Abstract: A dicing apparatus for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for inputting position information by designating an arbitrary position displayed by the display means, by using the display position on the display means, conversion means for converting the inputted position information into positional information on the position of the wafer surface, and moving means for moving the display position on the basis of the converted positional information. The apparatus displays the image in the displayed position moved.

Abstract: The present invention provides a dicing apparatus which machines with rotary blades a groove in, or cuts, a work mounted on a work table, wherein: a dicing tape to whose upper face the work is stuck can be stuck to or detached from the work table; a contact type displacement meter for measuring the upper face of the dicing tape fitted to the work table is provided; and a cutting depth controlling device which controls the depth of cutting by the rotary blades into the work on the basis of the measured position of the upper face of the dicing tape in the vertical direction is further provided.

Abstract: A wafer observation position designating apparatus and a wafer display position designating method for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for inputting position information by designating an arbitrary position displayed by the display means, by using the display position on the display means, conversion means for converting the inputted position information into positional information on the position of the wafer surface, and moving means for moving the display position on the basis of the converted positional information. The apparatus displays the image in the displayed position moved.

Abstract: In a dicing apparatus that comprises a first blade and a second blade, the first blade cuts a wafer along a street along which the first blade has not previously cut the wafer, and the second blade cuts the wafer along a street along which the first blade has not cut the wafer, and then kerfs made by the blades are inspected. In this method, the kerfs are made along the different streets, and thus the kerfs made by the blades can be accurately inspected.