Patents by Inventor Hisaaki Yamakage
Hisaaki Yamakage has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9689622Abstract: A heat transfer device that can improve temperature uniformity along the entire length of a pipe line housed in the heat transfer device is provided. The heat transfer device transferring heat to the pipe line in which a fluid flows includes: a heat transfer block of high heat conductivity, surrounding the pipe line, a heat pipe formed in the heat transfer block, along an extending direction of the pipe line, and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extending direction of the pipe line. There is provided a proximity portion where the heat transfer block is in proximate to the pipe line at both ends of the heat transfer block in the extending direction of the pipe line.Type: GrantFiled: April 25, 2012Date of Patent: June 27, 2017Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Junichi Uno, Hisaaki Yamakage
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Patent number: 9657880Abstract: A heating device which transfers heat isothermally to an object to be heated. The heating device includes: a block and a base plate which surround a pipe; a first heat insulating cover which covers an outer periphery of the block and the base plate and forms a first heat insulating layer; and a second heat insulating cover which covers an outer periphery of the first heat insulating cover and forms a second heat insulating layer. The first heat insulating cover includes first heat insulating covers fixed to the block and the base plate respectively. The second heat insulating cover includes second heat insulating covers fixed to each of the first heat insulating covers respectively. The heating device further includes snap locks which detachably fixes the second heat insulating covers.Type: GrantFiled: December 9, 2010Date of Patent: May 23, 2017Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Junichi Uno, Hisaaki Yamakage, Takeshi Funabiki, Yoshihito Yamada
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Patent number: 9428831Abstract: A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.Type: GrantFiled: September 30, 2013Date of Patent: August 30, 2016Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Hisaaki Yamakage, Yoshihito Yamada
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Patent number: 9428832Abstract: A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.Type: GrantFiled: September 30, 2013Date of Patent: August 30, 2016Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Hisaaki Yamakage, Yoshihito Yamada
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Patent number: 9423185Abstract: A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system.Type: GrantFiled: November 4, 2009Date of Patent: August 23, 2016Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Hisaaki Yamakage, Yoshihito Yamada, Masato Hanada
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Publication number: 20150075753Abstract: A heat transfer device that can improve temperature uniformity along the entire length of a pipe line housed in the heat transfer device is provided. The heat transfer device transferring heat to the pipe line in which a fluid flows includes: a heat transfer block of high heat conductivity, surrounding the pipe line, a heat pipe formed in the heat transfer block, along an extending direction of the pipe line, and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extending direction of the pipe line. There is provided a proximity portion where the heat transfer block is in proximate to the pipe line at both ends of the heat transfer block in the extending direction of the pipe line.Type: ApplicationFiled: April 25, 2012Publication date: March 19, 2015Applicant: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Junichi Uno, Hisaaki Yamakage
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Patent number: 8724973Abstract: A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.Type: GrantFiled: April 11, 2008Date of Patent: May 13, 2014Assignee: Toshiba Mitsubishi-Electric Industrial Systems CorporationInventors: Hisaaki Yamakage, Yoshihito Yamada
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Patent number: 8691017Abstract: A heat equalizer includes a container structure having a heating block in which a working fluid is held for heating and vaporizing a material to be heated, a heater placed at the bottom of the container structure, and a material feed pipe allowing the outside and the inside of the container structure to communicate with each other. In the heating block, as a flow path in which the material to be heated flows, a main header pipe connected to the material feed pipe and extending in the horizontally, and a riser pipe branching from the main header pipe and extending vertically are formed. As a condensation path in which the working fluid is cooled and condensed, condensation holes formed respectively on the opposite sides of the riser pipe and extending horizontally, and a condensation pit formed under the riser pipe are formed. Between the condensation holes and the condensation pit, the main header pipe is placed.Type: GrantFiled: April 11, 2008Date of Patent: April 8, 2014Assignees: National University Corporation Tohoku University, Toshiba Mitsubishi—Electric Industrial Systems CorporationInventors: Tadahiro Ohmi, Masafumi Kitano, Hisaaki Yamakage, Yoshihito Yamada
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Publication number: 20140026826Abstract: A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.Type: ApplicationFiled: September 30, 2013Publication date: January 30, 2014Applicant: Toshiba Mitsubishi-Elec. Industrial Sys. Corp.Inventors: Hisaaki YAMAKAGE, Yoshihito Yamada
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Publication number: 20140026825Abstract: A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.Type: ApplicationFiled: September 30, 2013Publication date: January 30, 2014Applicant: Toshiba Mitsubishi-Elec. Industrial Sys. Corp.Inventors: Hisaaki YAMAKAGE, Yoshihito YAMADA
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Publication number: 20130220993Abstract: A heating device which transfers heat isothermally to an object to be heated. The heating device includes: a block and a base plate which surround a pipe; a first heat insulating cover which covers an outer periphery of the block and the base plate and forms a first heat insulating layer; and a second heat insulating cover which covers an outer periphery of the first heat insulating cover and forms a second heat insulating layer. The first heat insulating cover includes first heat insulating covers fixed to the block and the base plate respectively. The second heat insulating cover includes second heat insulating covers fixed to each of the first heat insulating covers respectively. The heating device further includes snap locks which detachably fixes the second heat insulating covers.Type: ApplicationFiled: December 9, 2010Publication date: August 29, 2013Applicant: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Junichi Uno, Hisaaki Yamakage, Takeshi Funabiki, Yoshihito Yamada
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Publication number: 20130146258Abstract: An isothermal heating apparatus includes a plate including formed therein a heat pipe circuit in which working fluid is charged, and a heating mechanism heating the working fluid. The heat pipe circuit includes a header portion at which the working fluid is heated and evaporated and a plurality of branch portions in which vapor produced by vaporization of the working fluid exchanges heat with the plate and condensates, the branch portions branching off from the header portion. The heating mechanism is provided on an evaporating surface side of the header portion with which the working fluid is in contact when the heating mechanism heats the working fluid. The isothermal heating apparatus can achieve isothermal heating of a heat-treatment subject and size reduction of the apparatus.Type: ApplicationFiled: October 1, 2010Publication date: June 13, 2013Applicant: Toshiba Mitsubishi-Electric Industrial Systems CorporationInventors: Junichi Uno, Hisaaki Yamakage, Takeshi Funabiki, Yoshihito Yamada
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Publication number: 20120175083Abstract: A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system.Type: ApplicationFiled: November 4, 2009Publication date: July 12, 2012Applicant: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Hisaaki Yamakage, Yoshihito Yamada, Masato Hanada
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Publication number: 20110041768Abstract: A heat equalizer includes a container structure having a heating block in which a working fluid is held for heating and vaporizing a material to be heated, a heater placed at the bottom of the container structure, and a material feed pipe allowing the outside and the inside of the container structure to communicate with each other. In the heating block, as a flow path in which the material to be heated flows, a main header pipe connected to the material feed pipe and extending in the horizontally, and a riser pipe branching from the main header pipe and extending vertically are formed. As a condensation path in which the working fluid is cooled and condensed, condensation holes formed respectively on the opposite sides of the riser pipe and extending horizontally, and a condensation pit formed under the riser pipe are formed. Between the condensation holes and the condensation pit, the main header pipe is placed.Type: ApplicationFiled: April 11, 2008Publication date: February 24, 2011Applicants: National University Corporation Tohoku University, Toshiba Mitsubishi-Electric Indus. Sys. Corp.Inventors: Tadahiro Ohmi, Masafumi Kitano, Hisaaki Yamakage, Yoshihito Yamada
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Publication number: 20110023862Abstract: A heat equalizer includes a container structure, a material feed pipe, and a heating mechanism. The container structure includes an inner container and an outer container. In the outer container, a working fluid is held. Respective upper ends of the inner container and the outer container are joined to form a hollow portion between the inner container and the outer container. The material feed pipe extends from an outside of the container structure to the inner surface of the inner container. The heating mechanism is placed at the bottom of the outer container. At the bottom surface of the inner container, a plurality of protrusions protruding toward the inside of the inner container and depressions formed by the bottom surface depressed inward of the protrusions and capable of receiving the vaporized working fluid are formed.Type: ApplicationFiled: April 11, 2008Publication date: February 3, 2011Applicant: TOSHIBA MITSUBISHI-ELECTRIC INDUS. SYS.CORP.Inventors: Hisaaki Yamakage, Yoshihito Yamada
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Patent number: 7810551Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: November 20, 2008Date of Patent: October 12, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
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Patent number: 7721793Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: November 22, 2006Date of Patent: May 25, 2010Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
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Publication number: 20090071631Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: ApplicationFiled: November 20, 2008Publication date: March 19, 2009Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage
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Publication number: 20070089861Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: ApplicationFiled: November 22, 2006Publication date: April 26, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOUSHI, Nobuaki UEHARA, Akira YAMADA, Tetsuro OGUSHI, Hisaaki YAMAKAGE
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Patent number: 7201215Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.Type: GrantFiled: January 13, 2004Date of Patent: April 10, 2007Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigetoshi Ippoushi, Nobuaki Uehara, Akira Yamada, Tetsuro Ogushi, Hisaaki Yamakage