Patents by Inventor Hisaaki Terashima

Hisaaki Terashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12004429
    Abstract: To provide a piezoelectric body film that can suppress decrease in the piezoelectric constant d31, a method of producing a piezoelectric body film, and a piezoelectric body device. A piezoelectric body film comprising a fluororesin as a piezoelectric material, the fluororesin containing, as a main constituent unit, a repeating unit derived from vinylidene fluoride, a piezoelectric constant d31 of the piezoelectric body film being 20 pC/N or greater, and an extrapolated onset temperature at start of shrinkage determined by TMA measurement being not lower than 90° C. and not higher than 115° C. The difference between piezoelectric constants d31 measured before and after heating the piezoelectric body film at 100° C. for 24 hours relative to the piezoelectric constant d31 before the heating for 24 hours is 20% or less.
    Type: Grant
    Filed: September 11, 2023
    Date of Patent: June 4, 2024
    Assignee: KUREHA CORPORATION
    Inventors: Yusuke Sato, Hisaaki Terashima, Nobufumi Sato, Kazuyuki Kanno, Keiko Aita
  • Patent number: 11963454
    Abstract: To provide a piezoelectric body film that can suppress decrease in the piezoelectric constant d31, a method of producing a piezoelectric body film, and a piezoelectric body device. A piezoelectric body film comprising a fluororesin as a piezoelectric material, the fluororesin containing, as a main constituent unit, a repeating unit derived from vinylidene fluoride, a piezoelectric constant d31 of the piezoelectric body film being 20 pC/N or greater, and an extrapolated onset temperature at start of shrinkage determined by TMA measurement being not lower than 90° C. and not higher than 115° C. The difference between piezoelectric constants d31 measured before and after heating the piezoelectric body film at 100° C. for 24 hours relative to the piezoelectric constant d31 before the heating for 24 hours is 20% or less.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: April 16, 2024
    Assignee: KUREHA CORPORATION
    Inventors: Yusuke Sato, Hisaaki Terashima, Nobufumi Sato, Kazuyuki Kanno, Keiko Aita
  • Publication number: 20230422627
    Abstract: To provide a piezoelectric body film that can suppress decrease in the piezoelectric constant d31, a method of producing a piezoelectric body film, and a piezoelectric body device. A piezoelectric body film comprising a fluororesin as a piezoelectric material, the fluororesin containing, as a main constituent unit, a repeating unit derived from vinylidene fluoride, a piezoelectric constant d31 of the piezoelectric body film being 20 pC/N or greater, and an extrapolated onset temperature at start of shrinkage determined by TMA measurement being not lower than 90° C. and not higher than 115° C. The difference between piezoelectric constants d31 measured before and after heating the piezoelectric body film at 100° C. for 24 hours relative to the piezoelectric constant d31 before the heating for 24 hours is 20% or less.
    Type: Application
    Filed: September 11, 2023
    Publication date: December 28, 2023
    Applicant: Kureha Corporation
    Inventors: Yusuke SATO, Hisaaki TERASHIMA, Nobufumi SATO, Kazuyuki KANNO, Keiko AITA
  • Publication number: 20210367137
    Abstract: To provide a piezoelectric body film that can suppress decrease in the piezoelectric constant d31, a method of producing a piezoelectric body film, and a piezoelectric body device. A piezoelectric body film comprising a fluororesin as a piezoelectric material, the fluororesin containing, as a main constituent unit, a repeating unit derived from vinylidene fluoride, a piezoelectric constant d31 of the piezoelectric body film being 20 pC/N or greater, and an extrapolated onset temperature at start of shrinkage determined by TMA measurement being not lower than 90° C. and not higher than 115° C. The difference between piezoelectric constants d31 measured before and after heating the piezoelectric body film at 100° C. for 24 hours relative to the piezoelectric constant d31 before the heating for 24 hours is 20% or less.
    Type: Application
    Filed: October 19, 2018
    Publication date: November 25, 2021
    Applicant: Kureha Corporation
    Inventors: Yusuke SATO, Hisaaki TERASHIMA, Nobufumi SATO, Kazuyuki KANNO, Keiko AITA
  • Patent number: 11136440
    Abstract: A vinylidene fluoride resin film is produced by using a film composition containing at least a vinylidene fluoride resin and organic particles. The vinylidene fluoride resin film includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 40 to 400, per 0.10 mm2 of the vinylidene fluoride resin film.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: October 5, 2021
    Assignee: KUREHA CORPORATION
    Inventors: Nobufumi Sato, Kazuyuki Kanno, Yusuke Sato, Keiko Aita, Hisaaki Terashima
  • Patent number: 10988586
    Abstract: Provided is a vinylidene fluoride resin film that is produced using a film composition including at least a vinylidene fluoride resin and inorganic particles; and that includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 7.0 to 50 per 0.10 mm2 of the vinylidene fluoride resin film.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: April 27, 2021
    Assignee: KUREHA CORPORATION
    Inventors: Nobufumi Sato, Keiko Aita, Hisaaki Terashima, Kazuyuki Kanno, Yusuke Sato
  • Publication number: 20190338091
    Abstract: Provided is a vinylidene fluoride resin film that is produced using a film composition including at least a vinylidene fluoride resin and inorganic particles; and that includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 7.0 to 50 per 0.10 mm2 of the vinylidene fluoride resin film.
    Type: Application
    Filed: January 16, 2018
    Publication date: November 7, 2019
    Inventors: Nobufumi SATO, Keiko AITA, Hisaaki TERASHIMA, Kazuyuki KANNO, Yusuke SATO
  • Publication number: 20190330431
    Abstract: A vinylidene fluoride resin film is produced by using a film composition containing at least a vinylidene fluoride resin and organic particles. The vinylidene fluoride resin film includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 40 to 400, per 0.
    Type: Application
    Filed: January 16, 2018
    Publication date: October 31, 2019
    Inventors: Nobufumi SATO, Kazuyuki KANNO, Yusuke SATO, Keiko AITA, Hisaaki TERASHIMA
  • Patent number: 9493891
    Abstract: A method for producing an undrawn polyglycolic acid-based resin yarn, including: a discharge step of discharging a molten polyglycolic acid-based resin through a spinneret, to thereby form a fibrous polyglycolic acid-based resin; a keeping step of keeping the fibrous polyglycolic acid-based resin for 0.0012 seconds or more after the discharge in an atmosphere having a temperature of not lower than 110.5° C. but not higher than a melting point of the polyglycolic acid-based resin; and a cooling step of cooling the fibrous polyglycolic acid-based resin obtained in the keeping step, to thereby obtain an undrawn polyglycolic acid-based resin yarn.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: November 15, 2016
    Assignee: KUREHA CORPORATION
    Inventors: Kotaku Saigusa, Masahiro Yamazaki, Shunsuke Abe, Hisaaki Terashima, Hiroyuki Sato
  • Publication number: 20130224485
    Abstract: A method for producing an undrawn polyglycolic acid-based resin yarn, including: a discharge step of discharging a molten polyglycolic acid-based resin through a spinneret, to thereby form a fibrous polyglycolic acid-based resin; a keeping step of keeping the fibrous polyglycolic acid-based resin for 0.0012 seconds or more after the discharge in an atmosphere having a temperature of not lower than 110.5° C. but not higher than a melting point of the polyglycolic acid-based resin; and a cooling step of cooling the fibrous polyglycolic acid-based resin obtained in the keeping step, to thereby obtain an undrawn polyglycolic acid-based resin yarn.
    Type: Application
    Filed: November 7, 2011
    Publication date: August 29, 2013
    Applicant: KUREHA CORPORATION
    Inventors: Kotaku Saigusa, Masahiro Yamazaki, Shunsuke Abe, Hisaaki Terashima, Hiroyuki Sato
  • Publication number: 20060280915
    Abstract: A release film comprising a resin-based material containing a cycloolefin-based resin.
    Type: Application
    Filed: February 21, 2006
    Publication date: December 14, 2006
    Inventors: Hideki Kitamura, Hisaaki Terashima, Kazuyuki Suzuki, Yasuhiro Suzuki, Mitsuru Ito, Hiroshi Sato, Takeshi Nakadai, Hideo Yusa, Toshimi Murayama
  • Publication number: 20060272768
    Abstract: A release film comprising a resin-based material containing a cycloolefin-based resin.
    Type: Application
    Filed: August 11, 2006
    Publication date: December 7, 2006
    Inventors: Hideki Kitamura, Hisaaki Terashima, Kazuyuki Suzuki, Yasuhiro Suzuki, Mitsuru Ito, Hiroshi Sato, Takeshi Nakadai, Hideo Yusa, Toshimi Murayama
  • Publication number: 20050027076
    Abstract: As a polymer composition for electrical wire coating is provided a vinylidene fluoride polymer composition, which has such heat-resistance as to withstand the heat generated from a wire in service and exhibits satisfactory flexibility even after the change with the passage of time. The polymer composition for electrical wire coating comprises a vinylidene fluoride copolymer and a vinylidene fluoride homopolymer. The preferable compounding ratio in the polymer composition is in the range of 20 to 80% by weight of a vinylidene fluoride copolymer and 80 to 20% by weight of a vinylidene fluoride homopolymer. The vinylidene fluoride copolymer is preferably one comprising 95 to 70% by weight of vinylidene fluoride and 5 to 30% by weight of a monomer copolymerizable with vinylidene fluoride.
    Type: Application
    Filed: October 9, 2002
    Publication date: February 3, 2005
    Inventors: Toshiya Mizuno, Masamichi Akatsu, Hisaaki Terashima, Takumi Katsurao, Katsuo Horie
  • Patent number: 6749940
    Abstract: A moistureproof multilayer film, including a composite film having a non-moisture absorbing resin layer and a vapor deposited film of an inorganic oxide or a metal formed on at least one side of the non-moisture absorbing resin layer, the multilayer film having such a layer structure where the vapor deposited film surface of the composite film is laminated through an adhesive layer on a vapor deposited film surface of another composite film or a surface of another non-moisture absorbing resin layer, wherein a total number (n) of the deposited films laminated adjacent to the adhesive layer is 2 to 8, and wherein a moisture permeabihty (W; unit: g/m2.day) as measured under conditions of a temperature of 40° C. and a relative humidity of 100% satisfies a relation represented by equation W≦(1/n)×0.20, and a method for producing the moistureproof multilayer film including heat-treating the multilayer film in a hot dry atmosphere having a temperature lower than 140° C. but not lower than 55° C.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: June 15, 2004
    Assignee: Kureha Chemical Industry Co., Ltd.
    Inventors: Shuji Terasaki, Masamichi Akatsu, Hisaaki Terashima, Yasuhiro Tada
  • Patent number: 6432516
    Abstract: A moistureproof film composed of a transparent multi-layer film having a layer structure that thin metal or nonmetal oxide layers (C) are respectively arranged directly or through an adhesive layer (B) on both sides of a hygroscopic resin layer (A), and having a water vapor transmission rate of at most 0.05 g/m2·24 hr as measured at a temperature of 60° C. and a relative humidity of 90%, and a quantity of water vapor transmission for 50 hours of at most 0.15 g/m2 as measured at a temperature of 40° C. and a relative humidity of 100%, a production process thereof, an EL device sealed with the moistureproof film, and a fabrication process of the EL device.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: August 13, 2002
    Assignee: Kureha Kagaku Kogyo K.K.
    Inventors: Syuji Terasaki, Hisaaki Terashima, Satoru Matsunaga, Masamichi Akatsu