Patents by Inventor Hiroyuki Tokudome

Hiroyuki Tokudome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor element holding apparatus and semiconductor device manufactured using the same
    Patent number: 7659132
    Abstract: A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the semiconductor element-holding surface thereof, and the protrusion is provided with a plurality of suction holes. The suction holes are opened to the semiconductor element-holding surface. The surface of the semiconductor element is held by the semiconductor element-holding surface of the protrusion of the collet.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: February 9, 2010
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Hiroyuki Tokudome
  • Semiconductor element holding apparatus and semiconductor device manufactured using the same
    Publication number: 20070205548
    Abstract: A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the semiconductor element-holding surface thereof, and the protrusion is provided with a plurality of suction holes. The suction holes are opened to the semiconductor element-holding surface. The surface of the semiconductor element is held by the semiconductor element-holding surface of the protrusion of the collet.
    Type: Application
    Filed: March 14, 2007
    Publication date: September 6, 2007
    Inventor: Hiroyuki Tokudome
  • Semiconductor element holding apparatus and semiconductor device manufactured using the same
    Patent number: 7207554
    Abstract: A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the semiconductor element-holding surface thereof, and the protrusion is provided with a plurality of suction holes. The suction holes are opened to the semiconductor element-holding surface. The surface of the semiconductor element is held by the semiconductor element-holding surface of the protrusion of the collet.
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: April 24, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Hiroyuki Tokudome
  • Semiconductor element holding apparatus and semiconductor device manufactured using the same
    Publication number: 20060049564
    Abstract: A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the semiconductor element-holding surface thereof, and the protrusion is provided with a plurality of suction holes. The suction holes are opened to the semiconductor element-holding surface. The surface of the semiconductor element is held by the semiconductor element-holding surface of the protrusion of the collet.
    Type: Application
    Filed: July 12, 2005
    Publication date: March 9, 2006
    Inventor: Hiroyuki Tokudome