Abstract: Provided is a silicone resin composition, which is curable at a temperature of not more than 270.degree. C., consisting essentially of a silicone ladder polymer expressed in the following general formula (I): ##STR1## where R.sup.1 to R.sup.4 represent hydrogen atoms or lower alkyl groups respectively, R.sup.5 and R.sup.6 represent aryl groups, alkyl groups or alkenyl groups with alkenyl groups occupying at least 2% of 2n groups R.sup.5 and R.sup.6, and n represents an integer of 5 to 1600, an organic solvent, and/or 0.2 to 20.0 percent by weight of a catalyst with respect to the silicone ladder polymer. This composition is cured at a temperature of not more than 270.degree. C., to form a thin film having excellent solvent resistance and heat resistance.