Abstract: A molding machine includes: a tie bar connected continuously to any one of a stationary platen and a movable platen, and including an engagement groove; a first engagement member configured to engage with or move away from the engagement groove of the tie bar; a second engagement member configured to engage with or move away from the engagement groove of the tie bar, and configured to be displaceable in an axial direction of the tie bar; a force transmission member located opposite the first engagement member across the second engagement member, and including a pressure surface to press the second engagement member and a through hole in which the tie bar is inserted; and a drive mechanism configured to use the force transmission member to cause the second engagement member to be displaceable in the axial direction of the tie bar with respect to the first engagement member.

Abstract: A molding machine includes: a tie bar connected continuously to any one of a stationary platen and a movable platen, and including an engagement groove; a first engagement member configured to engage with or move away from the engagement groove of the tie bar; a second engagement member configured to engage with or move away from the engagement groove of the tie bar, and configured to be displaceable in an axial direction of the tie bar; a force transmission member located opposite the first engagement member across the second engagement member, and including a pressure surface to press the second engagement member and a through hole in which the tie bar is inserted; and a drive mechanism configured to use the force transmission member to cause the second engagement member to be displaceable in the axial direction of the tie bar with respect to the first engagement member.

Abstract: Provided is a molding machine including a mold opening/closing mechanism configured to move a movable platen to be attached with a movable mold to a stationary platen to be attached with a stationary mold, and a clamping mechanism to perform a clamping process, and is intended to suppress machine cost or ensure the mold opening/closing speed. The molding machine includes the mold opening/closing mechanism configured to move the movable platen to be attached with the movable mold to the stationary platen to be attached with the stationary mold, and the clamping mechanism configured to perform a clamping process. The mold opening/closing mechanism includes at least two ball screws, at least two electric motors that respectively drive the ball screws, and a ball screw nut into which each of the ball screws is inserted.

Abstract: Provided is a molding machine including a mold opening/closing mechanism configured to move a movable platen to be attached with a movable mold to a stationary platen to be attached with a stationary mold, and a clamping mechanism to perform a clamping process, and is intended to suppress machine cost or ensure the mold opening/closing speed. The molding machine includes the mold opening/closing mechanism configured to move the movable platen to be attached with the movable mold to the stationary platen to be attached with the stationary mold, and the clamping mechanism configured to perform a clamping process. The mold opening/closing mechanism includes at least two ball screws, at least two electric motors that respectively drive the ball screws, and a ball screw nut into which each of the ball screws is inserted.

Abstract: To provide a lamination method and a lamination system capable of excellently laminating a film-type laminate without damage even though the semiconductor is a brittle lamination target such as a foil-type semiconductor or a semiconductor made of highly brittle material. In a lamination method for laminating a film-type laminate to a brittle lamination target by overlapping the brittle lamination target and the film-type laminate and heating and pressing the brittle lamination target and the film-type laminate, with respect to the brittle lamination target mounted on a mount member and carried into a lamination device, an elastic film member is expanded into a vacuum chamber of the lamination device from the above to press and laminate the brittle lamination target and the film-type laminate.

Abstract: To provide a lamination method and a lamination system capable of excellently laminating a film-type laminate without damage even though the semiconductor is a brittle lamination target such as a foil-type semiconductor or a semiconductor made of highly brittle material. In a lamination method for laminating a film-type laminate to a brittle lamination target by overlapping the brittle lamination target and the film-type laminate and heating and pressing the brittle lamination target and the film-type laminate, with respect to the brittle lamination target mounted on a mount member and carried into a lamination device, an eleastic film member is expanded into a vacuum chamber of the lamination device from the above to press and laminate the brittle lamination target and the film-type laminate.