Patents by Inventor Hiroyuki Tokubo

Hiroyuki Tokubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Luminescent device and method for manufacturing the same
    Patent number: 7947999
    Abstract: A luminescent device including a die pad lead composed of an inner lead and an outer lead, a case for uniting the inner lead, a light emitting diode chip mounted on a first predetermined position of one main surface of the inner lead, and a transparent sealing material portion for sealing the light emitting diode chip and a part of the one main surface. The case seals the inner lead other than an area sealed by the transparent sealing material portion, and the inner lead of the die pad lead has bending portions at least two places including a first bending portion and a second bending portion. A rear of the first predetermined position in the inner lead of the die pad lead is exposed outside the case, and the second bending portion is formed in the case so that the outer lead extends from a side of the case.
    Type: Grant
    Filed: December 26, 2006
    Date of Patent: May 24, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Taizo Tomioka, Takahiro Suzuki, Hiroyuki Tokubo, Yukinori Aoki
  • LUMINESCENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20070145403
    Abstract: A luminescent device including a die pad lead composed of an inner lead and an outer lead, a case for uniting the inner lead, a light emitting diode chip mounted on a first predetermined position of one main surface of the inner lead, and a transparent sealing material portion for sealing the light emitting diode chip and a part of the one main surface. The case seals the inner lead other than an area sealed by the transparent sealing material portion, and the inner lead of the die pad lead has bending portions at least two places including a first bending portion and a second bending portion. A rear of the first predetermined position in the inner lead of the die pad lead is exposed outside the case, and the second bending portion is formed in the case so that the outer lead extends from a side of the case.
    Type: Application
    Filed: December 26, 2006
    Publication date: June 28, 2007
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Taizo TOMIOKA, Takahiro SUZUKI, Hiroyuki TOKUBO, Yukinori AOKI