Patents by Inventor Hiroyuki Yoshihara

Hiroyuki Yoshihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 6734551
    Abstract: Each lead frame for a power chip has one side main surface on which a power chip is mounted and a suspension lead part provided projectingly from a region reserved for forming mold resin in addition to a lead terminal. Thus, the lead frame can be supported by the plurality of suspension lead parts in a molding step. A metal block is provided on the other main surface of the lead frame to face the power chip. Consequently, a semiconductor device with good heat radiation properties and good insulation breakdown voltages can be obtained.
    Type: Grant
    Filed: April 22, 2002
    Date of Patent: May 11, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroyuki Yoshihara, Kenichi Hayashi, Hisashi Kawafuji, Mitsugu Tajiri
  • Semiconductor device
    Publication number: 20030075783
    Abstract: Each lead frame for a power chip has one side main surface on which a power chip is mounted and a suspension lead part provided projectingly from a region reserved for forming mold resin in addition to a lead terminal. Thus, the lead frame can be supported by the plurality of suspension lead parts in a molding step. A metal block is provided on the other main surface of the lead frame to face the power chip. Consequently, a semiconductor device with good heat radiation properties and good insulation breakdown voltages can be obtained.
    Type: Application
    Filed: April 22, 2002
    Publication date: April 24, 2003
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Hiroyuki Yoshihara, Kenichi Hayashi, Hisashi Kawafuji, Mitsugu Tajiri