Patents by Inventor His-Ying Yuan

His-Ying Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor with a protection layer
    Patent number: 7525139
    Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: April 28, 2009
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Chin-Chen Yang, Wen-Ping Yang, Wen-Bin Sun, Chao-nan Chou, His-Ying Yuan, Jui-Hsien Chang
  • Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP
    Patent number: 7400037
    Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: July 15, 2008
    Assignee: Advanced Chip Engineering Tachnology Inc.
    Inventors: Wen-Kun Yang, Chin-Chen Yang, Cheng-hsien Chiu, Wen-Bin Sun, Kuang-Chi Chao, His-Ying Yuan, Chun-Hui Yu
  • FBGA and COB package structure for image sensor
    Patent number: 7279782
    Abstract: A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: October 9, 2007
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Chin-Chen Yang, Wen-Bin Sun, Jui-Hsien Chang, Chun Hui Yu, His-Ying Yuan
  • Filling paste structure and process for WL-CSP
    Publication number: 20060145364
    Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
    Type: Application
    Filed: December 30, 2004
    Publication date: July 6, 2006
    Inventors: Wen-Kun Yang, Chin-Chen Yang, Cheng-hsien Chiu, Wen-Bin Sun, Kuang-Chi Chao, His-Ying Yuan, Chun-Hui Yu
  • FBGA and COB package structure for image sensor
    Publication number: 20060145325
    Abstract: A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
    Type: Application
    Filed: January 5, 2005
    Publication date: July 6, 2006
    Inventors: Wen-Kun Yang, Chin-Chen Yang, Wen-Bin Sun, Jui-Hsien Chang, Chun Yu, His-Ying Yuan
  • Imagine sensor with a protection layer
    Publication number: 20050242409
    Abstract: An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
    Type: Application
    Filed: December 29, 2004
    Publication date: November 3, 2005
    Inventors: Wen-Kun Yang, Chin-Chen Yang, Wen-Ping Yang, Wen-Bin Sun, Chao-nan Chou, His-Ying Yuan, Jui-Hsien Chang