Abstract: A ceramic substrate for an electrical device such as a layered circuit or an integrated circuit formed of a crystalline glass or ceramic material having a low densifying temperature such that conductor materials and circuits can be readily formed from high conductivity metals.

Abstract: A process for producing a multilayer circuit board composed of crystallized glass and copper-metallized circuit patterns, which comprises:(1) providing a green sheet of a crystallizable glass powder;(2) providing a copper paste comprising copper component (copper and/or copper oxide) and a glass powder in a proportion by weight of the copper component to the glass powder 95:5 to 75:25, copper oxide being calculated on copper;(3) printing a circuit pattern of the copper paste of step (2) on the green sheet of step (1);(4) coating on the green sheet of step (3) an insulating paste to form an insulating layer except for regions assigned for through holes;(5) printing on the insulating layer of step (4) a circuit pattern of the copper paste of step (2) and filling said holes with the copper paste make a conductive connection through said holes;(6) decomposing the binders by heating the product of step (5) under an oxidizing atmosphere at 400.degree.-850.degree. C.; and(7) heating the product of step (6) at 850.

Abstract: An electric field forming unit that has a long surface life, high reliability, and provides a uniform surface corona discharge along the entire length of the discharge electrode. The electric field forming unit includes a dielectric substrate made of a fine ceramic having a discharge electrode and an inductive electrode formed on opposite sides thereof. The discharge electrode has peripheral edges which are provided with a better linearity than a discharge electrode formed from an electroconductive paste by screen printing. The discharge electrode may be formed of a metalized tape in a thin line form.

Abstract: A compact, large capacity ozonizer device includes an insulated first ceramic substrate provided with an electrode on one or both sides, and a support such as a corrugated member attached to the first substrate and on which is mounted a second substrate composed of metal or insulating ceramic with an electrode mounted thereon, the first and second substrates and the first support means forming a space through which a gas is passed to be oxidized when a high voltage is applied across the two electrodes or the electrode and the metal plate. A third substrate is supported by a second support member mounted on the second substrate to form a space through which cooling fluid is passed, the cooling fluid moving in a direction different from the direction that the gas to be oxidized flows.

Abstract: A ceramic metallizing ink for forming low resistance conductors is described, said ink comprising a metal powder component comprising tungsten, molybdenum or a combination thereof as the main ingredient, and from about 0.03 to about 5.00% by weight nickel, from about 0.03 to about 5.00% by weight of nickel and from about 0.02 to about 0.90% by weight of copper, or from about 0.03 to about 5.00% by weight of nickel and from about 0.02 to about 0.70% by weight of cobalt, which are contained in the ink in a state of soluble compounds thereof, together with an organic binder and a solvent.