Patents by Inventor Hisai UEDA

Hisai UEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11603442
    Abstract: An object of the present invention is to provide a fiber-reinforced thermoplastic resin sheet which can be manufactured into a molded body exhibiting excellent appearance quality as well as exhibits both high moldability and strength and a manufacturing method of such a fiber-reinforced thermoplastic resin sheet. The present invention relates to a fiber-reinforced thermoplastic resin sheet which is a random laminated body of a tape-shaped unidirectional prepreg and contains spread reinforcement fibers and a polymer (a) and in which the polymer (a) is a polymer of at least a bisphenol A type epoxy compound represented by Formula (1): where n is an integer of 1 to 4 and a bisphenol compound selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol E, and bisphenol P.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 14, 2023
    Assignees: SUNCORONA ODA CO., LTD., KANAZAWA INSTITUTE OF TECHNOLOGY
    Inventors: Keisuke Sone, Masaki Kobayashi, Hirofumi Nishida, Kiyoshi Uzawa, Hisai Ueda
  • Publication number: 20210171728
    Abstract: An object of the present invention is to provide a fiber-reinforced thermoplastic resin sheet which can be manufactured into a molded body exhibiting excellent appearance quality as well as exhibits both high moldability and strength and a manufacturing method of such a fiber-reinforced thermoplastic resin sheet. The present invention relates to a fiber-reinforced thermoplastic resin sheet which is a random laminated body of a tape-shaped unidirectional prepreg and contains spread reinforcement fibers and a polymer (a) and in which the polymer (a) is a polymer of at least a bisphenol A type epoxy compound represented by Formula (1): [where n is an integer of 1 to 4] and a bisphenol compound selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol E, and bisphenol P, and Mwa is 25,000 or more and a proportion (Mwb/Mwa) of Mwb to Mwa is 1.01 to 1.
    Type: Application
    Filed: June 28, 2019
    Publication date: June 10, 2021
    Inventors: Keisuke SONE, Masaki KOBAYASHI, Hirofumi NISHIDA, Kiyoshi UZAWA, Hisai UEDA