Patents by Inventor Hirozi Kamiya

Hirozi Kamiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6116887
    Abstract: The present invention provides foam molding equipment which has an advantage in performing exchange of a molding dies within a short time period and in improving productivity thereof, and which is most suitable, in particular, to the case of using upsized molding dies. The equipment is provided with a fixed die base 21, movable die base 8, a die opening/closing mechanism to move the movable die base 8 together with a movable die 12, and a base frame 1. The fixed die base 21 is detachable from the base frame 1. Molding dies comprising a stationary die 11 and a movable die 12 is preliminarily attached to the fixed die base 21 to form a unit 20. The base frame 1 is provided with a loading surface 4 to load the unit 20 and a unit connector 27 to fix the unit loaded on the loading surface 4 to the base frame 1. The unit 20 is loaded on the loading surface 4 in a detachable manner.
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: September 12, 2000
    Assignee: Aisin Takaoka Co., Ltd.
    Inventors: Yuichi Yamada, Osamu Shimomura, Masaki Yonezawa, Hirozi Kamiya, Ken Ohshima