Patents by Inventor Hiroyuki Yabuta

Hiroyuki Yabuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8187683
    Abstract: An object of the present invention is to provide a multilayered polyamide-based tube for food packaging that is free from blocking in a Layer (C), and that has an excellent adherence to processed meat or like packaged food. The present invention provides a multilayered polyamide-based tube for food packaging comprising a Layer (A), a Layer (B) and a Layer (C); the multilayered polyamide-based tube having a low-temperature shrinkage ratio of 2 to 10%, and exhibiting heat shrinkage properties and gas barrier properties; the Layer (A) containing a polyamide-based resin; the Layer (B) containing a polyolefin-based resin; and the Layer (C) that comes in contact with the packaged food, the Layer (C) being a Layer (C-1) that contains a polypropylene-based resin having a heat distortion temperature (ISO 75B-1 or ISO 75B-2) of not less than 60° C. and a Vicat softening point of not less than 120° C.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: May 29, 2012
    Assignee: Gunze Limited
    Inventors: Hiroki Kuriu, Hiroyuki Yabuta
  • Publication number: 20110027511
    Abstract: An object of the present invention is to provide a multilayered polyamide-based tube for food packaging that is free from blocking in a Layer (C), and that has an excellent adherence to processed meat or like packaged food. The present invention provides a multilayered polyamide-based tube for food packaging comprising a Layer (A), a Layer (B) and a Layer (C); the multilayered polyamide-based tube having a low-temperature shrinkage ratio of 2 to 10%, and exhibiting heat shrinkage properties and gas barrier properties; the Layer (A) containing a polyamide-based resin; the Layer (B) containing a polyolefin-based resin; and the Layer (C) that comes in contact with the packaged food, the Layer (C) being a Layer (C-1) that contains a polypropylene-based resin having a heat distortion temperature (ISO 75B-1 or ISO 75B-2) of not less than 60° C. and a Vicat softening point of not less than 120° C.
    Type: Application
    Filed: March 26, 2009
    Publication date: February 3, 2011
    Applicant: GUNZE LIMITED
    Inventors: Hiroki Kuriu, Hiroyuki Yabuta
  • Publication number: 20040247753
    Abstract: The present invention relates to a multilayered film for food packaging, wherein an intermediate layer comprising polyamide blended with a polyolefin masterbatch is sandwiched between an inner layer comprising polyamide and an outer layer comprising polyamide.
    Type: Application
    Filed: March 25, 2004
    Publication date: December 9, 2004
    Inventor: Hiroyuki Yabuta