Abstract: A method for producing a ceramic substrate which employs a cofiring process using restraint sheets in which a second ceramic green sheet 7 is laminated on a green ceramic substrate 30 so as to cover surface conductors 32 of the green ceramic substrate 30, the second ceramic green sheet 7 subsequently being integrated with the green ceramic substrate 30. Restraint sheets 9, which are not sintered at a sintering temperature at which the green ceramic substrate 30 is sintered, are laminated on corresponding opposite sides of the green ceramic substrate 30 so as to restrain the green ceramic substrate 30 together with the second ceramic green sheet 7. The second ceramic green sheet 7 and the green ceramic substrate 30 are fired at a temperature at which the second ceramic green sheet 7 and the green ceramic substrate 30 are integrally sintered, whereas the restraint sheets 9 are not sintered, to thereby yield a ceramic substrate 40.

Abstract: The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan ? of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.

Abstract: A method for producing a ceramic substrate which employs a cofiring process using restraint sheets in which a second ceramic green sheet 7 is laminated on a green ceramic substrate 30 so as to cover surface conductors 32 of the green ceramic substrate 30, the second ceramic green sheet 7 subsequently being integrated with the green ceramic substrate 30. Restraint sheets 9, which are not sintered at a sintering temperature at which the green ceramic substrate 30 is sintered, are laminated on corresponding opposite sides of the green ceramic substrate 30 so as to restrain the green ceramic substrate 30 together with the second ceramic green sheet 7. The second ceramic green sheet 7 and the green ceramic substrate 30 are fired at a temperature at which the second ceramic green sheet 7 and the green ceramic substrate 30 are integrally sintered, whereas the restraint sheets 9 are not sintered, to thereby yield a ceramic substrate 40.

Abstract: In an embedding resin for embedding electronic parts, after a substrate in which a copper layer is formed on a cured product of the embedding resin is subjected to a pressure cooker test, the copper layer has a peeling strength of at least 588 N/m (0.6 kg/cm), wherein the conditions of the pressure cooker test are 121° C., 100% by mass humidity, 2.1 atm and 168 hours, and the measurement method of the peeling strength is according to JIS C 5012, and the width of the copper layer is 10 mm.

Abstract: A method for producing a multi-layer ceramic capacitor 10 in which reliability of electrical contact between a via electrode 28 and an internal electrode layer 24 (24a or 24b) provided between ceramic layers 22 is enhanced. A laminated sheet 100 including ceramic layers 22 and internal electrode layers 24, the layers 22 and 24 being alternately laminated and combined together, is formed, through-holes 26 are formed in the laminated sheet 100 by means of laser irradiation, and an electrically conductive material is charged into the through-holes 26 using charging container 110, to thereby form via electrodes 28. The electrically conductive material is charged, under application of pressure, into each of the through-holes 26 via an opening of the through-hole 26.

Abstract: A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.

Abstract: An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.

Abstract: A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.

Abstract: An embedding resin includes a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.

Abstract: An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan&dgr; of about 0.08 or less.

Abstract: An embedding resin that is caused to assume any base color selected from among black, blue, green, red, orange, yellow, and violet is used for embedding an electronic part in an insulating substrate. The embedding resin preferably contains at least one coloring agent selected from among carbon black, a phthalocyanine-based pigment, an azo pigment, a quinoline-based pigment, an anthraquinone-based pigment, a triphenylmethane-based pigment, and an inorganic oxide.

Abstract: The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan &dgr; of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.

Abstract: A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.

Abstract: In an embedding resin for embedding electronic parts, after a substrate in which a copper layer is formed on a cured product of the embedding resin is subjected to a pressure cooker test, the copper layer has a peeling strength of at least 588 N/m (0.6 kg/cm), wherein the conditions of the pressure cooker test are 121° C., 100% by mass humidity, 2.1 atm and 168 hours, and the measurement method of the peeling strength is according to JIS C 5012, and the width of the copper layer is 10 mm.

Abstract: A ceramic wiring board having a metalized part. The metalized part contains 100 parts by weight of an electrical-conduction imparting material made of at least one metal selected from the group consisting of Ag, Pd, Au and Pt; 3 to 5 parts by weight of a W and/or Mo compound, calculated in terms of metal W and/or metal Mo; and 1 to 10 parts by weight of a glass composition. The W compound includes WO.sub.3 and/or WSi.sub.2, while the Mo compound includes MoSi.sub.2. In the ceramic wiring board, the shrinkage behavior on sintering of the wiring material can be made similar to that of the ceramic material, so that warping and deformation of the wiring board are minimized.