Abstract: A plasma processing apparatus includes a stage disposed in a processing chamber for mounting a wafer, a plasma generation chamber disposed above the processing chamber for plasma generation using process gas, a plate member having multiple introduction holes, made of a dielectric material, disposed above the stage and between the processing chamber and the plasma generation chamber, and a lamp disposed around the plate member for heating the wafer. The plasma processing apparatus further includes an external IR light source, an emission fiber arranged in the stage, that outputs IR light from the external IR light source toward a wafer bottom, and a light collection fiber for collecting IR light from the wafer. Data obtained using only IR light from the lamp is subtracted from data obtained also using IR light from the external IR light source during heating of the wafer. Thus, a wafer temperature is determined.

Abstract: An object of the present invention is to provide a conductor roll which obviates burning troubles caused by poor contact between the collector rings (C rings) and the roll shafts, which makes removal and installation of the C rings and operation of sliding contact adjustment unnecessary during the repairing operation of the roll body, and which extends the life of the sliding collector parts. The ringless-collector conductor roll according to the present invention comprises an electroplated Cu layer provided on the outer peripheral surface of the shaft ends of the conductor roll and having a Vickers hardness of at least 100 Hv, the electroplated Cu layer being directly contacted with brushes.