Patents by Inventor Hiroyuki Yatsu

Hiroyuki Yatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7782854
    Abstract: This invention constructs within the LAN a private area network (PAN) which is configured by terminal devices (personal computers and the like) of a specific group, is hardly influenced by the LAN traffic, and has high security. For this purpose, a PAN server which manages the communication route between specific terminals is installed within the LAN. The PAN server sets the communication route of each terminal device as label information, and causes switches and terminals to set pieces of label information generated for them. When the frame of data from a given port of each connection switch contains information representing PAN communication, the connection switch outputs the data to only a port specified by routing label information described in the frame.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: August 24, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tsuguhide Sakata, Yukichi Niwa, Kenji Nakamura, Mitsuru Yamamoto, Noboru Yamamoto, Hiroyuki Yatsu
  • Publication number: 20070089901
    Abstract: A circuit board according to the present invention is so formed that an extension pattern not covered with an insulating film is provided at a NC land that does not allow an electric signal to pass therethrough, so as to have a configuration equivalent to that of a pattern not covered with the sulating film and provided at a land that allows the electric signal to pass therethrough. Accordingly, the NC land may have an exposed surface area equivalent to that of the land. Therefore, when a semiconductor component is soldered using solders, bumps of the solders at the NC land and at the land may be evenly formed, thereby providing coplanarity of the solders, and increasing soldering reliability for the semiconductor component.
    Type: Application
    Filed: September 14, 2006
    Publication date: April 26, 2007
    Inventors: Hiroyuki Yatsu, Shuichi Takeda
  • Patent number: 7157362
    Abstract: An electronic circuit unit contains electrodes to which bumps of a semiconductor chip are adhered. The electrodes are arranged on an upper surface of a circuit board. Land units to which chip parts is soldered are arranged on a rear surface of the circuit board. such that an insulating plate which is on the rear surface of the circuit board is supported by a supporting jig during a mounting process of the semiconductor chip, and the circuit board is not tilted. Therefore, an electronic circuit unit ensuring that the semiconductor chip is mounted with a reliable mounting capability can be obtained.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: January 2, 2007
    Assignee: Alps Electric Co., Ltd.
    Inventors: Hiroyuki Yatsu, Nobuyuki Suzuki
  • Patent number: 7139585
    Abstract: When an incoming call to a wireless communication apparatus is detected, a wireless control apparatus uses a wireless link, which has been established by previous communication, to perform succeeding communication. Examples of communication include communication of audio or data already completed, or, when there are a plurality of wireless communication apparatus, communication of control information by a wireless link established when notification of an incoming call is given to the wireless communication apparatus.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: November 21, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Futoshi Hachimura, Hiroyuki Yatsu
  • Publication number: 20050140008
    Abstract: A electronic circuit unit contains electrodes to which bumps of a semiconductor chip are adhered. The electrodes are arranged on an upper surface of a circuit board. Land units to which chip parts is soldered are arranged on a rear surface of the circuit board. such that an insulating plate which is on the rear surface of the circuit board is supported by a supporting jig during a mounting process of the semiconductor chip, and the circuit board is not tilted. Therefore, an electronic circuit unit ensuring that the semiconductor chip is mounted with a reliable mounting capability can be obtained.
    Type: Application
    Filed: December 21, 2004
    Publication date: June 30, 2005
    Inventors: Hiroyuki Yatsu, Nobuyuki Suzuki
  • Publication number: 20050089034
    Abstract: This invention constructs within the LAN a private area network (PAN) which is configured by terminal devices (personal computers and the like) of a specific group, is hardly influenced by the LAN traffic, and has high security. For this purpose, a PAN server which manages the communication route between specific terminals is installed within the LAN. The PAN server sets the communication route of each terminal device as label information, and causes switches and terminals to set pieces of label information generated for them. When the frame of data from a given port of each connection switch contains information representing PAN communication, the connection switch outputs the data to only a port specified by routing label information described in the frame.
    Type: Application
    Filed: August 6, 2004
    Publication date: April 28, 2005
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Tsuguhide Sakata, Yukichi Niwa, Kenji Nakamura, Mitsuru Yamamoto, Noboru Yamamoto, Hiroyuki Yatsu
  • Publication number: 20050029008
    Abstract: A electronic circuit module of the present invention comprises a circuit board 1 formed with laminated plurality of insulating sheets, and a cover 9 made from a metal plate and having attaching legs 9c soldered to electrode portions 7 in the concave portions 1c in a state of covering the electronic component 8. The concave portions 1c are formed from an upper surface of the circuit board 1 toward a lower surface side, stopping portions 1d for plugging the lower portions of the concave portions 1c are provided in the circuit board 1, and the attaching legs 9c of the cover 9 are soldered to the electrode portions 7 in a state of being inserted into the concave portions 1c. As a result, it is possible to prevent the soldering connecting the attaching legs 9c to the electrode portions 7 from leaking downward by way of the stopping portions 1d.
    Type: Application
    Filed: August 2, 2004
    Publication date: February 10, 2005
    Inventor: Hiroyuki Yatsu
  • Publication number: 20040090755
    Abstract: An electronic unit includes a module in which a semiconductor device is attached on the bottom of a circuit board and which has lands provided on the bottom of the circuit board, and a printed circuit board on which the module is mounted, the printed circuit board having a hole in a position facing the semiconductor device and having electrical conductors to which the lands are soldered. The module is mounted on the printed circuit board by soldering the lands to the electrical conductors while the semiconductor device is disposed in the hole. Accordingly, the electronic unit is smaller in height than conventional electronic units. Such a structure allows the module to be surface-mounted on the printed circuit board with solder paste, and thus high productivity of the electronic unit can be achieved.
    Type: Application
    Filed: October 31, 2003
    Publication date: May 13, 2004
    Applicant: Alps Electric Co., Ltd.
    Inventor: Hiroyuki Yatsu
  • Patent number: 6327477
    Abstract: When an incoming call to a wireless communication apparatus is detected, a wireless control apparatus uses a wireless link, which has been established by previous communication, to perform succeeding communication. Examples of communication include communication of audio or data already completed, or, when there are a plurality of wireless communication apparatus, communication of control information by a wireless link established when notification of an incoming call is given to the wireless communication apparatus.
    Type: Grant
    Filed: March 26, 1996
    Date of Patent: December 4, 2001
    Assignee: Canon Kabushiki Kaisha
    Inventors: Futoshi Hachimura, Hiroyuki Yatsu
  • Publication number: 20010018350
    Abstract: When an incoming call to a wireless communication apparatus is detected, a wireless control apparatus uses a wireless link, which has been established by previous communication, to perform succeeding communication. Examples of communication include communication of audio or data already completed, or, when there are a plurality of wireless communication apparatus, communication of control information by a wireless link established when notification of an incoming call is given to the wireless communication apparatus.
    Type: Application
    Filed: April 30, 2001
    Publication date: August 30, 2001
    Inventors: Futoshi Hachimura, Hiroyuki Yatsu
  • Patent number: 6085013
    Abstract: The invention provides an optical cable closure of which outer casing is made by joining two half cases on a partition plane and can be made smaller, with no redundant space produced in either of the half cases. A plurality of cable leading holes 4 are provided on only one end of a two-partition type outer casing 1 comprising half cases 1A and 1B of an identical configuration, with the cable leading holes 4 being arranged side by side and divided into halves by a partition plane 5 of the outer casing 1. Plugged into each cable leading hole 4 and supported therein is an end plate 6 which fits around the circumference of the optical cable 3 and seals the cable leading hole 4. The end plate 6 has a cable passing hole 6a disposed offset from the center line and is aligned in the cable leading hole 4 so that the offset cable passing hole 6a is disposed closer to the bottom side than the partition plane inside one half case 1A.
    Type: Grant
    Filed: October 8, 1998
    Date of Patent: July 4, 2000
    Assignee: The Furukawa Electric Co., Ltd.
    Inventor: Hiroyuki Yatsu
  • Patent number: 5848148
    Abstract: A communicating apparatus comprises a display unit, an input unit for inputting a dial number, an instruction unit for instructing a change in volume, and a control unit for controlling the display unit so as to display the dial number inputted by the input unit, wherein the control unit controls the display unit so as to display the kind of sound and the volume in place of the dial number in accordance with an instruction of the instruction unit. The control unit includes a generation unit for generating a plurality of kinds of sounds by a plurality of volumes. The control unit controls the display unit so as to display a message indicating that a volume of a ringing tone is being displayed and the volume of the ringing tone in accordance with an instruction by the instruction unit during the ringing.
    Type: Grant
    Filed: October 12, 1994
    Date of Patent: December 8, 1998
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hiroyuki Yatsu
  • Patent number: 5722054
    Abstract: A communication apparatus comprising a detector for detecting a standard DTMF signal when a clock of a predetermined frequency is supplied, an operating unit for executing an operation such as display or communication according to a detection output of the detector to which a clock other than the predetermined frequency was supplied, and a supply unit for supplying the clock other than the predetermined frequency to the detector.
    Type: Grant
    Filed: February 24, 1995
    Date of Patent: February 24, 1998
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koichi Mizutani, Hiroyuki Yatsu
  • Patent number: 5696817
    Abstract: A communication apparatus in accordance with the present invention determines the origin of an incoming telephone communication based on the calling party's number. When a call is made to a communication line to which an apparatus of the present invention is connected, the apparatus determines the number of digits in the calling party's number, and uses a ringing pattern or tone to indicate the source of the incoming call to the called party.
    Type: Grant
    Filed: December 8, 1992
    Date of Patent: December 9, 1997
    Assignee: Canon Kabushiki Kaisha
    Inventor: Hiroyuki Yatsu
  • Patent number: 5606158
    Abstract: A collection and processing apparatus for recycling recording media which are capable of erasably recording data and are repeatedly usable is disclosed.
    Type: Grant
    Filed: February 3, 1995
    Date of Patent: February 25, 1997
    Assignee: Kabushiki Kaisha Ace Denken
    Inventors: Takatoshi Takemoto, Hiroyuki Yatsu
  • Patent number: 5207857
    Abstract: A forced aligning jig for forcedly aligning a plurality of loose wires. It is provided with a retaining means for retaining the plurality of loose wires, a guiding means which has one end and the other end and one end is fixed to the retaining means and an aligning means which is slidably supported by the guiding means and forcedly aligns the plurality of loose wires, and the aligning means is provided with an aligning groove for aligning and storing the plurality of loose wires retained by the retaining means and a holding means for holding the plurality of loose wires have been stored in the aligning groove in an aligned state.
    Type: Grant
    Filed: May 24, 1991
    Date of Patent: May 4, 1993
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Akio Tanabe, Kazuo Hashimoto, Hideki Watanabe, Hiroyuki Yatsu
  • Patent number: 5033335
    Abstract: There is provided a coating stripper for optical fibers comprising a pair of clamp members each having a matching surface provided with a coating cutting edge, a coating pinching section and a coating holding section arranged in line on said matching surface with said coating pinching section located between said coating cutting edge and said coating holding section, any neighboring ones of said coating cutting edge, said coating pinching section and said coating holding section being contiguous with each other, each of said pair of coating cutting edges, said pair of coating pinching sections and said pair of coating holding sections being swingable relative to each other, both of said pair of coating pinching sections being made of a hard material, at least either of said pair of coating holding sections being made of a soft material and provided with a heater arranged in it.
    Type: Grant
    Filed: April 19, 1990
    Date of Patent: July 23, 1991
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Hiroyuki Yatsu, Akio Goto