Patents by Inventor Hisaki Sakamoto

Hisaki Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130130916
    Abstract: Adhesiveness between a metallic substrate and a metal oxide layer is made to increase. A superconducting thin film (1) includes a metallic substrate (10), a metallic layer (22) that is formed on a main surface of the metallic substrate (10) and includes a metal element capable of being passivated as a main component, a metal oxide layer (24) that is formed on the metallic layer (22) and includes the passivated metal element as a main component, and a superconducting layer (40) that is formed on the metal oxide layer (24) directly or through an intermediate layer and includes an oxide superconductor as a main component.
    Type: Application
    Filed: July 11, 2012
    Publication date: May 23, 2013
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuko Hayase, Yoshikazu Okuno, Hiroyuki Fukushima, Eiji Kojima, Hisaki Sakamoto
  • Publication number: 20120021917
    Abstract: Disclosed is a low-cost metal substrate which is resistant to high-temperature oxidation, has excellent strength, is non-magnetic and is ideal for a high-temperature superconducting wire to be used at or lower than liquid nitrogen temperature. Austenitic stainless steel containing 0.4 weight or more of nitrogen is used as the metal substrate for the superconducting wire. After heat treatment of 700 to 950° C. in the high-temperature superconducting layer formation step is carried out, the metal substrate has an extremely high 0.20 proof stress at liquid nitrogen temperature.
    Type: Application
    Filed: September 28, 2010
    Publication date: January 26, 2012
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hisaki Sakamoto, Yoshinori Nagasu
  • Patent number: 5837941
    Abstract: A superconductor wire comprising a plurality of Nb--Ti superconductor filaments embedded in a copper matrix made of a copper alloy other than a two element copper alloy selected from the group consisting of a Cu--Ni alloy, a Cu--Sn alloy and a Cu--Mn alloy, wherein the resistivity (Z) at room temperature of the copper matrix is 2.times.10.sup.-8 .OMEGA.m to 65.times.10.sup.-8 .OMEGA.m, and the distance between superconductor filaments is not less than 0.0625.times.1/.sqroot.Z nm. The superconductor wire has a high critical current density, a small AC loss and improved workability.
    Type: Grant
    Filed: August 16, 1994
    Date of Patent: November 17, 1998
    Assignees: Tokai University, The Furukawa Electric Co., Ltd.
    Inventors: Kyoji Tachikawa, Yasuzo Tanaka, Kaname Matsumoto, Hisaki Sakamoto