Abstract: The photosensitive resin composition comprises (a) a ternary copolymer of an ethylenically unsaturated amide, carboxyl-containing monomer and third monomer, (b) an esterified resin by the reaction of an unsaturated carboxylic acid and a novolactype epoxy resin, (c) a photopolymerizable monomer, (d) a photopolymerization initiator and (e) a powder such as a finely divided silica filler. The resist layer formed from the composition is capable of being developed with an alkaline aqueous solution and has excellent heat resistance in addition to other desirable properties when the patterned resist layer by the pattern-wise exposure to ultraviolet light and development is subjected to a heat treatment to effect thermal curing.

Abstract: A remover solution for photoresist comprising (a) a solvent which is typically water, (b) an inorganic or organic alkaline compound such as sodium and potassium hydroxides, and (c) a borohydride compound such as sodium and lithium borohydrides and organic amine borane compounds. When used for removing patterned photoresist layer in the manufacturing process of, for example, electronic circuit board substrates. The method gives quite satisfactory results without discoloration or denaturation of the copper surface and solder surface, consequently leading to the production of high-quality products.

Abstract: The composition of this invention comprises:(a) a thermoplastic organic polymer,(b) a non-gaseous ethylenically unsaturated compound containing at least two terminal ethylenic groups capable of forming a polymer by photoinitiated addition polymerization,(c) an addition polymerization initiator activatable by actinic radiation, and(d) a benzotriazole carboxylic acid.

Abstract: The invention provides an improved method for the so-called dry-film process for forming a pattern-wise photoresist layer on the substrate surface in which a substrate is overlaid and laminated with a preformed film of a photosensitive composition called a dry film and photolithographically processed. In the inventive method, different from conventional dry-film processes, the substrate plate is first provided with a protecting layer of a photosensitive composition containing a halation inhibitor and the lamination with a dry film is performed without removing the protecting layer. After pattern-wise exposure to light, development of the photosensitive layer is undertaken by use of a developer solvent capable of dissolving both of the protecting layer and the pattern-forming layer. Despite the intervention of the protecting layer, the resolving power and image reproducibility are excellent.

Abstract: A process for producing novel resinous gravure printing plates comprises coating on a printing substrate such as a cylinder a radiation-curable resin coating composition containing in a specific ratio a soluble polyamide resin and a radiation-polymerizable monomer or the like dissolved in a solvent, curing the coated film by irradiation with actinic rays, and engraving the resulting cured film. As a result, a novel resinous gravure printing plate having excellent engraving property, printing durability, and solvent resistance is produced.