Abstract: Disclosed is a polyimide laminate wherein a thermoplastic polyimide layer is formed on at least one side of a highly heat resistant polyimide layer. This polyimide laminate is characterized in that the highly heat-resistant polyimide layer contains molecules of a polyimide having a reactive functional group, and the thermoplastic polyimide layer contains molecules of a thermoplastic polyimide having a reactive functional group which is capable of forming at least one bond selected from an imide bond, amide bond and benzimidazole bond with the reactive functional group of the polyimide of contained in the highly heat-resistant polyimide layer. By having such an arrangement, the polyimide laminate is improved in the adhesion strength between the polyimides.