, suppressing the size of the pump device). As a consequence, the size of the pump device can be suppressed while increasing reliability of the function for preventing the drive shaft from escaping.

Abstract: A portable media player communicates with a host computer for enabling a user of the player to manage media distribution using the control software of the host computer. The host computer can send a GUI that is displayed on the otherwise “dumb” player, and the user can view the GUI and press a single button to command the control software to download a media title to the player. The host computer can periodically poll the player to determine its status.