Patents by Inventor Hiroyuki Tsukui

Hiroyuki Tsukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10899153
    Abstract: The content of compound(s) having a molecular weight of 650-670, typically a molecular weight of 660, as measured by mass spectrometry, is reduced to 0.5 mass % or less in a heat-sensitive recording material comprising 3,3?-diallyl-4,4?-dihydroxy diphenylsulfone, or in a diphenylsulfone or a color-developing agent. Provided is, thereby, a heat-sensitive recording material, a color-developing agent, or a diphenylsulfone which cause less background fogging under moisture and heat conditions and which has excellent preservation stability of a colored image.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: January 26, 2021
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Tsunetoshi Egusa, Takashi Fujii, Hiroyuki Tsukui, Takaaki Kurata
  • Publication number: 20180312465
    Abstract: The content of compound(s) having a molecular weight of 650-670, typically a molecular weight of 660, as measured by mass spectrometry, is reduced to 0.5 mass % or less in a heat-sensitive recording material comprising 3,3?-diallyl-4,4?-dihydroxy diphenylsulfone, or in a diphenylsulfone or a color-developing agent. Provided is, thereby, a heat-sensitive recording material, a color-developing agent, or a diphenylsulfone which cause less background fogging under moisture and heat conditions and which has excellent preservation stability of a colored image.
    Type: Application
    Filed: November 15, 2016
    Publication date: November 1, 2018
    Inventors: Tsunetoshi Egusa, Takashi Fujii, Hiroyuki Tsukui, Takaaki Kurata
  • Publication number: 20160143740
    Abstract: To provide an artificial annulus sizing tool capable of determining a suitable size for an artificial annulus to be implanted in a patient. [Solution] An artificial annulus sizing tool comprising an annular core material and a cover material covering the core material to a predetermined thickness, the cover material portion being attached to the annulus using suturing thread for implanting artificial annuli, and the part of the cover material engaged with the suturing thread being broken after a suitable artificial annulus size is determined for the annulus, allowing for removal from the suturing thread.
    Type: Application
    Filed: March 7, 2014
    Publication date: May 26, 2016
    Inventors: Hiroyuki TSUKUI, Young-Kwang PARK, Naohiko KANEMITSU
  • Patent number: 7585361
    Abstract: The present invention relates to a porphyrazine coloring matter represented by the following formula (1): (wherein, A, B, C and D independently represents a 6-membered ring having aromaticity, at least one or more is a benzene ring, at least one or more contains a nitrogen-containing heteroaromatic ring; in addition, E represents alkylene and each of X and Y independently represents a substituted or unsubstituted anilino group or a substituted or unsubstituted naphthylamino group; and b is 0 to 2.9, c is 0.1 to 3 and the sum of b and c is 1 to 3) which has a good hue as a cyan ink, is excellent in light fastness, ozone fastness and moisture fastness, and does not cause bronze phenomenon, as well as is thus suitable for inkjet recording.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: September 8, 2009
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Takashi Yoneda, Yoshiaki Kawaida, Hiroyuki Tsukui, Takafumi Fujii
  • Publication number: 20090151599
    Abstract: The present invention relates to a porphyrazine coloring matter represented by the following formula (1): (wherein, A, B, C and D independently represents a 6-membered ring having aromaticity, at least one or more is a benzene ring, at least one or more contains a nitrogen-containing heteroaromatic ring; in addition, E represents alkylene and each of X and Y independently represents a substituted or unsubstituted anilino group or a substituted or unsubstituted naphthylamino group; and b is 0 to 2.9, c is 0.1 to 3 and the sum of b and c is 1 to 3) which has a good hue as a cyan ink, is excellent in light fastness, ozone fastness and moisture fastness, and does not cause bronze phenomenon, as well as is thus suitable for inkjet recording.
    Type: Application
    Filed: April 5, 2007
    Publication date: June 18, 2009
    Inventors: Takafumi Fujii, Takashi Yoneda, Yoshiaki Kawaida, Hiroyuki Tsukui
  • Publication number: 20020177295
    Abstract: A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.
    Type: Application
    Filed: July 9, 2002
    Publication date: November 28, 2002
    Applicant: NEC Corporation
    Inventors: Hiroyuki Tsukui, Chikara Yamashita, Tetsuya Tao
  • Publication number: 20020173135
    Abstract: A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.
    Type: Application
    Filed: July 9, 2002
    Publication date: November 21, 2002
    Applicant: NEC Corporation
    Inventors: Hiroyuki Tsukui, Chikara Yamashita, Tetsuya Tao
  • Publication number: 20020173136
    Abstract: A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.
    Type: Application
    Filed: July 9, 2002
    Publication date: November 21, 2002
    Applicant: NEC Corporation
    Inventors: Hiroyuki Tsukui, Chikara Yamashita, Tetsuya Tao
  • Patent number: 6432807
    Abstract: A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: August 13, 2002
    Assignee: NEC Corporation
    Inventors: Hiroyuki Tsukui, Chikara Yamashita, Tetsuya Tao