Abstract: A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: An imaging device module includes an imaging device including a light incident plane on which light is incident, and a reverse face disposed on an opposite side of the light incident plane; and a thermal conductive sheet provided on the reverse face for dissipating heat generated from the imaging device. The thermal conductive sheet contains a plate-like boron nitride particle, and the thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of 4 W/m·K or more.

Abstract: A back light includes an irradiating portion for applying light to a liquid crystal panel and a heat diffusing member which is in contact with the irradiating portion. The heat diffusing member is made of a thermal conductive sheet containing a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: An imaging device module includes an imaging device including a light incident plane on which light is incident, and a reverse face disposed on an opposite side of the light incident plane; and a thermal conductive sheet provided on the reverse face for dissipating heat generated from the imaging device. The thermal conductive sheet contains a plate-like boron nitride particle, and the thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of 4 W/m·K or more.

Abstract: A thermal conductive sheet contains a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more. The thermal conductive sheet does not fall off from an adherend in the initial adhesion test (1) below: Initial adhesion test (1): The thermal conductive sheet is temporarily fixed on an adherend along the horizontal direction, and thereafter the adherend is turned over to be upside down. The maximum cutting resistance on the cutting blade at the time of cutting the thermal conductive sheet is 120 N/30 mm or less.

Abstract: A thermal conductive sheet contains a plate-like boron nitride particle. The proportion of the boron nitride particle content is 35 vol % or more, and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.

Abstract: A thermal conductive sheet containing a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more, and a glass transition point determined as the peak value of tan? obtained by measuring a dynamic viscoelasticity of the thermal conductive sheet at a frequency of 10 Hz is 125° C. or more.

Abstract: A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A thermal conductive sheet contains a plate-like boron nitride particle, has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and has a volume resistivity of 1×1010 ?·cm or more. The transmittance of light at a wavelength of 500 nm is 10% or less. The surface reflectance R of light at 500 nm is 70% or more relative to the surface reflectance of barium sulfate as 100%. A light-emitting diode mounting substrate includes a substrate for mounting a light-emitting diode; and a thermal conductive light reflection layer being formed on the surface of the substrate and including the above-described thermal conductive sheet. A thermal conductive adhesive sheet includes a thermal conductive layer including the above-described thermal conductive sheet, and an adhesive layer or a pressure-sensitive adhesive layer laminated on at least one side of the thermal conductive layer.

Abstract: A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A heat dissipation structure includes a substrate, an electronic component mounted on the substrate, a heat dissipation member for dissipating heat generated from the electronic component, and a thermal conductive adhesive sheet provided on the substrate so as to cover the electronic component. The thermal conductive adhesive sheet includes a thermal conductive layer containing a plate-like boron nitride particle. The thermal conductive layer has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive layer of 4 W/m·K or more, and the thermal conductive adhesive sheet is in contact with the heat dissipation member.

Abstract: A thermal conductive sheet contains a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. The breakdown voltage of the thermal conductive sheet as measured in conformity with JIS C 2110 (2010) is 10 kV/mm or more.

Abstract: A first resin, a curable precursor of a second resin that differs from the first resin, an inorganic material and a solvent are blended and a mixed solution is prepared. Next, by heating the mixed solution, the solvent is removed and the curable precursor is cured, and an organic-inorganic composite is obtained that comprises a composite resin having a co-continuous phase-separated structure formed from a three-dimensionally continuous first phase made of the first resin and a three-dimensionally continuous second phase made of the second resin, and an inorganic material that is localized at the interface between the first phase and the second phase.

Abstract: To provide a semi-conducting resin composition capable of forming a semi-conducting layer which exhibits a less variable surface resistivity even when subjected to ultrasonic cleaning and effectively discharges static electricity and also provide a wired circuit board comprising the semi-conducting layer composed of the semi-conducting resin composition, an imide resin or a precursor of an imide resin and conducting particles are mixed in a solvent so that the semi-conducting resin composition containing the imide resin or imide resin precursor dissolved therein and the conducting particles dispersed therein is prepared. Then, the semi-conducting resin composition is coated on a surface of an insulating cover layer (5) including the terminal portion (6) of a suspension board with circuit (1) and dried to form a semi-conducting layer (7). Thereafter, the semi-conducting layer 7 formed in the terminal portion (6) is removed by etching.