Abstract: A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates, superposed upon each other with a predetermined space therebetween. Each of the substrate has a signal conductor pattern formed on at least one surface thereof and a land conductor pattern formed on at least one surface thereof. Each substrate has plated through holes in the land conductor pattern, each of which holes is in line with another plated through hole of at least one of the neighboring substrates to form a continuous through hole or an interstitial through hole. A layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plated through holes. This layer serves as a through connection between two or more signal conductor patterns of the substrates and as an interlayer adhesion between the substrates.

Abstract: A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates (1), (2), (3) and (4), superposed upon each other with a predetermined space therebetween each of which substrate has a signal conductor pattern (6) formed on at least one surface thereof and a land conductor pattern (7) formed on at least one surface thereof. Each substrate has plated throughholes (10) in the land conductor pattern, each of which holes is in line with another plated throughhole of at least one of the neighboring substrates to form a throughhole or an interstitial via hole (12) or (13). A layer of a low melting point metal is formed at least on the upper and lower end surfaces of each plated throughholes (10), which layer serves as a through connection between two or more signal conductor patterns of the substrates and as an interlayer adhesion between the substrates.