Patents by Inventor Hisako Hori

Hisako Hori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050208197
    Abstract: A substance capable of stimulating the movement of digestive tract, comprising a compound of the formula: (I) (active substance ? and active substance ? being stereoisomers), which substance is derived from natural products and hence cause no side effects, is highly safe even when continuously used for a prolonged period of time and can be widely employed as additives to refreshments, etc.; and a refreshment containing an additive comprising the stimulating substance. In particular, a digestive tract movement stimulating substance capable of acting on muscarine M3 receptor, obtained from beer through isolation and purification, which substance is one having drinkability stimulating effect; and a composition from natural products or natural processed products, comprising the above substance. The thus provided substance or composition is used as an additive to refreshment, thereby providing a refreshment capable of stimulating the movement of digestive tract.
    Type: Application
    Filed: June 26, 2003
    Publication date: September 22, 2005
    Inventors: Yoshihide Suwa, Wataru Fujii, Hisako Hori, Yoshiaki Yokoo, Haruo Nukaya, Kuniro Tsuji
  • Patent number: 4893404
    Abstract: A method for producing a multilayer printed wiring board by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) over a first insulating laminate (12), and second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern over through studs (15) and a second insulating laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
    Type: Grant
    Filed: September 13, 1988
    Date of Patent: January 16, 1990
    Assignee: Furukawa Denki Kogyo Kabushiki Kaisha
    Inventors: Isao Shirahata, Shoji Shiga, Hisako Hori, Takamasa Jinbo
  • Patent number: 4791239
    Abstract: A multilayer printed wiring board produced by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
    Type: Grant
    Filed: May 29, 1987
    Date of Patent: December 13, 1988
    Assignee: Furukawa Denki Kogyo Kabushiki Kaisha
    Inventors: Isao Shirahata, Shoji Shiga, Hisako Hori, Takamasa Jinbo
  • Patent number: 4469718
    Abstract: A process for manufacturing a polyester resin insulated wire involves coating a resin consisting essentially of a saturated substantially linear polyester resin prepared by reacting (i) an aromatic dicarboxylic acid or a dicarboxylic acid in which an aliphatic dicarboxylic acid is substituted for part of the aromatic dicarboxylic acid, and (ii) an aliphatic diol or an aromatic diol on a conductor having a copper surface without use of a solvent, and then heating the coated conductor in oxygen or an oxygen-containing gas at a temperature higher than the melting point of said linear polyester resin to permit cross-linking in the coated resin.
    Type: Grant
    Filed: September 3, 1982
    Date of Patent: September 4, 1984
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Isao Shirahata, Nobuyuki Nakamura, Shigeharu Shioya, Hisako Hori
  • Patent number: 4391955
    Abstract: A process for crosslinking a polycarbonate resin involves heating the polycarbonate resin in the presence of an organic copper compound at a temperature higher than the glass transition point of the polycarbonate resin.
    Type: Grant
    Filed: January 20, 1982
    Date of Patent: July 5, 1983
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hisako Hori, Nobu Kitamura, Isao Shirahata, Nobuyuki Nakamura
  • Patent number: 4363899
    Abstract: Copper powder or a copper compound is mixed with a substantially linear polyester series resin, and the resultant resin composition is formed into a predetermined shape. Thereafter, the resin composition is heated to a temperature above the melting point of the resin in an oxygen-containing atmosphere for cross-linking the polyester series resin.
    Type: Grant
    Filed: May 5, 1981
    Date of Patent: December 14, 1982
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Isao Shirahata, Nobu Kitamura, Nobuyuki Nakamura, Hisako Hori