Abstract: A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.

Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

Abstract: A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.

Abstract: An optical module includes: a butterfly-type optical device including a body that contains a heating element in an interior space, a lid body that puts a lid on the interior space, and a plurality of pins; a substrate including a connecting surface to which the plurality of pins are connected; and a heat-dissipating component arranged to the connecting surface side, wherein the optical device is connected to the connecting surface with a heat-dissipating surface, of a part that has been arranged with the heating element, oriented to the heat-dissipating component side, and with a gap provided to a side of the lid body opposite to a side of the interior space.

Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.

Abstract: A convoy travel control apparatus includes: a communication portion; a travel control portion; and a joining control portion, wherein when an own vehicle is travelling in convoy while being incorporated in a group of convoy vehicles travelling in convoy, if the communication portion has received, from an independent vehicle not incorporated in the group of convoy vehicles travelling in convoy, request information to incorporate the independent vehicle into the group of convoy vehicles, then the joining control portion determines a positional relationship between a position of the group of convoy vehicles and a position of the independent vehicle, and wherein if the independent vehicle is travelling along a side of the group of convoy vehicles, then in order to incorporate the independent vehicle into the group of convoy vehicles, the joining control portion exercises control on the group of convoy vehicles via the communication portion.

Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

Abstract: A communication device (202) for performing communication with other vehicle through a wireless communication network which performs communication by switching a communication state to a standby state or to a connecting state, and a state setting means (208) for selectively setting a state of the communication device to the standby state or to the connecting state are provided, wherein the state setting means judges whether or not at least one predetermined condition is met based on the information on an own vehicle and/or the information on other vehicle, sets the communication device to the connecting state when the condition is met, and sets the communication device to the standby state provided that the condition is not met.

Abstract: A wired circuit board includes a first insulating layer, a conductive pattern disposed on the first insulating layer and including a plurality of terminals arranged in parallel to be spaced apart from each other, and a second insulating layer disposed on the first insulating layer so as to cover the conductive pattern. Each of the terminals includes a main body portion and a protruding portion protruding from the main body portion and having a dimension in a parallel arrangement direction of the terminals which is shorter than a dimension of the main body portion thereof. The second insulating layer includes a plurality of end-portion covering portions disposed individually on both end portions of the main body portion in the parallel arrangement direction and exposing a middle portion of the main body portion and the protruding portion.

Abstract: The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.

Abstract: The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist.

Abstract: A method for producing a suspension board with circuit includes the steps of (7) removing a first electroless plating layer corresponding to a first terminal and/or a second electroless plating layer corresponding to a second terminal by etching, (8) removing a metal supporting board in contact with the lower surface of a first conductive layer filling the inside of a first opening portion, and (9) providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and/or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board.

Abstract: A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating layer to cover the write wiring trace. A connection terminal is formed over the insulating layer to be electrically connected to the write wiring trace and exposed from the coating layer.

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side in the thickness direction of the base insulating layer and a second cover insulating layer disposed at one side in the thickness direction of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.

Abstract: An optical module includes: a butterfly-type optical device including a body that contains a heating element in an interior space, a lid body that puts a lid on the interior space, and a plurality of pins; a substrate including a connecting surface to which the plurality of pins are connected; and a heat-dissipating component arranged to the connecting surface side, wherein the optical device is connected to the connecting surface with a heat-dissipating surface, of a part that has been arranged with the heating element, oriented to the heat-dissipating component side, and with a gap provided to a side of the lid body opposite to a side of the interior space.

Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof.

Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.