Abstract: A preparation apparatus includes a first tank, a second tank, a preparation tank, and a computer having a hardware processor. The first tank contains a first liquid. The second tank contains a second liquid having a lower viscosity than the first liquid. The preparation tank stirs the first liquid supplied from the first tank and the second liquid supplied from the second tank to prepare a preparation liquid. The hardware processor measures a viscosity of the first liquid based on a supply time required to supply a specified amount of the first liquid at a constant pressure from the first tank to the preparation tank, and supplies an amount of the second liquid to the preparation tank based on the measured viscosity of the first liquid so as to cause the preparation liquid to have a target viscosity.

Abstract: A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

Abstract: An application device according to an embodiment includes a liquid nozzle part, an air nozzle part, and an ejection controlling unit. The liquid nozzle part ejects liquid to be applied to an electronic component mounted on a substrate. The air nozzle part ejects air toward the substrate. The air nozzle is concentrically arranged with respect to the liquid nozzle part. The ejection controlling unit ejects the air from the air nozzle part at a timing in synchronization with an ejection timing of the liquid to be applied by the liquid nozzle part.

Abstract: A preparation apparatus includes a first tank, a second tank, a preparation tank, and a computer having a hardware processor. The first tank contains a first liquid. The second tank contains a second liquid having a lower viscosity than the first liquid. The preparation tank stirs the first liquid supplied from the first tank and the second liquid supplied from the second tank to prepare a preparation liquid. The hardware processor measures a viscosity of the first liquid based on a supply time required to supply a specified amount of the first liquid at a constant pressure from the first tank to the preparation tank, and supplies an amount of the second liquid to the preparation tank based on the measured viscosity of the first liquid so as to cause the preparation liquid to have a target viscosity.

Abstract: A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

Abstract: There is provided a flux applying method using a flux applying apparatus configured to jet and apply a flux to a target. The flux is supplied to a nozzle of the flux applying apparatus. A gas is applied to a foaming pipe with a porous filter included in the nozzle. The gas is jetted from the porous filter of the foaming pipe to the flux supplied to the nozzle, thereby jetting foamed flux to the target.

Abstract: An applying apparatus according to one embodiment of the invention includes an application liquid nozzle, a wall and an air nozzle. The application liquid nozzle sprays an application liquid onto a predetermined area of a board. The wall is arranged so as to surround the predetermined area of the board, and includes a flow channel through which the application liquid that has been sprayed from the application liquid nozzle flows to the predetermined area. The air nozzle is provided adjacent to the wall, and sprays air onto the board.

Abstract: There is provided a flux applying apparatus configured to jet and apply a flux to a target, whereby the flux applying apparatus is capable of rapidly collecting a surplus flux in a sub-tank and returning the same to the main tank for further jetting and applying. In particular, the flux applying apparatus is coupled to a control unit capable of estimating a flux amount trapped in the sub-tank on the basis of a time period for which the flux is to be jetted from the nozzle.

Abstract: A soldering apparatus includes a solder bath, an ejection nozzle and a solder flow slowing ramp. The solder bath is configured to hold molten solder. The ejection nozzle ejects the molten solder supplied from the solder bath. The solder flow slowing ramp i) is disposed adjacent to an outlet of the ejection nozzle and receives the molten solder overflowing from the ejection nozzle, and ii) downwardly slopes toward a liquefied solder surface of the molten solder in the solder bath so as to return the molten solder overflowing from the ejection nozzle to the solder bath.

Abstract: A forced-feed pressure control device according to an embodiment includes a pressure detection nozzle, a pressure detector, and a controller. One end of the pressure detection nozzle is inserted into a casing member from which molten solder is forcibly fed to a solder jet nozzle of a jet-flow soldering device. The pressure detector is connected to another end of the pressure detection nozzle to detect a pressure of molten solder forcibly input from the one end into the pressure detection nozzle by using gas that exists between the molten solder inside the pressure detection nozzle and the pressure detector. The controller adjusts a forced-feed pressure of the molten solder to the solder jet nozzle so that the pressure of the molten solder to be detected by the pressure detector becomes a reference pressure.

Abstract: There is provided a flux applying method using a flux applying apparatus configured to jet and apply a flux to a target. The flux is supplied to a nozzle of the flux applying apparatus. A gas is applied to a foaming pipe with a porous filter included in the nozzle. The gas is jetted from the porous filter of the foaming pipe to the flux supplied to the nozzle, thereby jetting foamed flux to the target.

Abstract: There is provided a flux applying apparatus configured to jet and apply a flux to a target. A main tank is configured to accommodate therein the flux. A feed pipe is configured to pass therethrough the flux which is to be pneumatically transported with a gas pressure when an inside of the main tank is at a positive pressure. A nozzle is configured to jet the flux transported via the feed pipe. A sub-tank is configured to trap therein the flux jetted from the nozzle. A return pipe is configured to communicate the sub-tank and the main tank each other and to return the flux to the main tank with a gas pressure when the inside of the main tank is at a negative pressure.

Abstract: There is provided a spray apparatus. A first nozzle is configured to eject mist. A second nozzle is provided around the first nozzle. The second nozzle is configured to suck a part of the mist ejected from the first nozzle and to eject a remnant of the mist to an ejection target.