Patents by Inventor Hiroyuki Sunazuka

Hiroyuki Sunazuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090200090
    Abstract: The present invention provides a multiple-point grounding type foot portion supporting mechanism having excellent reliability, in which the respective supporting points passively follow unevenness of the grounding surface such as a road surface, and which is capable of quickly supporting foot bottoms at polygonal points and preventing falling over even on a grounding surface having level differences by fixing the supporting points when all supporting points are grounded.
    Type: Application
    Filed: July 28, 2005
    Publication date: August 13, 2009
    Applicants: TMSUK CO., LTD., TAKANISHI, ATSUO
    Inventors: Atsuo Takanishi, Kenji Hashimoto, Akihiro Ohta, Takuya Hosobata, Yusuke Sugahara, Yutaka Mikuriya, Masamiki Kawase, Hiroyuki Sunazuka, Chiaki Tanaka, Yoichi Takamoto, Katsuyuki Baba, Shigeaki Ino