Abstract: A liquid ejection apparatus includes an ejection unit including a first ejection unit having a first nozzle surface in which a first nozzle is opened, the first ejection unit being configured to eject a first liquid from the first nozzle onto a medium, and a second ejection unit having a second nozzle surface in which a second nozzle is opened, the second ejection unit being configured to eject a second liquid from the second nozzle onto a medium, the second liquid containing a component for coagulating the first liquid, a detection unit configured to detect contact between the ejection unit and a medium, and a notification unit configured to perform notification of information for prompting confirmation of the first nozzle surface and the second nozzle surface when the detection unit detects contact between the ejection unit and a medium.

Abstract: A liquid ejection device includes a liquid ejection portion including a plurality of first nozzles configured to eject a first liquid containing an inorganic pigment and a plurality of second nozzles configured to eject a second liquid not containing a substance having a hardness the same as or higher than a hardness of the inorganic pigment contained in the first liquid, and a control portion, wherein the control portion performs the cleaning such that a proportion of the inorganic pigment of the first liquid in a mixed liquid, remaining on the nozzle surface, containing the first liquid and the second liquid is smaller than a proportion of the inorganic pigment in the first liquid, and then performs wiping of the nozzle surface.

Abstract: A liquid ejecting head comprises a pressure generation chamber communicating with a nozzle opening, a vibrating wall provided as one surface of the pressure generation chamber and vibrates so that ejects the liquid from the nozzle opening, and a resin portion having a recessed arc-shape and formed in a corner of the pressure generation chamber and formed of a resin material having a Young's modulus of less than or equal to 10 GPa. A ratio r/w of a radius r of the surface of the resin portion to a width w of the pressure generation chamber defined by the vibrating wall is greater than or equal to 0.017 and less than or equal to 0.087.

Abstract: A liquid ejecting head comprises a pressure generation chamber communicating with a nozzle opening, a vibrating wall provided as one surface of the pressure generation chamber and vibrates so that ejects the liquid from the nozzle opening, and a resin portion having a recessed arc-shape and formed in a corner of the pressure generation chamber and formed of a resin material having a Young's modulus of less than or equal to 10 GPa. A ratio r/w of a radius r of the surface of the resin portion to a width w of the pressure generation chamber defined by the vibrating wall is greater than or equal to 0.017 and less than or equal to 0.087.

Abstract: A liquid ejecting head comprises a pressure generation chamber communicating with a nozzle opening, a vibrating wall provided as one surface of the pressure generation chamber and vibrates so that ejects the liquid from the nozzle opening, and a resin portion having a recessed arc-shape and formed in a corner of the pressure generation chamber and formed of a resin material having a Young's modulus of less than or equal to 10 GPa. A ratio r/w of a radius r of the surface of the resin portion to a width w of the pressure generation chamber defined by the vibrating wall is greater than or equal to 0.017 and less than or equal to 0.087.

Abstract: A liquid ejecting head comprises a pressure generation chamber communicating with a nozzle opening, a vibrating wall provided as one surface of the pressure generation chamber and vibrates so that ejects the liquid from the nozzle opening, and a resin portion having a recessed arc-shape and formed in a corner of the pressure generation chamber and formed of a resin material having a Young's modulus of less than or equal to 10 GPa. A ratio r/w of a radius r of the surface of the resin portion to a width w of the pressure generation chamber defined by the vibrating wall is greater than or equal to 0.017 and less than or equal to 0.087.

Abstract: A liquid ejecting head comprises a pressure generation chamber communicating with a nozzle opening, a vibrating wall provided as one surface of the pressure generation chamber and vibrates so that ejects the liquid from the nozzle opening, and a resin portion having a recessed arc-shape and formed in a corner of the pressure generation chamber and formed of a resin material having a Young's modulus of less than or equal to 10 GPa. A ratio r/w of a radius r of the surface of the resin portion to a width w of the pressure generation chamber defined by the vibrating wall is greater than or equal to 0.017 and less than or equal to 0.087.

Abstract: A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.

Abstract: The invention enhances reliability and achieves higher speeds for semiconductor devices with a stacked structure. A semiconductor device includes a die pad, a plurality of semiconductor chips stacked on one surface of the die pad, leads extending toward the die pad, first wires that are bonded to first pads of a first semiconductor chip among the plurality of semiconductor chips and to second pads of a second semiconductor chip among the plurality of semiconductor chips, second wires that are bonded to the leads and to the first pads or the second pads, and a sealing material that seals the plurality of semiconductor chips and exposes another surface of the die pad.

Abstract: A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.

Abstract: A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.

Abstract: The invention provides a method for forming spacers very productively. A method for manufacturing a semiconductor wafer includes forming spacers on a plurality of semiconductor chips arranged in a plane on a substrate, respectively. The steps of forming the multiple spacers are conducted collectively on the substrate.

Abstract: The invention provides semiconductor devices that are excellent in manufacturing efficiency, and provides highly reliable semiconductor devices, circuit substrates and electronic equipment. A method of manufacturing a semiconductor device in accordance with the present invention includes: providing liquid resin on a first semiconductor chip, which is mounted on a substrate having wiring patterns; mounting a second semiconductor chip over the first semiconductor chip through the liquid resin; and hardening the liquid resin to form a spacer between the first semiconductor chip and the second semiconductor chip, and to fix the first and second semiconductor chips together.

Abstract: The invention enhances reliability and achieves higher speeds for semiconductor devices with a stacked structure. A semiconductor device includes a die pad, a plurality of semiconductor chips stacked on one surface of the die pad, leads extending toward the die pad, first wires that are bonded to first pads of a first semiconductor chip among the plurality of semiconductor chips and to second pads of a second semiconductor chip among the plurality of semiconductor chips, second wires that are bonded to the leads and to the first pads or the second pads, and a sealing material that seals the plurality of semiconductor chips and exposes another surface of the die pad.

Abstract: The invention realizes preferential routing of wires. A semiconductor device includes leads, a plurality of semiconductor chips stacked in layers, first wires that electrically connect a first semiconductor chip among the plurality of semiconductor chips to the leads, second wires that electrically connect a second semiconductor chip stacked on the first semiconductor chip among the plurality of semiconductor chips to the leads, and first and second bent sections formed in the second wires, each having a curvature greater than other parts thereof. The second wires extend toward the first bent section above the leads, upwardly diagonally extend from the first bent section toward the second semiconductor chip, and downwardly extend from the second bent section to electrically connect to the second semiconductor chip.

Abstract: The invention enhances reliability and achieves higher speeds for semiconductor devices with a stacked structure. A semiconductor device includes a die pad, a plurality of semiconductor chips stacked on one surface of the die pad, leads extending toward the die pad, first wires that are bonded to first pads of a first semiconductor chip among the plurality of semiconductor chips and to second pads of a second semiconductor chip among the plurality of semiconductor chips, second wires that are bonded to the leads and to the first pads or the second pads, and a sealing material that seals the plurality of semiconductor chips and exposes another surface of the die pad.

Abstract: The invention realizes preferential routing of wires. A semiconductor device includes leads, a plurality of semiconductor chips stacked in layers, first wires that electrically connect a first semiconductor chip among the plurality of semiconductor chips to the leads, second wires that electrically connect a second semiconductor chip stacked on the first semiconductor chip among the plurality of semiconductor chips to the leads, and first and second bent sections formed in the second wires, each having a curvature greater than other parts thereof. The second wires extend toward the first bent section above the leads, upwardly diagonally extend from the first bent section toward the second semiconductor chip, and downwardly extend from the second bent section to electrically connect to the second semiconductor chip.

Abstract: The invention provides a method for forming spacers very productively. A method for manufacturing a semiconductor wafer includes forming spacers on a plurality of semiconductor chips arranged in a plane on a substrate, respectively. The steps of forming the multiple spacers are conducted collectively on the substrate.

Abstract: A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.

Abstract: The invention enhances reliability and achieves higher speeds for semiconductor devices with a stacked structure. A semiconductor device includes a die pad, a plurality of semiconductor chips stacked on one surface of the die pad, leads extending toward the die pad, first wires that are bonded to first pads of a first semiconductor chip among the plurality of semiconductor chips and to second pads of a second semiconductor chip among the plurality of semiconductor chips, second wires that are bonded to the leads and to the first pads or the second pads, and a sealing material that seals the plurality of semiconductor chips and exposes another surface of the die pad.