Patents by Inventor Hiroyuki Wakasa

Hiroyuki Wakasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7255918
    Abstract: A coated paper sheet provided with a coating layer formed on a paper sheet substrate and containing a pigment and a binder and optionally a pre-coated polyacrylamide-containing anionic acrylic resin layer formed between the substrate and coating layer, and having a 75° specular gloss of 70% or more, an air permeability of 4000 seconds or less, a Clark stiffness, in terms of critical strength L, of 12 cm or more in a cross direction and an internal bond strength of 200 mJ or more, exhibits high resistance to blistering, excellent printer-passing property, and high quality image-recording property and useful for both of offset printing and electrophotographic duplicating or printing.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: August 14, 2007
    Assignee: Oji Paper Co., Ltd.
    Inventors: Harumi Watanabe, Atsushi Myojo, Hiroyuki Wakasa, Osamu Kitao
  • Publication number: 20040001963
    Abstract: A coated paper sheet provided with a coating layer formed on a paper sheet substrate and containing a pigment and a binder and optionally a pre-coated polyacrylamide-containing anionic acrylic resin layer formed between the substrate and coating layer, and having a 75° specular gloss of 70% or more, an air permeability of 4000 seconds or less, a Clark stiffness, in terms of critical strength L, of 12 cm or more in a cross direction and an internal bond strength of 200 mJ or more, exhibits high resistance to blistering, excellent printer-passing property, and high quality image-recording property and useful for both of offset printing and electrophotographic duplicating or printing.
    Type: Application
    Filed: June 5, 2003
    Publication date: January 1, 2004
    Applicant: OJI PAPER CO., LTD.
    Inventors: Harumi Watanabe, Atsushi Myojo, Hiroyuki Wakasa, Osamu Kitao
  • Patent number: 4677530
    Abstract: In a printed circuit board having land parts provided for connecting electric circuit forming elements and conductors interconnecting the elements. The conductors interconnect the land parts without the use of intercrossed connection wires over the conductors between the land parts.
    Type: Grant
    Filed: September 30, 1985
    Date of Patent: June 30, 1987
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toshiharu Mamiya, Hiroyuki Wakasa