Patents by Inventor Hisaki Fujitani
Hisaki Fujitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10490721Abstract: A light-emitting device includes: a substrate; a first light-emitting element row disposed on the substrate; a first wire disposed on the substrate and passing between two light-emitting elements adjacent in the first light-emitting element row; and a first bonding wire which has one end connected to one of the two light-emitting elements and another end connected to the other of the two light-emitting elements, and crosses over the first wire.Type: GrantFiled: May 22, 2018Date of Patent: November 26, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Keiji Kiba, Hisaki Fujitani, Toshifumi Ogata
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Patent number: 10260687Abstract: A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.Type: GrantFiled: October 23, 2017Date of Patent: April 16, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hisaki Fujitani, Masumi Abe, Kosuke Takehara
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Publication number: 20180351060Abstract: A light-emitting device includes: a substrate; a first light-emitting element row disposed on the substrate; a first wire disposed on the substrate and passing between two light-emitting elements adjacent in the first light-emitting element row; and a first bonding wire which has one end connected to one of the two light-emitting elements and another end connected to the other of the two light-emitting elements, and crosses over the first wire.Type: ApplicationFiled: May 22, 2018Publication date: December 6, 2018Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Keiji KIBA, Hisaki FUJITANI, Toshifumi OGATA
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Patent number: 10103298Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.Type: GrantFiled: July 29, 2016Date of Patent: October 16, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Naoki Tagami, Masumi Abe, Hisaki Fujitani, Kosuke Takehara, Toshiaki Kurachi
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Publication number: 20180119898Abstract: A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.Type: ApplicationFiled: October 23, 2017Publication date: May 3, 2018Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hisaki FUJITANI, Masumi ABE, Kosuke TAKEHARA
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Publication number: 20180108818Abstract: A light-emitting module is provided. The light-emitting module includes a substrate, a light-emitting element mounted on the substrate, and a sealant that seals the light-emitting element. The sealant includes a resin material containing a wavelength converter. A cross section of the sealant taken through the light-emitting element satisfies HMAX/W?0.3, where W is a width of a base of the sealant and HMAX is a maximum height of the sealant.Type: ApplicationFiled: September 26, 2017Publication date: April 19, 2018Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kosuke TAKEHARA, Hisaki FUJITANI, Masumi ABE
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Patent number: 9799803Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.Type: GrantFiled: July 29, 2016Date of Patent: October 24, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Naoki Tagami, Masumi Abe, Hisaki Fujitani, Kosuke Takehara, Toshiaki Kurachi
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Patent number: 9761766Abstract: An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.Type: GrantFiled: February 2, 2016Date of Patent: September 12, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kosuke Takehara, Hisaki Fujitani, Naoki Tagami
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Patent number: 9741915Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.Type: GrantFiled: July 27, 2016Date of Patent: August 22, 2017Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Naoki Tagami, Masumi Abe, Hisaki Fujitani, Kosuke Takehara, Toshiaki Kurachi
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Patent number: 9728695Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.Type: GrantFiled: February 1, 2016Date of Patent: August 8, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kosuke Takehara, Hisaki Fujitani, Naoki Tagami, Toshiaki Kurachi
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Publication number: 20170077368Abstract: A light-emitting device includes: a board which is a resin board having an elongated shape; a conductive film formed on the board; and a plurality of LED elements disposed over the board. The plurality of LED elements include two adjacent LED elements arranged along a first direction. The conductive film includes (i) a first conductive part which electrically connects the two adjacent LED elements and at least a portion of which is located between the two adjacent LED elements and (ii) a second conductive part located on two outer sides of the first conductive part in a second direction intersecting the first direction. The second conductive part has a slit on each of the two outer sides of the first conductive part, and the slit extends in the second direction intersecting the longitudinal direction of the board.Type: ApplicationFiled: September 7, 2016Publication date: March 16, 2017Inventors: Hisaki FUJITANI, Kenji SUGIURA, Naoki TAGAMI, Kosuke TAKEHARA
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Publication number: 20170040508Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.Type: ApplicationFiled: July 27, 2016Publication date: February 9, 2017Inventors: Naoki TAGAMI, Masumi ABE, Hisaki FUJITANI, Kosuke TAKEHARA, Toshiaki KURACHI
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Publication number: 20170040497Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.Type: ApplicationFiled: July 29, 2016Publication date: February 9, 2017Inventors: Naoki TAGAMI, Masumi ABE, Hisaki FUJITANI, Kosuke TAKEHARA, Toshiaki KURACHI
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Publication number: 20170040510Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.Type: ApplicationFiled: July 29, 2016Publication date: February 9, 2017Inventors: Naoki TAGAMI, Masumi ABE, Hisaki FUJITANI, Kosuke TAKEHARA, Toshiaki KURACHI
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Publication number: 20160260871Abstract: An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.Type: ApplicationFiled: February 2, 2016Publication date: September 8, 2016Inventors: Kosuke TAKEHARA, Hisaki FUJITANI, Naoki TAGAMI
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Publication number: 20160260878Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.Type: ApplicationFiled: February 1, 2016Publication date: September 8, 2016Inventors: Kosuke TAKEHARA, Hisaki FUJITANI, Naoki TAGAMI, Toshiaki KURACHI
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Patent number: 9368706Abstract: A lighting apparatus includes a substrate and a semiconductor light-emitting element mounted on the substrate. The substrate includes a plate-like base member and a copper foil layer formed on part of the base member. The substrate includes a first area and a second area. The first area is an area that is provided so as to surround an element mounting area where a semiconductor light-emitting element is mounted thereon when viewed from the top of the substrate and does not include with the copper foil layer. The second area is an area that includes a part provided so as to surround the first area and the element mounting area; and where the copper foil layer formed. The substrate has a white resist layer disposed thereon that covers the first and second areas and is formed thicker on the first area than on the second area.Type: GrantFiled: July 11, 2014Date of Patent: June 14, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kenji Sugiura, Hisaki Fujitani
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Publication number: 20150021650Abstract: A lighting apparatus includes a substrate and a semiconductor light-emitting element mounted on the substrate. The substrate includes a plate-like base member and a copper foil layer formed on part of the base member. The substrate includes a first area and a second area. The first area is an area that is provided so as to surround an element mounting area where a semiconductor light-emitting element is mounted thereon when viewed from the top of the substrate and does not include with the copper foil layer. The second area is an area that includes a part provided so as to surround the first area and the element mounting area; and where the copper foil layer formed. The substrate has a white resist layer disposed thereon that covers the first and second areas and is formed thicker on the first area than on the second area.Type: ApplicationFiled: July 11, 2014Publication date: January 22, 2015Inventors: Kenji SUGIURA, Hisaki FUJITANI
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Patent number: 8012869Abstract: An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.Type: GrantFiled: November 6, 2009Date of Patent: September 6, 2011Assignee: Panasonic CorporationInventors: Masanori Minamio, Hiroaki Fujimoto, Atsuhito Mizutani, Hisaki Fujitani, Toshiyuki Fukuda
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Publication number: 20100048017Abstract: An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.Type: ApplicationFiled: November 6, 2009Publication date: February 25, 2010Applicant: Panasonic CorporationInventors: Masanori MINAMIO, Hiroaki FUJIMOTO, Atsuhito MIZUTANI, Hisaki FUJITANI, Toshiyuki FUKUDA