Patents by Inventor Hiroyuki Yagyu
Hiroyuki Yagyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9325386Abstract: Coil units equipped with primary coils having the same specification are provided in a power feeding module. Coil-unit intermeshing recess sections are formed on a printed circuit board to match each of the coil units. Pads for joining together with electrodes formed on the coil units are formed on the bottom faces of each of the coil-unit intermeshing recess sections. A plurality of coil units can be mounted onto the printed circuit board easily, by fitting each of the coil units into each of the coil-unit intermeshing recess sections and joining them together, which will enable manufacturing efficiency to be improved.Type: GrantFiled: January 11, 2012Date of Patent: April 26, 2016Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Hideaki Abe, Hiroyuki Yagyu, Wataru Tanaka, Shinichi Abe
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Patent number: 8768122Abstract: Disclosed is an optical module which improves optical coupling efficiency either when configured to receive an optical signal from an optical fiber with a light receiving element or when configured to receive an optical signal from a light emitting element with an optical fiber. The optical module includes: a substrate (1) having in the surface thereof a first groove (1a) and a second groove (1b) formed, with this second groove (1b) being configured to have a substantially V-shaped cross section formed deeper than the first groove and being formed in continuation from the first groove; and an internal waveguide (16) provided within the first groove (1a) of the substrate (1).Type: GrantFiled: February 23, 2011Date of Patent: July 1, 2014Assignee: Panasonic CorporationInventors: Tadahiro Yamaji, Nobuyuki Asashi, Hiroyuki Yagyu, Yutaka Kinugasa, Takuya Matsumoto, Tsutomu Niiho
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Patent number: 8575529Abstract: To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.Type: GrantFiled: August 8, 2007Date of Patent: November 5, 2013Assignee: Panasonic CorporationInventors: Nobuyuki Asahi, Makoto Nishimura, Hiroyuki Yagyu, Yutaka Kinugasa, Takuya Matsumoto
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Publication number: 20130175877Abstract: Coil units equipped with primary coils having the same specification are provided in a power feeding module. Coil-unit intermeshing recess sections are formed on a printed circuit board to match each of the coil units. Pads for joining together with electrodes formed on the coil units are formed on the bottom faces of each of the coil-unit intermeshing recess sections. A plurality of coil units can be mounted onto the printed circuit board easily, by fitting each of the coil units into each of the coil-unit intermeshing recess sections and joining them together, which will enable manufacturing efficiency to be improved.Type: ApplicationFiled: January 11, 2012Publication date: July 11, 2013Applicant: PANASONIC CORPORATIONInventors: Hideaki Abe, Hiroyuki Yagyu, Wataru Tanaka, Shinichi Abe
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Patent number: 8391657Abstract: An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate) and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.Type: GrantFiled: June 26, 2008Date of Patent: March 5, 2013Assignee: Panasonic CorporationInventors: Nobuyuki Asahi, Makoto Nisimura, Nobuyuki Miyagawa, Hiroyuki Yagyu, Yuichi Uchida, Yutaka Kinugasa, Tadahiro Yamaji, Takuya Matsumoto
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Publication number: 20120321250Abstract: Disclosed is an optical module which improves optical coupling efficiency either when configured to receive an optical signal from an optical fiber with a light receiving element or when configured to receive an optical signal from a light emitting element with an optical fiber. The optical module includes: a substrate (1) having in the surface thereof a first groove (1a) and a second groove (1b) formed, with this second groove (1b) being configured to have a substantially V-shaped cross section formed deeper than the first groove and being formed in continuation from the first groove; and an internal waveguide (16) provided within the first groove (1a) of the substrate (1).Type: ApplicationFiled: February 23, 2011Publication date: December 20, 2012Applicant: PANASONIC CORPORATIONInventors: Tadahiro Yamaji, Nobuyuki Asashi, Hiroyuki Yagyu, Yutaka Kinugasa, Takuya Matsumoto, Tsutomu Niiho
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Patent number: 8073295Abstract: A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.Type: GrantFiled: April 12, 2007Date of Patent: December 6, 2011Assignee: Panasonic Electric Works Co., Ltd.Inventors: Tooru Nakashiba, Kouhei Kotera, Tomoaki Matsushima, Yukio Matsushita, Hideo Nakanishi, Shinji Hashimoto, Tomoaki Nemoto, Hiroyuki Yagyu, Yuuki Kasai
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Patent number: 7989148Abstract: In a method for forming a photoelectric composite board (10) on which a photoelectric transducer (5) is mounted, photo-masks (111, 112, 113) which are used in processes to form the photoelectric composite board (10) are respectively disposed on the basis of a reference mark (33) previously formed on a metal thin film (101). In addition, openings (22) are formed on solder resist layers (8) by irradiating laser beams at positions defined on the basis of a reference point (4a) defined above a light deflector (4) formed on an end of a light guide (3).Type: GrantFiled: October 19, 2007Date of Patent: August 2, 2011Assignee: Panasonic Electric Works Co., Ltd.Inventors: Tooru Nakashiba, Hiroyuki Yagyu, Shinji Hashimoto, Yuuki Kasai
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Patent number: 7967663Abstract: A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.Type: GrantFiled: June 5, 2009Date of Patent: June 28, 2011Assignee: Panasonic Electric Works Co., Ltd.Inventors: Hiroyuki Yagyu, Tooru Nakashiba, Shinji Hashimoto
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Publication number: 20100220957Abstract: An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.Type: ApplicationFiled: June 26, 2008Publication date: September 2, 2010Applicant: PANASONIC ELECTRIC WORKS CO., LTD.Inventors: Nobuyuki Asahi, Makoto Nisimura, Nobuyuki Miyagawa, Hiroyuki Yagyu, Yuichi Uchida, Yutaka Kinugasa, Tadahiro Yamaji, Takuya Matsumoto
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Publication number: 20100171023Abstract: To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.Type: ApplicationFiled: August 8, 2007Publication date: July 8, 2010Applicant: PANASONIC ELECTRIC WORKS, CO., LTD.Inventors: Nobuyuki Asahi, Makoto Nishimura, Hiroyuki Yagyu, Yutaka Kinugasa, Takuya Matsumoto
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Publication number: 20090238963Abstract: A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.Type: ApplicationFiled: June 5, 2009Publication date: September 24, 2009Inventors: Hiroyuki Yagyu, Tooru Nakashiba, Shinji Hashimoto
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Patent number: 7553215Abstract: A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.Type: GrantFiled: August 24, 2007Date of Patent: June 30, 2009Assignee: Panasonic Electric Works Co, Ltd.Inventors: Hiroyuki Yagyu, Tooru Nakashiba, Shinji Hashimoto
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Publication number: 20090104565Abstract: In a method for forming a photoelectric composite board (10) on which a photoelectric transducer (5) is mounted, photo-masks (111, 112, 113) which are used in processes to form the photoelectric composite board (10) are respectively disposed on the basis of a reference mark (33) previously formed on a metal thin film (101). In addition, openings (22) are formed on solder resist layers (8) by irradiating laser beams at positions defined on the basis of a reference point (4a) defined above a light deflector (4) formed on an end of a light guide (3).Type: ApplicationFiled: October 19, 2007Publication date: April 23, 2009Applicant: MATSUSHITA ELECTRIC WORKS, LTD.Inventors: Tooru NAKASHIBA, Hiroyuki YAGYU, Shinji HASHIMOTO, Yuuki KASAI
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Publication number: 20090049964Abstract: A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.Type: ApplicationFiled: August 24, 2007Publication date: February 26, 2009Applicant: MATSUSHITA ELECTRIC WORKS, LTD.Inventors: Hiroyuki Yagyu, Tooru Nakashiba, Shinji Hashimoto
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Publication number: 20080113168Abstract: A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.Type: ApplicationFiled: December 14, 2007Publication date: May 15, 2008Applicant: Matsushita Electric Works, Ltd.Inventors: Tooru Nakashiba, Kouhei Kotera, Tomoaki Matsushima, Yukio Matsushita, Hideo Nakanishi, Shinji Hashimoto, Tomoaki Nemoto, Hiroyuki Yagyu, Yuuki Kasai
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Publication number: 20080107881Abstract: A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.Type: ApplicationFiled: December 14, 2007Publication date: May 8, 2008Applicant: Matsushita Electric Works, Ltd.Inventors: Tooru Nakashiba, Kouhei Kotera, Tomoaki Matsushima, Yukio Matsushita, Hideo Nakanishi, Shinji Hashimoto, Tomoaki Nemoto, Hiroyuki Yagyu, Yuuki Kasai
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Patent number: 7330612Abstract: A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.Type: GrantFiled: May 27, 2003Date of Patent: February 12, 2008Assignee: Matsushita Electric Works, Ltd.Inventors: Tooru Nakashiba, Kouhei Kotera, Tomoaki Matsushima, Yukio Matsushita, Hideo Nakanishi, Shinji Hashimoto, Tomoaki Nemoto, Hiroyuki Yagyu, Yuuki Kasai
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Publication number: 20070189661Abstract: A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.Type: ApplicationFiled: April 12, 2007Publication date: August 16, 2007Applicant: Matsushita Electric Works, Ltd.,Inventors: Tooru Nakashiba, Kouhei Kotera, Tomoaki Matsushima, Yukio Matsushita, Hideo Nakanishi, Shinji Hashimoto, Tomoaki Nemoto, Hiroyuki Yagyu, Yuuki Kasai
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Publication number: 20050238278Abstract: A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.Type: ApplicationFiled: May 27, 2003Publication date: October 27, 2005Inventors: Tooru Nakashiba, Kouhei Kotera, Tomoaki Matsushima, Yukio Matsushita, Hideo Nakanishi, Shinji Hashimoto, Tomoaki Nemoto, Hiroyuki Yagyu, Yuuki Kasai