Patents by Inventor Hirschler Joachim

Hirschler Joachim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PROCESSING A SEMICONDUCTOR WAFER
    Publication number: 20160141208
    Abstract: According to various embodiments, a method for processing a semiconductor substrate may include: covering a plurality of die regions of the semiconductor substrate with a metal; forming a plurality of dies from the semiconductor substrate, wherein each die of the plurality of dies is covered with the metal; and, subsequently, annealing the metal covering at least one die of the plurality of dies.
    Type: Application
    Filed: November 14, 2014
    Publication date: May 19, 2016
    Inventors: Hirschler Joachim, Roesner Michael, Heinrici Juch Markus, Stranzl Gudrun, Mischitz Martin, Zgaga Martin