Abstract: To provide a piezoelectric body film that can suppress decrease in the piezoelectric constant d31, a method of producing a piezoelectric body film, and a piezoelectric body device. A piezoelectric body film comprising a fluororesin as a piezoelectric material, the fluororesin containing, as a main constituent unit, a repeating unit derived from vinylidene fluoride, a piezoelectric constant d31 of the piezoelectric body film being 20 pC/N or greater, and an extrapolated onset temperature at start of shrinkage determined by TMA measurement being not lower than 90° C. and not higher than 115° C. The difference between piezoelectric constants d31 measured before and after heating the piezoelectric body film at 100° C. for 24 hours relative to the piezoelectric constant d31 before the heating for 24 hours is 20% or less.

Abstract: To provide a piezoelectric body film that can suppress decrease in the piezoelectric constant d31, a method of producing a piezoelectric body film, and a piezoelectric body device. A piezoelectric body film comprising a fluororesin as a piezoelectric material, the fluororesin containing, as a main constituent unit, a repeating unit derived from vinylidene fluoride, a piezoelectric constant d31 of the piezoelectric body film being 20 pC/N or greater, and an extrapolated onset temperature at start of shrinkage determined by TMA measurement being not lower than 90° C. and not higher than 115° C. The difference between piezoelectric constants d31 measured before and after heating the piezoelectric body film at 100° C. for 24 hours relative to the piezoelectric constant d31 before the heating for 24 hours is 20% or less.

Abstract: To provide a piezoelectric body film that can suppress decrease in the piezoelectric constant d31, a method of producing a piezoelectric body film, and a piezoelectric body device. A piezoelectric body film comprising a fluororesin as a piezoelectric material, the fluororesin containing, as a main constituent unit, a repeating unit derived from vinylidene fluoride, a piezoelectric constant d31 of the piezoelectric body film being 20 pC/N or greater, and an extrapolated onset temperature at start of shrinkage determined by TMA measurement being not lower than 90° C. and not higher than 115° C. The difference between piezoelectric constants d31 measured before and after heating the piezoelectric body film at 100° C. for 24 hours relative to the piezoelectric constant d31 before the heating for 24 hours is 20% or less.

Abstract: A vinylidene fluoride resin film is produced by using a film composition containing at least a vinylidene fluoride resin and organic particles. The vinylidene fluoride resin film includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 40 to 400, per 0.10 mm2 of the vinylidene fluoride resin film.

Abstract: Provided is a vinylidene fluoride resin film that is produced using a film composition including at least a vinylidene fluoride resin and inorganic particles; and that includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 7.0 to 50 per 0.10 mm2 of the vinylidene fluoride resin film.

Abstract: Provided is a vinylidene fluoride resin film that is produced using a film composition including at least a vinylidene fluoride resin and inorganic particles; and that includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 7.0 to 50 per 0.10 mm2 of the vinylidene fluoride resin film.

Abstract: A vinylidene fluoride resin film is produced by using a film composition containing at least a vinylidene fluoride resin and organic particles. The vinylidene fluoride resin film includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 40 to 400, per 0.

Abstract: A method for producing an undrawn polyglycolic acid-based resin yarn, including: a discharge step of discharging a molten polyglycolic acid-based resin through a spinneret, to thereby form a fibrous polyglycolic acid-based resin; a keeping step of keeping the fibrous polyglycolic acid-based resin for 0.0012 seconds or more after the discharge in an atmosphere having a temperature of not lower than 110.5° C. but not higher than a melting point of the polyglycolic acid-based resin; and a cooling step of cooling the fibrous polyglycolic acid-based resin obtained in the keeping step, to thereby obtain an undrawn polyglycolic acid-based resin yarn.

Abstract: A method for producing an undrawn polyglycolic acid-based resin yarn, including: a discharge step of discharging a molten polyglycolic acid-based resin through a spinneret, to thereby form a fibrous polyglycolic acid-based resin; a keeping step of keeping the fibrous polyglycolic acid-based resin for 0.0012 seconds or more after the discharge in an atmosphere having a temperature of not lower than 110.5° C. but not higher than a melting point of the polyglycolic acid-based resin; and a cooling step of cooling the fibrous polyglycolic acid-based resin obtained in the keeping step, to thereby obtain an undrawn polyglycolic acid-based resin yarn.

Abstract: A release film comprising a resin-based material containing a cycloolefin-based resin.

Abstract: A release film comprising a resin-based material containing a cycloolefin-based resin.

Abstract: As a polymer composition for electrical wire coating is provided a vinylidene fluoride polymer composition, which has such heat-resistance as to withstand the heat generated from a wire in service and exhibits satisfactory flexibility even after the change with the passage of time. The polymer composition for electrical wire coating comprises a vinylidene fluoride copolymer and a vinylidene fluoride homopolymer. The preferable compounding ratio in the polymer composition is in the range of 20 to 80% by weight of a vinylidene fluoride copolymer and 80 to 20% by weight of a vinylidene fluoride homopolymer. The vinylidene fluoride copolymer is preferably one comprising 95 to 70% by weight of vinylidene fluoride and 5 to 30% by weight of a monomer copolymerizable with vinylidene fluoride.

Abstract: A moistureproof multilayer film, including a composite film having a non-moisture absorbing resin layer and a vapor deposited film of an inorganic oxide or a metal formed on at least one side of the non-moisture absorbing resin layer, the multilayer film having such a layer structure where the vapor deposited film surface of the composite film is laminated through an adhesive layer on a vapor deposited film surface of another composite film or a surface of another non-moisture absorbing resin layer, wherein a total number (n) of the deposited films laminated adjacent to the adhesive layer is 2 to 8, and wherein a moisture permeabihty (W; unit: g/m2.day) as measured under conditions of a temperature of 40° C. and a relative humidity of 100% satisfies a relation represented by equation W≦(1/n)×0.20, and a method for producing the moistureproof multilayer film including heat-treating the multilayer film in a hot dry atmosphere having a temperature lower than 140° C. but not lower than 55° C.

Abstract: A moistureproof film composed of a transparent multi-layer film having a layer structure that thin metal or nonmetal oxide layers (C) are respectively arranged directly or through an adhesive layer (B) on both sides of a hygroscopic resin layer (A), and having a water vapor transmission rate of at most 0.05 g/m2·24 hr as measured at a temperature of 60° C. and a relative humidity of 90%, and a quantity of water vapor transmission for 50 hours of at most 0.15 g/m2 as measured at a temperature of 40° C. and a relative humidity of 100%, a production process thereof, an EL device sealed with the moistureproof film, and a fabrication process of the EL device.