Patents by Inventor Hiroyuki Wakui
Hiroyuki Wakui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11970802Abstract: The present invention provides a network structure having excellent repeated compression durability, the network structure having a low repeated compression residual strain and a high hardness retention after repeated compression. A network structure comprising a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure including a polyester-based thermoplastic elastomer and having a fineness of not less than 100 dtex and not more than 60000 dtex, and by making each loop mutually contact in a molten state, wherein the network structure has an apparent density of 0.005 g/cm3 to 0.20 g/cm3, a 50%-constant displacement repeated compression residual strain of not more than 15%, and a 50%-compression hardness retention of not less than 85% after 50%-constant displacement repeated compression.Type: GrantFiled: July 1, 2020Date of Patent: April 30, 2024Assignee: TOYOBO CO., LTD.Inventors: Teruyuki Taninaka, Shinichi Kobuchi, Hiroyuki Wakui
-
Publication number: 20230312852Abstract: Provided is a layered body including glass and a polyamic acid heat-cured product that is readily releasable from an inorganic substrate after being heated at 250° C. A layered body including an inorganic substrate and a polyamic acid heat-cured product, the layered body being characterized by a weight average molecular weight of 30,000 or greater for the polyamic acid, and a peel strength of 0.3 N/cm or weaker between the polyamic acid heat-cured product layer and the inorganic substrate, after the layered body has been heated at 250° C.Type: ApplicationFiled: August 10, 2021Publication date: October 5, 2023Applicant: TOYOBO CO., LTD.Inventors: Kaya TOKUDA, Tetsuo OKUYAMA, Naoki WATANABE, Hiroyuki WAKUI, Harumi YONEMUSHI, Denichirou MIZUGUCHI
-
Publication number: 20230211584Abstract: Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 µm.Type: ApplicationFiled: May 25, 2021Publication date: July 6, 2023Applicant: TOYOBO CO., LTD.Inventors: Tetsuo OKUYAMA, Makoto NAKAMURA, Denichirou MIZUGUCHI, Harumi YONEMUSHI, Hiroyuki WAKUI, Kaya TOKUDA
-
Publication number: 20230173800Abstract: The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant transparent film which has sufficient heat resistance and is able to be mechanically separated from the inorganic substrate after being subjected to various processes on the inorganic substrate since the adhesion between the highly heat-resistant transparent film and the inorganic substance is adequately weak. A multilayer body of a highly heat-resistant transparent film and an inorganic substrate, wherein: an adhesive is not substantially used; the peel strength between the highly heat-resistant transparent film and the inorganic substrate is 0.3 N/cm or less; and the CTE of the highly heat-resistant transparent film is 50 ppm/K or less.Type: ApplicationFiled: May 25, 2021Publication date: June 8, 2023Applicant: TOYOBO CO., LTD.Inventors: Tetsuo OKUYAMA, Makoto NAKAMURA, Denichirou MIZUGUCHI, Harumi YONEMUSHI, Hiroyuki WAKUI, Kaya TOKUDA
-
LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE
Publication number: 20220282052Abstract: The purpose is to provide a laminate useful as a temporary support for producing a large-area, high-definition flexible electronic device, the laminate having stably low adhesive strength between a colorless and highly transparent polyimide film and an inorganic substrate even in the case of a large surface area and having few blister defects. The laminate that attains the purpose is obtained by initially wetting either one of an inorganic substrate coated with the silane coupling agent and a colorless polyimide film with an aqueous medium, and then laminating while pressing out the aqueous medium.Type: ApplicationFiled: September 30, 2020Publication date: September 8, 2022Applicant: TOYOBO CO., LTD.Inventors: Naoki WATANABE, Harumi YONEMUSHI, Kousuke SASAI (deceased), Hiroyuki WAKUI -
Patent number: 11168421Abstract: [Problem] The objective of the present invention is to provide an elastic mesh structure having exceptional cushioning and reducing noise during compression or recovery. [Solution] A mesh structure comprising a three-dimensional, random-loop, joining structure formed by winding a continuous line of thermoplastic resin to form random loops, bringing the loops into contact with one another in a molten state, and fusing the majority of the contact area, wherein (a) the apparent density of the random-loop contact structure is 0.005-0.200 g/cm3, and (b) the number of contact points per unit weight of the random-loop contact structure is 500-1200/g.Type: GrantFiled: May 7, 2013Date of Patent: November 9, 2021Assignee: TOYOBO CO., LTD.Inventors: Hiroyuki Wakui, Masahiko Nakamori
-
Patent number: 10934644Abstract: To provide a net-like structure having excellent low resilience characteristics, cushioning properties, and durability. The net-like structure has a three-dimensional random loop bonded structure constituted of a continuous linear body made of a thermoplastic elastomer having a fiber diameter of 0.1-3.0 mm and a styrene content of 10-40 mass %, the net-like structure having an apparent density of 0.005-0.30 g/cm3 and a 40° C. compression residual strain of less than or equal to 35%.Type: GrantFiled: February 2, 2016Date of Patent: March 2, 2021Assignee: TOYOBO CO., LTD.Inventors: Teruyuki Taninaka, Takahiro Kuramoto, Shinichi Kobuchi, Hiroyuki Wakui, Tatsushi Okamoto, Akifumi Yasui
-
Publication number: 20200332445Abstract: The present invention provides a network structure having excellent repeated compression durability, the network structure having a low repeated compression residual strain and a high hardness retention after repeated compression. A network structure comprising a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure including a polyester-based thermoplastic elastomer and having a fineness of not less than 100 dtex and not more than 60000 dtex, and by making each loop mutually contact in a molten state, wherein the network structure has an apparent density of 0.005 g/cm3 to 0.20 g/cm3, a 50%-constant displacement repeated compression residual strain of not more than 15%, and a 50%-compression hardness retention of not less than 85% after 50%-constant displacement repeated compression.Type: ApplicationFiled: July 1, 2020Publication date: October 22, 2020Applicant: TOYOBO CO., LTD.Inventors: Teruyuki Taninaka, Shinichi Kobuchi, Hiroyuki Wakui
-
Patent number: 10316444Abstract: The present invention provides an elastic network structure that has excellent cushioning properties and makes less sound when it is compressed and recovers its shape. A network structure including a three-dimensional random loop bonded structure obtained by forming random loops by curling treatment of a continuous linear structure comprising a thermoplastic resin, and by making each loop mutually contact in a molten state to weld the majority of contacted parts, wherein (a) the continuous linear structure is a hollow cross section, (b) the degree of hollowness of the hollow cross section is not less than 10% and not more than 50%, (c) the fiber diameter of the continuous linear structure is not less than 0.10 mm and not more than 0.65 mm, and (d) the number of bonded points per unit weight of the random loop bonded structure is not less than 200/g and less than 500/g.Type: GrantFiled: October 27, 2014Date of Patent: June 11, 2019Assignee: TOYOBO CO., LTD.Inventors: Hiroyuki Wakui, Shinichi Kobuchi, Teruyuki Taninaka
-
Publication number: 20180282924Abstract: A net-like structure has a three-dimensional random loop bonded structure constituted of a thermoplastic elastomer continuous linear body having a fiber size of greater than or equal to 0.1 mm and less than or equal to 3.0 mm. The net-like structure has, in the thickness direction, a solid-section fiber main region mainly including solid-section fibers, a hollow-section fiber main region mainly including hollow-section fibers, and a mixed region including solid-section fibers and hollow-section fibers in a mixed state, located between the solid-section fiber main region and the hollow-section fiber main region. Both solid-section fiber main region-side residual strain of the net-like structure and hollow-section fiber main region-side residual strain of the net-like structure are less than or equal to 20%, and the difference between the solid-section fiber main region-side residual strain and the hollow-section fiber main region-side residual strain is less than or equal to 10 points.Type: ApplicationFiled: April 28, 2016Publication date: October 4, 2018Applicant: TOYOBO CO., LTD.Inventors: Shinichi Kobuchi, Teruyuki Taninaka, Hiroyuki Wakui, Takahiro Kuramoto, Noriki Fukunishi, Takuo Inoue, Akifumi Yasui
-
Publication number: 20180237968Abstract: To provide a net-like structure having excellent low resilience characteristics, cushioning properties, and durability. The net-like structure has a three-dimensional random loop bonded structure constituted of a continuous linear body made of a thermoplastic elastomer having a fiber diameter of 0.1-3.0 mm and a styrene content of 10-40 mass %, the net-like structure having an apparent density of 0.005-0.30 g/cm3 and a 40° C. compression residual strain of less than or equal to 35%.Type: ApplicationFiled: February 2, 2016Publication date: August 23, 2018Applicant: TOYOBO CO., LTD.Inventors: Teruyuki Taninaka, Takahiro Kuramoto, Shinichi Kobuchi, Hiroyuki Wakui, Tatsushi Okamoto, Akifumi Yasui
-
Publication number: 20180177306Abstract: A net-like structure of the present invention is one having a three-dimensional random loop bonded structure constituted of a thermoplastic elastomer continuous linear body, wherein the net-like structure has, in a thickness direction thereof, a thin fiber main region, a thick fiber main and a mixed region that is located between the thin fiber main region and the thick fiber main region and includes the thin fibers and the thick fibers in a mixed state, the fiber size of the thick fibers is greater than that of the thin fibers by greater than or equal to 0.07 mm, and the residual strain after 750 N constant load repeated compression at pressurization from the side of the thin fiber main region of the net-like structure is less than or equal to 15%.Type: ApplicationFiled: April 28, 2016Publication date: June 28, 2018Applicant: TOYOBO CO., LTD.Inventors: Shinichi Kobuchi, Teruyuki Taninaka, Hiroyuki Wakui, Takahiro Kuramoto, Noriki Fukunishi, Takuo Inoue, Yasushi Yamada
-
Patent number: 9970140Abstract: The present invention provides a network structure having excellent repeated compression durability, a low repeated compression residual strain and a high hardness retention after repeated compression. A network structure made of a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure including at least one thermoplastic elastic resin selected from the group consisting of a polyolefin-based thermoplastic elastomer, an ethylene-vinyl acetate copolymer, a polyurethane-based thermoplastic elastomer and a polyamide-based thermoplastic elastomer, the continuous linear structure having a fineness of not less than 100 dtex and not more than 60000 dtex, and by making each loop mutually contact in a molten state, wherein The network structure has an apparent density of 0.005 g/cm3 to 0.Type: GrantFiled: September 30, 2014Date of Patent: May 15, 2018Assignee: TOYOBO CO., LTD.Inventors: Teruyuki Taninaka, Shinichi Kobuchi, Hiroyuki Wakui
-
Patent number: 9938649Abstract: A network structure is disclosed including a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure including at least one thermoplastic elastomer selected from a polyester-based thermoplastic elastomer, a polyolefin-based thermoplastic elastomer, and an ethylene-vinyl acetate copolymer, and by making each loop mutually contact in a molten state, wherein a fiber diameter of the continuous linear structure is not less than 0.1 mm and not more than 3.0 mm, a fiber diameter of a surface layer portion of the network structure is not less than 1.05 times of a fiber diameter of an inner layer portion thereof, an apparent density is not less than 0.01 g/cm3 and not more than 0.20 g/cm3, 750 N-constant load repeated compression residual strain is not more than 15%, and 40%-compression hardness retention after 750 N-constant load repeated compression is not less than 55%.Type: GrantFiled: October 28, 2014Date of Patent: April 10, 2018Assignee: TOYOBO CO., LTD.Inventors: Teruyuki Taninaka, Shinichi Kobuchi, Hiroyuki Wakui
-
Publication number: 20160251789Abstract: A network structure is disclosed including a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure including at least one thermoplastic elastomer selected from a polyester-based thermoplastic elastomer, a polyolefin-based thermoplastic elastomer, and an ethylene-vinyl acetate copolymer, and by making each loop mutually contact in a molten state, wherein a fiber diameter of the continuous linear structure is not less than 0.1 mm and not more than 3.0 mm, a fiber diameter of a surface layer portion of the network structure is not less than 1.05 times of a fiber diameter of an inner layer portion thereof, an apparent density is not less than 0.01 g/cm3 and not more than 0.20 g/cm3, 750 N-constant load repeated compression residual strain is not more than 15%, and 40%-compression hardness retention after 750 N-constant load repeated compression is not less than 55%.Type: ApplicationFiled: October 28, 2014Publication date: September 1, 2016Applicant: TOYOBO CO., LTD.Inventors: Teruyuki Taninaka, Shinichi Kobuchi, Hiroyuki Wakui
-
Publication number: 20160251790Abstract: The present invention provides an elastic network structure that has excellent cushioning properties and makes less sound when it is compressed and recovers its shape. A network structure including a three-dimensional random loop bonded structure obtained by forming random loops by curling treatment of a continuous linear structure comprising a thermoplastic resin, and by making each loop mutually contact in a molten state to weld the majority of contacted parts, wherein (a) the continuous linear structure is a hollow cross section, (b) the degree of hollowness of the hollow cross section is not less than 10% and not more than 50%, (c) the fiber diameter of the continuous linear structure is not less than 0.10 mm and not more than 0.65 mm, and (d) the number of bonded points per unit weight of the random loop bonded structure is not less than 200/g and less than 500/g.Type: ApplicationFiled: October 27, 2014Publication date: September 1, 2016Applicant: TOYOBO CO., LTD.Inventors: Hiroyuki Wakui, Shinichi Kobuchi, Teruyuki Taninaka
-
Publication number: 20160237603Abstract: The present invention provides a network structure having excellent repeated compression durability, a low repeated compression residual strain and a high hardness retention after repeated compression. A network structure made of a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure including at least one thermoplastic elastic resin selected from the group consisting of a polyolefin-based thermoplastic elastomer, an ethylene-vinyl acetate copolymer, a polyurethane-based thermoplastic elastomer and a polyamide-based thermoplastic elastomer, the continuous linear structure having a fineness of not less than 100 dtex and not more than 60000 dtex, and by making each loop mutually contact in a molten state, wherein The network structure has an apparent density of 0.005 g/cm3 to 0.Type: ApplicationFiled: September 30, 2014Publication date: August 18, 2016Applicant: TOYOBO CO., LTD.Inventors: Teruyuki TANINAKA, Shinichi KOBUCHI, Hiroyuki WAKUI
-
Publication number: 20160010250Abstract: The present invention provides a network structure having excellent repeated compression durability, the network structure having a low repeated compression residual strain and a high hardness retention after repeated compression. A network structure comprising a three-dimensional random loop bonded structure obtained by forming random loops with curling treatment of a continuous linear structure including a polyester-based thermoplastic elastomer and having a fineness of not less than 100 dtex and not more than 60000 dtex, and by making each loop mutually contact in a molten state, wherein the network structure has an apparent density of 0.005 g/cm3 to 0.20 g/cm3, a 50%-constant displacement repeated compression residual strain of not more than 15%, and a 50%-compression hardness retention of not less than 85% after 50%-constant displacement repeated compression.Type: ApplicationFiled: October 21, 2013Publication date: January 14, 2016Applicant: TOYOBO CO., LTD.Inventors: Teruyuki Taninaka, Shinichi Kobuchi, Hiroyuki Wakui
-
Publication number: 20150087196Abstract: [Problem] The objective of the present invention is to provide an elastic mesh structure having exceptional cushioning and reducing noise during compression or recovery. [Solution] A mesh structure comprising a three-dimensional, random-loop, joining structure formed by winding a continuous line of thermoplastic resin to form random loops, bringing the loops into contact with one another in a molten state, and fusing the majority of the contact area, wherein (a) the apparent density of the random-loop contact structure is 0.005-0.200 g/cm3, and (b) the number of contact points per unit weight of the random-loop contact structure is 500-1200/g.Type: ApplicationFiled: May 7, 2013Publication date: March 26, 2015Inventors: Hiroyuki Wakui, Masahiko Nakamori