Patents by Inventor Hisakazu Horii

Hisakazu Horii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • One-pack moisture-curing epoxy resin composition
    Patent number: 7022779
    Abstract: A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: April 4, 2006
    Assignee: Konishi Co., Ltd.
    Inventors: Takeshi Endo, Fumio Sanda, Hisakazu Horii, Kentaro Suzuki, Nobuki Matsuura
  • One-pack moisture-curable epoxy resin composition
    Publication number: 20040019140
    Abstract: A one-pack moisture-curable epoxy resin composition which includes: a carbonyl compound represented by the chemical formula (1) consisting of a carbonyl group and bonded thereto two C2-6 alkyl groups which are the same or different; a ketimine compound represented by the chemical formula (2) synthesized from an amine compound having at least one primary amino group per molecule; and an epoxy resin. The composition combines excellent curability with satisfactory storage stability.
    Type: Application
    Filed: April 4, 2003
    Publication date: January 29, 2004
    Inventors: Takeshi Endo, Fumio Sanda, Kentaro Suzuki, Hisakazu Horii, Nobuki Matsuura
  • One-pack moisture-curing epoxy resin composition
    Publication number: 20040019161
    Abstract: A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin.
    Type: Application
    Filed: April 4, 2003
    Publication date: January 29, 2004
    Inventors: Takeshi Endo, Fumio Sanda, Hisakazu Horii, Kentaro Suzuki, Nobuki Matsuura