Patents by Inventor Hisaki Ikebata

Hisaki Ikebata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microlayer membranes, battery separators, batteries, and related methods
    Patent number: 11969929
    Abstract: Described herein is a multilayer microporous film or membrane that may exhibit improved properties, including improved dielectric break down and strength, compared to prior monolayer or tri-layer microporous membranes of the same thickness. The preferred multilayer microporous membrane comprises microlayers and one or more lamination interfaces or barriers. Also disclosed is a battery separator or battery comprising one or more of the multilayer microporous films or membranes. The inventive battery and battery separator is preferably safer and more robust than batteries and battery separators using prior monolayer and tri-layer microporous membranes. Also, described herein is a method for making the multilayer microporous separators, membranes or films described herein.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: April 30, 2024
    Assignee: Celgard, LLC
    Inventors: Kang Karen Xiao, Stefan Reinartz, Takahiko Kondo, Hisaki Ikebata, Eric J. Penegar, Robert Nark, Changqing Wang Adams, Masaaki Okada, Brian R. Stepp, Eric Robert White, Allen M. Donn, Katharine Chemelewski
  • Artificial Leather and Production Method Therefor
    Publication number: 20220372698
    Abstract: Provided is an artificial leather that has texture (stiffness), a luxuriant feel (dispersibility of fiber bundles), and a slick feel (resin clusters of appropriate size) and can be used suitably as a seat cover material or interior design material for interiors, cars, airplanes, railway cars, etc. and garment accessory products.
    Type: Application
    Filed: October 27, 2020
    Publication date: November 24, 2022
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Daisuke Hironaka, Yoshiyuki Tadokoro, Keiichiro Sakata, Masaya Kawasaki, Aguru Yamamoto, Hisaki Ikebata
  • Wafer dividing method
    Patent number: 8513096
    Abstract: A method of dividing a wafer having devices formed in a plurality of regions demarcated by a plurality of streets formed in a grid pattern on a surface of the wafer, along the streets and into the individual devices.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: August 20, 2013
    Assignee: Disco Corporation
    Inventors: Makoto Shimotani, Kazuya Miyazaki, Hisaki Ikebata
  • WAFER DIVIDING METHOD
    Publication number: 20120003816
    Abstract: A method of dividing a wafer having devices formed in a plurality of regions demarcated by a plurality of streets formed in a grid pattern on a surface of the wafer, along the streets and into the individual devices.
    Type: Application
    Filed: June 23, 2011
    Publication date: January 5, 2012
    Applicant: DISCO CORPORATION
    Inventors: Makoto Shimotani, Kazuya Miyazaki, Hisaki Ikebata