Patents by Inventor Hiroyuki Uchiumi

Hiroyuki Uchiumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminated tube container
    Patent number: 5612106
    Abstract: A laminated tube container has the body comprising a sheet material comprising a substrate, a silicon oxide deposited layer, a heat buffer layer and an extruded coating layer of a thermoadhesive resin which are successively formed in a laminate. The heat buffer layer prevents cracks from being produced in the silicon oxide deposited layer by the heat coming when the extruded coating layer of a thermoadhesive resin is laminated. The heat buffer layer is preferably formed by dry lamination or non-solvent lamination which requires no heating. An anchor coat layer may optionally be provided between the heat buffer layer and the extruded coating layer of a thermoadhesive resin so that the adhesion strength between these layers can be improved.
    Type: Grant
    Filed: May 16, 1995
    Date of Patent: March 18, 1997
    Assignees: Toppan Printing Co, Ltd., Lion Corporation
    Inventors: Yuji Komiya, Hiroyuki Uchiumi, Shintaro Ohashi, Akio Kuboniwa
  • Laminated tube container
    Patent number: 5232755
    Abstract: A laminated tube container has the body comprising a sheet material comprising a substrate, a silicon oxide deposited layer, a heat buffer layer and an extruded coating layer of a thermoadhesive resin which are successively formed in a laminate. The heat buffer layer prevents cracks from being produced in the silicon oxide deposited layer by the heat coming when the extruded coating layer of a thermoadhesive resin is laminated. The heat buffer layer is preferably formed by dry lamination or non-solvent lamination which requires no heating. An anchor coat layer may optionally be provided between the heat buffer layer and the extruded coating layer of a thermoadhesive resin so that the adhesion strength between these layers can be improved.
    Type: Grant
    Filed: September 11, 1991
    Date of Patent: August 3, 1993
    Assignees: Toppan Printing Co., Ltd., Lion Corporation
    Inventors: Yuji Komiya, Hiroyuki Uchiumi, Shintaro Ohashi, Akio Kuboniwa