Patents by Inventor Hisanaga Takano

Hisanaga Takano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5659461
    Abstract: An indirect feedback type flyback converter that compares favorably with the direct feedback type flyback converter in controllability of secondary output voltage, wherein the converter is arranged so that a switching signal, which is induced in a secondary winding when a direct current input voltage, applied to a primary winding, is turned ON and OFF by a switching element, is smoothed by rectification and fed to a load and that an output voltage is detected using a switching signal induced in an auxiliary winding to transmit a control signal to the switching element for the purpose of stabilizing the output voltage; wherein the primary, secondary and auxiliary windings are formed on respective coil formation surfaces of a coil laminate as convoluted shaped conductor patterns disposed between a core hole at the center of the pattern and the border of the coil formation surface, with the auxiliary winding being disposed to be near the border of the coil formation surface.
    Type: Grant
    Filed: June 19, 1995
    Date of Patent: August 19, 1997
    Assignee: Yokogawa Electric Corporation
    Inventors: Kiyoharu Inou, Yuichi Suzuki, Hisanaga Takano, Kiyoshi Yokoshima
  • Patent number: 5652561
    Abstract: A laminating type molded coil and a method of fabricating the same comprising at least one coil substrate structure in which coils are formed on both sides of an insulating substrate by use of a printed wire technique, resin sheets disposed on both side of the coil substrate structure, and insulating covering sheets disposed on the outermost surfaces of the resin sheets, wherein when heated and subjected to pressure the spaces between the layers and between the coils are filled with resin from the resin sheets, and then hardened to produce an integral structure. Advantageously, because the coil pattern has a predetermined shape and is formed by printed wire techniques, the thickness of the coils may be thin and the gaps between the coils may be narrow. By using the invention method, the fabrication does not require use of a molding box as does the conventional method and the fabrication is done with simple steps.
    Type: Grant
    Filed: June 17, 1994
    Date of Patent: July 29, 1997
    Assignees: Yokogawa Electric Corporation, Ibiden Company, Limited
    Inventors: Kiyoharu Inoh, Hisanaga Takano, Eiji Sumiya, Akihiro Demura
  • Patent number: 5521573
    Abstract: A printed coil, having good magnetic coupling, low loss, and good high frequency characteristics, comprises a plurality of conductor forming planes on which a conductor pattern having one or more turns are formed centered about a core inserting hole and which are laminated together with an insulating layer, each of the conductor forming planes being provided with outer peripheral connecting holes provided on an outer periphery of the conductor pattern, and a plurality of inner peripheral connecting holes provided on an inner periphery thereof, with the outer and inner peripheral connecting holes being connected to the conductor pattern; a connecting coil which is laminated together with the conductor forming planes and having a connection pattern thereon for connecting the outer and inner peripheral connecting holes, and circuitry for electrically connecting the outer and inner peripheral connecting holes and the connecting coil.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: May 28, 1996
    Assignee: Yokogawa Electric Corporation
    Inventors: Kiyoharu Inoh, Hisanaga Takano
  • Patent number: 4982245
    Abstract: A twin diode assembly is disclosed which has a pair of pn-junction diodes formed on a single semiconductor substrate to provide a common cathode. In order to reduce the flow of leakage current from one diode to the other through the common substrate, a semiconductor region of a specified conductivity type is formed in the substrate so as to provide a portion intervening between the pair of diodes. This intervening region efficiently collects the minority carriers diffusing from one diode toward the other when either of the two pn-junctions is forward biased.
    Type: Grant
    Filed: December 4, 1989
    Date of Patent: January 1, 1991
    Assignee: Sanken Electric Co., Ltd.
    Inventors: Masayuki Hanaoka, Hisanaga Takano