Abstract: A lid body includes a base containing an alloy of iron and nickel, a first film positioned on a lower surface of the base and containing nickel, and a second film positioned on a lower surface of the first film and containing copper. During welding of the lid body, penetration of crystal grain boundaries of the base by Cu of the second film is reduced by the first film. Therefore, occurrence of cracks in the base is reduced and thus a package with high airtightness can be formed.

Abstract: A board in an aspect of the present invention includes a substrate, a first film, a first layer, and a second film. The substrate has a first elastic modulus. The first film is at an upper surface of the substrate. The first layer is at a lower surface of the substrate. The first layer has a second elastic modulus lower than the first elastic modulus and has a first thermal expansion coefficient. The second film is at a lower surface of the first layer. The second film includes the same material as the first film and has a second thermal expansion coefficient lower than the first thermal expansion coefficient.

Abstract: Aboard in an aspect of the present invention includes a substrate, a first film, a first layer, and a second film. The substrate has a first elastic modulus. The first film is at an upper surface of the substrate. The first layer is at a lower surface of the substrate. The first layer has a second elastic modulus lower than the first elastic modulus and has a first thermal expansion coefficient. The second film is at a lower surface of the first layer. The second film includes the same material as the first film and has a second thermal expansion coefficient lower than the first thermal expansion coefficient.

Abstract: A heat dissipation board includes a substrate, first, second, and third portions, and a bond. The substrate has a through-hole and includes a metal material. The first portion is located in the through-hole. The first portion has a higher thermal conductivity than the substrate and includes a metal material. The second portion is located on an upper surface of the substrate. The second portion has a higher thermal conductivity than the substrate and includes a metal material. The third portion is located on a lower surface of the substrate. The third portion has a higher thermal conductivity than the substrate and includes a metal material. The bond is between the substrate and the second portion, and between the substrate and the third portion. The first portion is at least partially continuous with the second portion and with the third portion through the bond or the bonding layer.

Abstract: A package for housing a photosemiconductor element comprises a substrate having a mounting portion on a top surface of which a photosemiconductor element is mounted, a frame attached onto the substrate to surround the mounting portion and having a through hole on a side thereof, a cylindrical fixing member attached around the through hole of the frame and having a space therein for transmitting an optical signal, a light transmitting member attached to the cylindrical fixing member, for clogging the inside of the fixing member and a lid attached onto a top surface of the frame, hermetically sealing the photosemiconductor element. The fixing member is made of an alloy of from 40 to 60 wt % iron and from 40 to 60 wt % nickel. The coefficient of thermal expansion of the fixing member is about 9.5×10−6/° C. (room temperature to 400° C.

Abstract: A process variable transmitter including a plurality of process variable detector units for detecting a primary process variable to be measured and secondary process variables not to be measured but which affect the primary process variable, a memory circuit for storing detected outputs supplied from the process variable detector units, a circuit for reading the detected outputs out of the memory circuit and then correcting the detected output indicative of the primary process variable based on the detected outputs indicative of the secondary process variables, and a power supply control for intermittently supplying electric power to the process variable detector units and the correcting circuit. The process variable transmitter corrects the primary process variable to precision and consumes a reduced amount of electric power.